JP5010589B2 - 半導体デバイス製造方法及びその方法により製造した半導体デバイスを備えた半導体集積回路チップ - Google Patents
半導体デバイス製造方法及びその方法により製造した半導体デバイスを備えた半導体集積回路チップ Download PDFInfo
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- JP5010589B2 JP5010589B2 JP2008516483A JP2008516483A JP5010589B2 JP 5010589 B2 JP5010589 B2 JP 5010589B2 JP 2008516483 A JP2008516483 A JP 2008516483A JP 2008516483 A JP2008516483 A JP 2008516483A JP 5010589 B2 JP5010589 B2 JP 5010589B2
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- 239000004065 semiconductor Substances 0.000 title claims description 43
- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 238000000034 method Methods 0.000 title claims description 14
- 239000000758 substrate Substances 0.000 claims description 34
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 21
- 229920005591 polysilicon Polymers 0.000 claims description 20
- 239000002019 doping agent Substances 0.000 claims description 18
- 238000000137 annealing Methods 0.000 claims description 8
- 238000005498 polishing Methods 0.000 claims description 6
- 229910021332 silicide Inorganic materials 0.000 claims description 6
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000001953 recrystallisation Methods 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 14
- 238000005280 amorphization Methods 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 7
- 238000002513 implantation Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 229910052732 germanium Inorganic materials 0.000 description 6
- 230000004913 activation Effects 0.000 description 4
- 229910021417 amorphous silicon Inorganic materials 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 239000007790 solid phase Substances 0.000 description 4
- 239000002344 surface layer Substances 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- -1 boron ions Chemical class 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000005036 potential barrier Methods 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001638 boron Chemical class 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
- H01L21/26513—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors of electrically active species
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
- H01L21/28035—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
- H01L21/28035—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities
- H01L21/28044—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities the conductor comprising at least another non-silicon conductive layer
- H01L21/28052—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities the conductor comprising at least another non-silicon conductive layer the conductor comprising a silicide layer formed by the silicidation reaction of silicon with a metal layer
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
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- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4916—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a silicon layer, e.g. polysilicon doped with boron, phosphorus or nitrogen
- H01L29/4925—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a silicon layer, e.g. polysilicon doped with boron, phosphorus or nitrogen with a multiple layer structure, e.g. several silicon layers with different crystal structure or grain arrangement
- H01L29/4933—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a silicon layer, e.g. polysilicon doped with boron, phosphorus or nitrogen with a multiple layer structure, e.g. several silicon layers with different crystal structure or grain arrangement with a silicide layer contacting the silicon layer, e.g. Polycide gate
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66545—Unipolar field-effect transistors with an insulated gate, i.e. MISFET using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
Description
Claims (4)
- 半導体デバイス製造方法において、
n型またはp型にドープされた半導体基板上にポリシリコンのゲート電極を形成するステップと、
前記半導体基板および前記ゲート電極の露出面をアモルファス化させるステップと、
前記アモルファス化させるステップの後、前記ゲート電極に隣接した前記半導体基板の領域に、前記半導体基板の型とは異なる型のドーパントをドーピングするステップと、
その後、600℃〜750℃の低温アニールにより、前記ゲート電極の上部はアモルファス状態で、前記ゲート電極の下部および前記半導体基板を再結晶化させる再結晶化ステップと、
前記再結晶化ステップの後、前記ゲート電極の最上部表面から20〜50nmの厚さを有する層を除去し、前記ゲート電極の高抵抗部分のみを取り除く除去ステップと、
前記除去ステップの後に、前記ゲート電極上に金属層を堆積させるステップと、
前記金属層が堆積した状態で、前記基板を加熱して前記ゲート電極上にシリサイド接点領域を形成するステップと
を含むことを特徴とする半導体デバイス製造方法。 - 請求項1に記載の半導体デバイス製造方法において、
前記除去ステップは、前記ゲート電極の最上部露出面を研磨するステップを含むことを特徴とする半導体デバイス製造方法。 - 請求項1に記載の半導体デバイス製造方法において、
前記除去ステップは、前記ゲート電極の最上部露出面をエッチングするステップを含むことを特徴とする半導体デバイス製造方法。 - 請求項1〜3のいずれか1項に記載の半導体デバイス製造方法により製造した半導体デバイスを備えた集積回路チップ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05105323 | 2005-06-16 | ||
EP05105323.9 | 2005-06-16 | ||
PCT/IB2006/051879 WO2006134553A2 (en) | 2005-06-16 | 2006-06-13 | Semiconductor device having a polysilicon electrode |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008544517A JP2008544517A (ja) | 2008-12-04 |
JP5010589B2 true JP5010589B2 (ja) | 2012-08-29 |
Family
ID=37532687
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2008516483A Active JP5010589B2 (ja) | 2005-06-16 | 2006-06-13 | 半導体デバイス製造方法及びその方法により製造した半導体デバイスを備えた半導体集積回路チップ |
Country Status (5)
Country | Link |
---|---|
US (1) | US7790545B2 (ja) |
EP (1) | EP1894243A2 (ja) |
JP (1) | JP5010589B2 (ja) |
CN (1) | CN101288159B (ja) |
WO (1) | WO2006134553A2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102194752B (zh) * | 2010-03-11 | 2013-06-12 | 中芯国际集成电路制造(上海)有限公司 | 一种互补金属氧化物半导体器件结构的制作方法 |
US8748256B2 (en) * | 2012-02-06 | 2014-06-10 | Texas Instruments Incorporated | Integrated circuit having silicide block resistor |
US9958424B2 (en) * | 2012-10-01 | 2018-05-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of identifying airborne molecular contamination source |
CN106952918A (zh) * | 2016-01-05 | 2017-07-14 | 中芯国际集成电路制造(上海)有限公司 | 分离栅快闪存储器的制备方法 |
US10522557B2 (en) | 2017-10-30 | 2019-12-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | Surface topography by forming spacer-like components |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH03297148A (ja) * | 1990-04-16 | 1991-12-27 | Fujitsu Ltd | 半導体装置の製造方法 |
JPH0458524A (ja) * | 1990-06-27 | 1992-02-25 | Fujitsu Ltd | 半導体装置の製造方法 |
JPH07263684A (ja) * | 1994-03-25 | 1995-10-13 | Mitsubishi Electric Corp | 電界効果トランジスタの製造方法 |
US5656519A (en) | 1995-02-14 | 1997-08-12 | Nec Corporation | Method for manufacturing salicide semiconductor device |
JPH0923007A (ja) * | 1995-07-07 | 1997-01-21 | Sony Corp | 半導体装置およびその製造方法 |
US5966597A (en) * | 1998-01-06 | 1999-10-12 | Altera Corporation | Method of forming low resistance gate electrodes |
US6297115B1 (en) | 1998-11-06 | 2001-10-02 | Advanced Micro Devices, Inc. | Cmos processs with low thermal budget |
JP2000260728A (ja) * | 1999-03-08 | 2000-09-22 | Nec Corp | 半導体装置の製造方法 |
US6335253B1 (en) | 2000-07-12 | 2002-01-01 | Chartered Semiconductor Manufacturing Ltd. | Method to form MOS transistors with shallow junctions using laser annealing |
US6424001B1 (en) * | 2001-02-09 | 2002-07-23 | Micron Technology, Inc. | Flash memory with ultra thin vertical body transistors |
JP2003332565A (ja) * | 2002-05-08 | 2003-11-21 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
JP2003022984A (ja) * | 2002-05-31 | 2003-01-24 | Sharp Corp | 半導体装置の製造方法 |
US20040115889A1 (en) | 2002-12-17 | 2004-06-17 | Amitabh Jain | Ultra shallow junction formation |
US7247566B2 (en) * | 2003-10-23 | 2007-07-24 | Dupont Air Products Nanomaterials Llc | CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfonic acids as oxidizers |
EP1650796A3 (fr) | 2004-10-20 | 2010-12-08 | STMicroelectronics (Crolles 2) SAS | Procédé de prise de contact sur une région d'un circuit intégré, en particulier sur les électrodes d'un transistor |
-
2006
- 2006-06-13 CN CN2006800213073A patent/CN101288159B/zh active Active
- 2006-06-13 US US11/917,103 patent/US7790545B2/en active Active
- 2006-06-13 WO PCT/IB2006/051879 patent/WO2006134553A2/en active Application Filing
- 2006-06-13 EP EP06756123A patent/EP1894243A2/en not_active Withdrawn
- 2006-06-13 JP JP2008516483A patent/JP5010589B2/ja active Active
Also Published As
Publication number | Publication date |
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WO2006134553A3 (en) | 2008-06-19 |
EP1894243A2 (en) | 2008-03-05 |
WO2006134553A2 (en) | 2006-12-21 |
US7790545B2 (en) | 2010-09-07 |
JP2008544517A (ja) | 2008-12-04 |
CN101288159B (zh) | 2010-10-06 |
US20090159992A1 (en) | 2009-06-25 |
CN101288159A (zh) | 2008-10-15 |
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