JP5032803B2 - 電子部品 - Google Patents
電子部品 Download PDFInfo
- Publication number
- JP5032803B2 JP5032803B2 JP2006189298A JP2006189298A JP5032803B2 JP 5032803 B2 JP5032803 B2 JP 5032803B2 JP 2006189298 A JP2006189298 A JP 2006189298A JP 2006189298 A JP2006189298 A JP 2006189298A JP 5032803 B2 JP5032803 B2 JP 5032803B2
- Authority
- JP
- Japan
- Prior art keywords
- wireless communication
- electronic component
- communication module
- power supply
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims description 68
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 description 22
- 230000002093 peripheral effect Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 8
- 238000001514 detection method Methods 0.000 description 5
- 230000007257 malfunction Effects 0.000 description 5
- 239000004020 conductor Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006189298A JP5032803B2 (ja) | 2006-07-10 | 2006-07-10 | 電子部品 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006189298A JP5032803B2 (ja) | 2006-07-10 | 2006-07-10 | 電子部品 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008016776A JP2008016776A (ja) | 2008-01-24 |
JP2008016776A5 JP2008016776A5 (enrdf_load_stackoverflow) | 2009-07-30 |
JP5032803B2 true JP5032803B2 (ja) | 2012-09-26 |
Family
ID=39073483
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006189298A Active JP5032803B2 (ja) | 2006-07-10 | 2006-07-10 | 電子部品 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5032803B2 (enrdf_load_stackoverflow) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009202584A (ja) | 2008-01-28 | 2009-09-10 | Fujifilm Corp | 感熱転写による画像形成方法 |
JP5027751B2 (ja) * | 2008-07-25 | 2012-09-19 | 株式会社クボタ | 作業機用モジュール |
CN103889149B (zh) | 2012-12-21 | 2017-07-14 | 华为终端有限公司 | 电子装置和栅格阵列模块 |
JP6357759B2 (ja) * | 2013-11-25 | 2018-07-18 | セイコーエプソン株式会社 | パッケージ、物理量センサー、電子機器および移動体 |
CN109429421B (zh) * | 2017-08-24 | 2023-01-20 | 中兴通讯股份有限公司 | 一种pcb和电子设备 |
JP7267054B2 (ja) * | 2019-03-25 | 2023-05-01 | 三菱重工業株式会社 | パルサレシーバ |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6353540B1 (en) * | 1995-01-10 | 2002-03-05 | Hitachi, Ltd. | Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board. |
-
2006
- 2006-07-10 JP JP2006189298A patent/JP5032803B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2008016776A (ja) | 2008-01-24 |
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