JP4981064B2 - 放射状プリズム光偏向器を有するled発光体 - Google Patents
放射状プリズム光偏向器を有するled発光体 Download PDFInfo
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- JP4981064B2 JP4981064B2 JP2008547319A JP2008547319A JP4981064B2 JP 4981064 B2 JP4981064 B2 JP 4981064B2 JP 2008547319 A JP2008547319 A JP 2008547319A JP 2008547319 A JP2008547319 A JP 2008547319A JP 4981064 B2 JP4981064 B2 JP 4981064B2
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Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/095—Refractive optical elements
- G02B27/0972—Prisms
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/02—Refractors for light sources of prismatic shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/0091—Reflectors for light sources using total internal reflection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/68—Details of reflectors forming part of the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
- F21V13/02—Combinations of only two kinds of elements
- F21V13/04—Combinations of only two kinds of elements the elements being reflectors and refractors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/04—Optical design
- F21V7/05—Optical design plane
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Planar Illumination Modules (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Optical Elements Other Than Lenses (AREA)
Description
Claims (3)
- 発光軸を持つ発光ダイオード(LED)と、
参照点に対して放射状に配置された複数個の線状プリズム構造物を含む構造化表面であって、前記構造化表面が前記LEDに対して、前記参照点が前記発光軸と略一直線になるように配置される、構造化表面と、
前記線状プリズム構造物が前記参照点の周りで少なくとも部分的に非接触であるように、前記線状プリズム構造物の各々の間にある非構造化部分
とを備える光学組立品であって、
前記線状プリズム構造物の各々が略線状のプリズム頂部を有し、各々のプリズム頂部が前記発光軸に垂直な参照面に平行である、光学組立品。 - 発光軸を持つ発光ダイオード(LED)と、
参照点に対して放射状に配置された複数個の線状プリズム構造物を含む構造化表面であって、前記構造化表面が前記LEDに対して、前記参照点が前記発光軸と略一直線になるように配置される、構造化表面と、
前記線状プリズム構造物が前記参照点の周りで少なくとも部分的に非接触であるように、前記線状プリズム構造物の各々の間にある非構造化部分
とを備える光学組立品であって、
前記線状プリズム構造物の各々が湾曲プリズム頂部を有し、前記プリズム頂部が前記発光軸に対して漏斗形の配置で傾斜している、光学組立品。 - 発光軸を持つ発光ダイオード(LED)と、
参照点に対して放射状に配置された複数個の線状プリズム構造物を含む構造化表面であって、前記構造化表面が前記LEDに対して、前記参照点が前記発光軸と略一直線になるように配置される、構造化表面と、
前記線状プリズム構造物が前記参照点の周りで少なくとも部分的に非接触であるように、前記線状プリズム構造物の各々の間にある非構造化部分
とを備える光学組立品であって、
前記LEDがカプセルの中に配置されたLEDダイを備え、前記構造化表面が前記カプセル上に配置されている、光学組立品。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/275,288 | 2005-12-21 | ||
US11/275,288 US7637639B2 (en) | 2005-12-21 | 2005-12-21 | LED emitter with radial prismatic light diverter |
PCT/US2006/047580 WO2007078783A1 (en) | 2005-12-21 | 2006-12-13 | Led emitter with radial prismatic light diverter |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009521782A JP2009521782A (ja) | 2009-06-04 |
JP2009521782A5 JP2009521782A5 (ja) | 2010-01-14 |
JP4981064B2 true JP4981064B2 (ja) | 2012-07-18 |
Family
ID=38173125
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008547319A Expired - Fee Related JP4981064B2 (ja) | 2005-12-21 | 2006-12-13 | 放射状プリズム光偏向器を有するled発光体 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7637639B2 (ja) |
EP (1) | EP1964187A4 (ja) |
JP (1) | JP4981064B2 (ja) |
KR (1) | KR20080078845A (ja) |
CN (1) | CN101341601B (ja) |
TW (1) | TWI379060B (ja) |
WO (1) | WO2007078783A1 (ja) |
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EP1455398A3 (en) * | 2003-03-03 | 2011-05-25 | Toyoda Gosei Co., Ltd. | Light emitting device comprising a phosphor layer and method of making same |
JP2005249942A (ja) * | 2004-03-02 | 2005-09-15 | Hitachi Displays Ltd | 表示装置 |
JP4471685B2 (ja) * | 2004-03-10 | 2010-06-02 | シチズン電子株式会社 | 照明装置 |
KR100576864B1 (ko) | 2004-03-31 | 2006-05-10 | 삼성전기주식회사 | Led 패키지용 렌즈 |
JP4290601B2 (ja) * | 2004-05-17 | 2009-07-08 | 株式会社小糸製作所 | 車両用灯具ユニットおよび車両用灯具 |
KR100586968B1 (ko) * | 2004-05-28 | 2006-06-08 | 삼성전기주식회사 | Led 패키지 및 이를 구비한 액정표시장치용 백라이트어셈블리 |
WO2006020535A2 (en) | 2004-08-09 | 2006-02-23 | Valeo Sylvania Llc | Led bulb refractive relector |
JP2006091821A (ja) * | 2004-08-26 | 2006-04-06 | Fuji Photo Film Co Ltd | プリズムシート及びこれを用いた表示装置 |
KR100638657B1 (ko) * | 2004-10-20 | 2006-10-30 | 삼성전기주식회사 | 양극성 측면 방출형 발광 다이오드 렌즈 및 이를 구비하는발광 다이오드 모듈 |
US20070014018A1 (en) * | 2004-12-30 | 2007-01-18 | Wheatley John A | Internal components of optical device comprising hardcoat |
-
2005
- 2005-12-21 US US11/275,288 patent/US7637639B2/en not_active Expired - Fee Related
-
2006
- 2006-12-13 WO PCT/US2006/047580 patent/WO2007078783A1/en active Application Filing
- 2006-12-13 EP EP06847619.1A patent/EP1964187A4/en not_active Withdrawn
- 2006-12-13 KR KR1020087014942A patent/KR20080078845A/ko not_active Application Discontinuation
- 2006-12-13 CN CN2006800479715A patent/CN101341601B/zh not_active Expired - Fee Related
- 2006-12-13 JP JP2008547319A patent/JP4981064B2/ja not_active Expired - Fee Related
- 2006-12-20 TW TW095148024A patent/TWI379060B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20080078845A (ko) | 2008-08-28 |
JP2009521782A (ja) | 2009-06-04 |
CN101341601B (zh) | 2010-05-19 |
CN101341601A (zh) | 2009-01-07 |
EP1964187A4 (en) | 2015-04-01 |
US7637639B2 (en) | 2009-12-29 |
EP1964187A1 (en) | 2008-09-03 |
US20070139798A1 (en) | 2007-06-21 |
WO2007078783A1 (en) | 2007-07-12 |
TWI379060B (en) | 2012-12-11 |
TW200732595A (en) | 2007-09-01 |
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