JP5025576B2 - 静電チャック及び基板温調固定装置 - Google Patents

静電チャック及び基板温調固定装置 Download PDF

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Publication number
JP5025576B2
JP5025576B2 JP2008156019A JP2008156019A JP5025576B2 JP 5025576 B2 JP5025576 B2 JP 5025576B2 JP 2008156019 A JP2008156019 A JP 2008156019A JP 2008156019 A JP2008156019 A JP 2008156019A JP 5025576 B2 JP5025576 B2 JP 5025576B2
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Japan
Prior art keywords
electrostatic chuck
base
substrate
fixing device
substrate temperature
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JP2008156019A
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Japanese (ja)
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JP2009302347A (ja
JP2009302347A5 (enExample
Inventor
智昭 児山
晃樹 玉川
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2008156019A priority Critical patent/JP5025576B2/ja
Priority to US12/482,901 priority patent/US8068326B2/en
Publication of JP2009302347A publication Critical patent/JP2009302347A/ja
Publication of JP2009302347A5 publication Critical patent/JP2009302347A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2008156019A 2008-06-13 2008-06-13 静電チャック及び基板温調固定装置 Active JP5025576B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008156019A JP5025576B2 (ja) 2008-06-13 2008-06-13 静電チャック及び基板温調固定装置
US12/482,901 US8068326B2 (en) 2008-06-13 2009-06-11 Electrostatic chuck and substrate temperature control fixing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008156019A JP5025576B2 (ja) 2008-06-13 2008-06-13 静電チャック及び基板温調固定装置

Publications (3)

Publication Number Publication Date
JP2009302347A JP2009302347A (ja) 2009-12-24
JP2009302347A5 JP2009302347A5 (enExample) 2011-03-24
JP5025576B2 true JP5025576B2 (ja) 2012-09-12

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ID=41414543

Family Applications (1)

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JP2008156019A Active JP5025576B2 (ja) 2008-06-13 2008-06-13 静電チャック及び基板温調固定装置

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US (1) US8068326B2 (enExample)
JP (1) JP5025576B2 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6003011B2 (ja) * 2011-03-31 2016-10-05 東京エレクトロン株式会社 基板処理装置
EP2525389A1 (en) * 2011-05-18 2012-11-21 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Electrostatic clamp and method of making said electrostatic clamp
US9543184B2 (en) 2012-01-26 2017-01-10 Kyocera Corporation Electrostatic chuck
US9685356B2 (en) * 2012-12-11 2017-06-20 Applied Materials, Inc. Substrate support assembly having metal bonded protective layer
US20150062772A1 (en) * 2013-08-27 2015-03-05 Varian Semiconductor Equipment Associates, Inc Barrier Layer For Electrostatic Chucks
KR101583767B1 (ko) * 2014-05-09 2016-01-08 코리아세미텍(주) 히터가 장착된 캡형 정전척 및 그 제조방법
DE102014008029B4 (de) 2014-05-28 2023-05-17 Asml Netherlands B.V. Elektrostatische Haltevorrichtung mit einer Elektroden-Trägerscheibe und Verfahren zur Herstellung der Haltevorrichtung
DE102014008031B4 (de) 2014-05-28 2020-06-25 Berliner Glas Kgaa Herbert Kubatz Gmbh & Co. Elektrostatische Haltevorrichtung mit einer Keramik-Elektrode und Verfahren zur Herstellung einer solchen Haltevorrichtung
DE102014008030A1 (de) * 2014-05-28 2015-12-03 Berliner Glas Kgaa Herbert Kubatz Gmbh & Co Verfahren zur Herstellung einer elektrostatischen Haltevorrichtung
DE102014007903B4 (de) 2014-05-28 2025-04-03 ASML Netherlands B.V. Elektrostatische Haltevorrichtung mit Noppen-Elektroden und Verfahren zu deren Herstellung
JP6279149B2 (ja) * 2015-04-02 2018-02-14 株式会社アルバック 吸着装置及び真空処理装置
JP6312926B2 (ja) * 2015-04-02 2018-04-18 株式会社アルバック 吸着方法及び真空処理方法
JP6124156B2 (ja) 2015-04-21 2017-05-10 Toto株式会社 静電チャックおよびウェーハ処理装置
KR101758344B1 (ko) * 2015-06-25 2017-07-18 주식회사 엘케이엔지니어링 정전 척 및 리페어 방법
US10256131B2 (en) * 2015-08-27 2019-04-09 Sumitomo Osaka Cement Co., Ltd. Electrostatic chuck device
US10020218B2 (en) 2015-11-17 2018-07-10 Applied Materials, Inc. Substrate support assembly with deposited surface features
KR101758347B1 (ko) * 2016-08-01 2017-07-18 주식회사 엘케이엔지니어링 정전 척 및 리페어 방법
JP6858035B2 (ja) * 2017-02-27 2021-04-14 新光電気工業株式会社 基板固定具及び基板固定装置
US11887877B2 (en) * 2017-09-29 2024-01-30 Sumitomo Osaka Cement Co., Ltd. Electrostatic chuck device
GB201815258D0 (en) * 2018-09-19 2018-10-31 Spts Technologies Ltd A support
CN111199902B (zh) * 2018-11-19 2023-02-24 拓荆科技股份有限公司 热隔离之晶圆支撑装置及其制造方法
CN110246745B (zh) * 2019-05-17 2021-12-21 苏州珂玛材料科技股份有限公司 一种等离子体处理装置及静电卡盘与静电卡盘的制造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3238925B2 (ja) * 1990-11-17 2001-12-17 株式会社東芝 静電チャック
JPH0774234A (ja) * 1993-06-28 1995-03-17 Tokyo Electron Ltd 静電チャックの電極構造、この組み立て方法、この組み立て治具及び処理装置
JP3596127B2 (ja) * 1995-12-04 2004-12-02 ソニー株式会社 静電チャック、薄板保持装置、半導体製造装置、搬送方法及び半導体の製造方法
US5810933A (en) * 1996-02-16 1998-09-22 Novellus Systems, Inc. Wafer cooling device
JP2000317761A (ja) 1999-03-01 2000-11-21 Toto Ltd 静電チャックおよび吸着方法
JP3805134B2 (ja) 1999-05-25 2006-08-02 東陶機器株式会社 絶縁性基板吸着用静電チャック
US6373679B1 (en) * 1999-07-02 2002-04-16 Cypress Semiconductor Corp. Electrostatic or mechanical chuck assembly conferring improved temperature uniformity onto workpieces held thereby, workpiece processing technology and/or apparatus containing the same, and method(s) for holding and/or processing a workpiece with the same
JP2001338912A (ja) * 2000-05-29 2001-12-07 Tokyo Electron Ltd プラズマ処理装置および処理方法
JP2003060019A (ja) * 2001-08-13 2003-02-28 Hitachi Ltd ウエハステージ
KR100511854B1 (ko) * 2002-06-18 2005-09-02 아네르바 가부시키가이샤 정전 흡착 장치
JP2005276886A (ja) * 2004-03-23 2005-10-06 Nikon Corp 静電チャックおよび露光装置
JP4386360B2 (ja) * 2004-12-06 2009-12-16 信越化学工業株式会社 静電チャック
JP4994121B2 (ja) * 2006-08-10 2012-08-08 東京エレクトロン株式会社 静電吸着電極、基板処理装置および静電吸着電極の製造方法
US7701693B2 (en) * 2006-09-13 2010-04-20 Ngk Insulators, Ltd. Electrostatic chuck with heater and manufacturing method thereof

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Publication number Publication date
JP2009302347A (ja) 2009-12-24
US20090310274A1 (en) 2009-12-17
US8068326B2 (en) 2011-11-29

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