JP4988123B2 - 発光ダイオード - Google Patents

発光ダイオード Download PDF

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Publication number
JP4988123B2
JP4988123B2 JP2002044707A JP2002044707A JP4988123B2 JP 4988123 B2 JP4988123 B2 JP 4988123B2 JP 2002044707 A JP2002044707 A JP 2002044707A JP 2002044707 A JP2002044707 A JP 2002044707A JP 4988123 B2 JP4988123 B2 JP 4988123B2
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JP
Japan
Prior art keywords
light emitting
component
light
emitting diode
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2002044707A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002327114A (ja
JP2002327114A5 (enExample
Inventor
克哉 大内
学 津村
晴美 坂本
雅幸 藤田
雅史 蔵本
倫英 三木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Kaneka Corp
Original Assignee
Nichia Corp
Kaneka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp, Kaneka Corp filed Critical Nichia Corp
Priority to JP2002044707A priority Critical patent/JP4988123B2/ja
Publication of JP2002327114A publication Critical patent/JP2002327114A/ja
Publication of JP2002327114A5 publication Critical patent/JP2002327114A5/ja
Application granted granted Critical
Publication of JP4988123B2 publication Critical patent/JP4988123B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Liquid Crystal (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
JP2002044707A 2001-02-23 2002-02-21 発光ダイオード Expired - Lifetime JP4988123B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002044707A JP4988123B2 (ja) 2001-02-23 2002-02-21 発光ダイオード

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2001048548 2001-02-23
JP2001048548 2001-02-23
JP2001-48548 2001-02-23
JP2002044707A JP4988123B2 (ja) 2001-02-23 2002-02-21 発光ダイオード

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2005033542A Division JP2005200657A (ja) 2001-02-23 2005-02-09 光学材料用組成物、光学材料、その製造方法、並びにそれを用いた液晶表示装置

Publications (3)

Publication Number Publication Date
JP2002327114A JP2002327114A (ja) 2002-11-15
JP2002327114A5 JP2002327114A5 (enExample) 2005-08-25
JP4988123B2 true JP4988123B2 (ja) 2012-08-01

Family

ID=26609991

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002044707A Expired - Lifetime JP4988123B2 (ja) 2001-02-23 2002-02-21 発光ダイオード

Country Status (1)

Country Link
JP (1) JP4988123B2 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4880837B2 (ja) * 2001-09-05 2012-02-22 株式会社カネカ 硬化性組成物および硬化物
JP2003073549A (ja) * 2001-09-05 2003-03-12 Kanegafuchi Chem Ind Co Ltd 光学材料用硬化性組成物、光学用材料、その製造方法およびそれを用いた発光ダイオード
JP5676068B2 (ja) * 2001-09-06 2015-02-25 株式会社カネカ 硬化性組成物、硬化物、その製造方法およびその硬化物により封止された発光ダイオード
JP2004346207A (ja) * 2003-05-22 2004-12-09 Sekisui Chem Co Ltd 室温硬化性組成物、シーリング材及び接着剤
DE102004039111A1 (de) 2003-08-14 2005-04-14 Shin-Etsu Chemical Co., Ltd. Härtbare Silikonharzzusammensetzung
TW200513483A (en) 2003-10-10 2005-04-16 Shinetsu Chemical Co Curable composition
JP4520251B2 (ja) * 2003-10-10 2010-08-04 信越化学工業株式会社 硬化性組成物
JP5021151B2 (ja) * 2003-11-19 2012-09-05 株式会社カネカ 半導体のパッケージ用硬化性樹脂組成物および半導体
JP4520248B2 (ja) * 2004-08-27 2010-08-04 信越化学工業株式会社 硬化性シリコーン樹脂組成物
US8541103B2 (en) 2004-12-03 2013-09-24 Kaneka Corporation Silicone polymer particle and silicone composition containing same
JP4725186B2 (ja) * 2005-05-18 2011-07-13 三菱化学株式会社 発光装置
JP2007207295A (ja) * 2006-01-31 2007-08-16 Konica Minolta Opto Inc 光学素子
JP4933797B2 (ja) * 2006-02-24 2012-05-16 昭和電工株式会社 硬化性樹脂組成物およびオプトデバイス
US9502624B2 (en) 2006-05-18 2016-11-22 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
JP5583928B2 (ja) * 2009-06-16 2014-09-03 株式会社カネカ 硬化性組成物、および、硬化物
JP5738541B2 (ja) * 2010-04-21 2015-06-24 日東電工株式会社 光半導体装置
US9260654B2 (en) * 2011-03-11 2016-02-16 Konica Minolta, Inc. Manufacturing method for light emitting device and phosphor mixture
JP5563628B2 (ja) * 2012-08-06 2014-07-30 株式会社カネカ 半導体のパッケージ用硬化性樹脂組成物および半導体
JP5563695B2 (ja) * 2013-04-17 2014-07-30 株式会社カネカ 半導体のパッケージ用硬化性樹脂組成物および半導体
JP5685284B2 (ja) * 2013-04-17 2015-03-18 株式会社カネカ 発光ダイオード用パッケージおよび発光ダイオード
JP5563696B2 (ja) * 2013-04-17 2014-07-30 株式会社カネカ 半導体のパッケージ用硬化性樹脂組成物および半導体

Also Published As

Publication number Publication date
JP2002327114A (ja) 2002-11-15

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