JP5045783B2 - 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材 - Google Patents

電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材 Download PDF

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JP5045783B2
JP5045783B2 JP2010112266A JP2010112266A JP5045783B2 JP 5045783 B2 JP5045783 B2 JP 5045783B2 JP 2010112266 A JP2010112266 A JP 2010112266A JP 2010112266 A JP2010112266 A JP 2010112266A JP 5045783 B2 JP5045783 B2 JP 5045783B2
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copper alloy
atomic
electronic equipment
alloy
copper
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JP2011241412A5 (enExample
JP2011241412A (ja
Inventor
優樹 伊藤
一誠 牧
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Mitsubishi Materials Corp
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Mitsubishi Materials Corp
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Priority to JP2010112266A priority Critical patent/JP5045783B2/ja
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to PH1/2012/502195A priority patent/PH12012502195A1/en
Priority to US13/695,666 priority patent/US10056165B2/en
Priority to KR1020137031600A priority patent/KR101570919B1/ko
Priority to EP15193144.1A priority patent/EP3020836A3/en
Priority to EP15193147.4A priority patent/EP3009523B1/en
Priority to EP15175001.5A priority patent/EP2952595B1/en
Priority to PCT/JP2011/061036 priority patent/WO2011142450A1/ja
Priority to MYPI2014002778A priority patent/MY189251A/en
Priority to EP11780706.5A priority patent/EP2570506B1/en
Priority to MYPI2012700829A priority patent/MY168183A/en
Priority to TW100116878A priority patent/TWI441931B/zh
Priority to SG2012078978A priority patent/SG185024A1/en
Priority to CN201180018491.7A priority patent/CN102822363B/zh
Priority to KR1020127025942A priority patent/KR101369693B1/ko
Publication of JP2011241412A publication Critical patent/JP2011241412A/ja
Publication of JP2011241412A5 publication Critical patent/JP2011241412A5/ja
Application granted granted Critical
Publication of JP5045783B2 publication Critical patent/JP5045783B2/ja
Priority to US14/291,335 priority patent/US10032536B2/en
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JP2010112266A 2010-05-14 2010-05-14 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材 Active JP5045783B2 (ja)

Priority Applications (16)

Application Number Priority Date Filing Date Title
JP2010112266A JP5045783B2 (ja) 2010-05-14 2010-05-14 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材
SG2012078978A SG185024A1 (en) 2010-05-14 2011-05-13 Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
KR1020137031600A KR101570919B1 (ko) 2010-05-14 2011-05-13 전자 기기용 구리 합금, 전자 기기용 구리 합금의 제조 방법, 및 전자 기기용 구리 합금 압연재
EP15193144.1A EP3020836A3 (en) 2010-05-14 2011-05-13 Copper alloy for electronic device, method for producing it, and rolled copper alloy for electronic device
EP15193147.4A EP3009523B1 (en) 2010-05-14 2011-05-13 Copper alloy for electronic device, method for producing it, and rolled material from it
EP15175001.5A EP2952595B1 (en) 2010-05-14 2011-05-13 Copper alloy and material rolled thereof for electronic device and method for producing this alloy
PCT/JP2011/061036 WO2011142450A1 (ja) 2010-05-14 2011-05-13 電子機器用銅合金、電子機器用銅合金の製造方法、及び電子機器用銅合金圧延材
MYPI2014002778A MY189251A (en) 2010-05-14 2011-05-13 Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
PH1/2012/502195A PH12012502195A1 (en) 2010-05-14 2011-05-13 Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
MYPI2012700829A MY168183A (en) 2010-05-14 2011-05-13 Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
TW100116878A TWI441931B (zh) 2010-05-14 2011-05-13 電子機器用銅合金、電子機器用銅合金之製造方法、及電子機器用銅合金滾壓材
US13/695,666 US10056165B2 (en) 2010-05-14 2011-05-13 Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
CN201180018491.7A CN102822363B (zh) 2010-05-14 2011-05-13 电子器件用铜合金及其制造方法及电子器件用铜合金轧材
KR1020127025942A KR101369693B1 (ko) 2010-05-14 2011-05-13 전자 기기용 구리 합금, 전자 기기용 구리 합금의 제조 방법, 및 전자 기기용 구리 합금 압연재
EP11780706.5A EP2570506B1 (en) 2010-05-14 2011-05-13 Copper alloy for electronic device, method for producing this alloy, and copper alloy rolled material for this device
US14/291,335 US10032536B2 (en) 2010-05-14 2014-05-30 Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010112266A JP5045783B2 (ja) 2010-05-14 2010-05-14 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材

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JP2011241412A JP2011241412A (ja) 2011-12-01
JP2011241412A5 JP2011241412A5 (enExample) 2012-02-09
JP5045783B2 true JP5045783B2 (ja) 2012-10-10

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Cited By (10)

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WO2015016218A1 (ja) 2013-07-31 2015-02-05 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用部品及び端子
WO2015087624A1 (ja) 2013-12-11 2015-06-18 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用部品及び端子
KR20180043197A (ko) 2015-09-09 2018-04-27 미쓰비시 마테리알 가부시키가이샤 전자·전기 기기용 구리 합금, 전자·전기 기기용 구리 합금 소성 가공재, 전자·전기 기기용 부품, 단자, 및, 버스바
US10128019B2 (en) 2015-09-09 2018-11-13 Mitsubishi Materials Corporation Copper alloy for electronic/electrical device, plastically-worked copper alloy material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar
US10453582B2 (en) 2015-09-09 2019-10-22 Mitsubishi Materials Corporation Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar
US10676803B2 (en) 2015-09-09 2020-06-09 Mitsubishi Materials Corporation Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar
US11104977B2 (en) 2018-03-30 2021-08-31 Mitsubishi Materials Corporation Copper alloy for electronic/electric device, copper alloy sheet/strip material for electronic/electric device, component for electronic/electric device, terminal, and busbar
US11203806B2 (en) 2016-03-30 2021-12-21 Mitsubishi Materials Corporation Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relay
US11319615B2 (en) 2016-03-30 2022-05-03 Mitsubishi Materials Corporation Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relay
US11655523B2 (en) 2018-03-30 2023-05-23 Mitsubishi Materials Corporation Copper alloy for electronic/electric device, copper alloy sheet/strip material for electronic/electric device, component for electronic/electric device, terminal, and busbar

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101570919B1 (ko) 2010-05-14 2015-11-23 미쓰비시 마테리알 가부시키가이샤 전자 기기용 구리 합금, 전자 기기용 구리 합금의 제조 방법, 및 전자 기기용 구리 합금 압연재
TWI571518B (zh) 2011-08-29 2017-02-21 Furukawa Electric Co Ltd Copper alloy material and manufacturing method thereof
JP5903832B2 (ja) 2011-10-28 2016-04-13 三菱マテリアル株式会社 電子機器用銅合金、電子機器用銅合金の製造方法、電子機器用銅合金圧延材及び電子機器用部品
JP5903838B2 (ja) 2011-11-07 2016-04-13 三菱マテリアル株式会社 電子機器用銅合金、電子機器用銅素材、電子機器用銅合金の製造方法、電子機器用銅合金塑性加工材及び電子機器用部品
JP5903842B2 (ja) * 2011-11-14 2016-04-13 三菱マテリアル株式会社 銅合金、銅合金塑性加工材及び銅合金塑性加工材の製造方法
JP6248389B2 (ja) * 2012-12-05 2017-12-20 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用部品及び端子
JP6248386B2 (ja) * 2012-12-05 2017-12-20 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用部品及び端子
JP6248387B2 (ja) * 2012-12-05 2017-12-20 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用部品及び端子
JP6248388B2 (ja) * 2012-12-05 2017-12-20 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用部品及び端子
JP6311299B2 (ja) * 2013-12-11 2018-04-18 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用銅合金塑性加工材の製造方法、電子・電気機器用部品及び端子

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JP2722401B2 (ja) * 1988-10-20 1998-03-04 株式会社神戸製鋼所 耐マイグレーション性に優れた高導電性電気・電子部品配線用銅合金
JPH11186273A (ja) * 1997-12-19 1999-07-09 Ricoh Co Ltd 半導体装置及びその製造方法

Cited By (12)

* Cited by examiner, † Cited by third party
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WO2015016218A1 (ja) 2013-07-31 2015-02-05 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用部品及び端子
US10294547B2 (en) 2013-07-31 2019-05-21 Mitsubishi Materials Corporation Copper alloy for electronic and electrical equipment, plastically worked copper alloy material for electronic and electrical equipment, and component and terminal for electronic and electrical equipment
WO2015087624A1 (ja) 2013-12-11 2015-06-18 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用部品及び端子
US10157694B2 (en) 2013-12-11 2018-12-18 Mitsubishi Materials Corporation Copper alloy for electronic/electric device, copper alloy plastic working material for electronic/electric device, and component and terminal for electronic/electric device
KR20180043197A (ko) 2015-09-09 2018-04-27 미쓰비시 마테리알 가부시키가이샤 전자·전기 기기용 구리 합금, 전자·전기 기기용 구리 합금 소성 가공재, 전자·전기 기기용 부품, 단자, 및, 버스바
US10128019B2 (en) 2015-09-09 2018-11-13 Mitsubishi Materials Corporation Copper alloy for electronic/electrical device, plastically-worked copper alloy material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar
US10453582B2 (en) 2015-09-09 2019-10-22 Mitsubishi Materials Corporation Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar
US10676803B2 (en) 2015-09-09 2020-06-09 Mitsubishi Materials Corporation Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar
US11203806B2 (en) 2016-03-30 2021-12-21 Mitsubishi Materials Corporation Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relay
US11319615B2 (en) 2016-03-30 2022-05-03 Mitsubishi Materials Corporation Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relay
US11104977B2 (en) 2018-03-30 2021-08-31 Mitsubishi Materials Corporation Copper alloy for electronic/electric device, copper alloy sheet/strip material for electronic/electric device, component for electronic/electric device, terminal, and busbar
US11655523B2 (en) 2018-03-30 2023-05-23 Mitsubishi Materials Corporation Copper alloy for electronic/electric device, copper alloy sheet/strip material for electronic/electric device, component for electronic/electric device, terminal, and busbar

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