JP4977411B2 - レーザー加工装置 - Google Patents

レーザー加工装置 Download PDF

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Publication number
JP4977411B2
JP4977411B2 JP2006186327A JP2006186327A JP4977411B2 JP 4977411 B2 JP4977411 B2 JP 4977411B2 JP 2006186327 A JP2006186327 A JP 2006186327A JP 2006186327 A JP2006186327 A JP 2006186327A JP 4977411 B2 JP4977411 B2 JP 4977411B2
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Japan
Prior art keywords
laser beam
light
light receiving
reflected light
processing
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JP2006186327A
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English (en)
Japanese (ja)
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JP2008012566A (ja
Inventor
圭司 能丸
重松　　孝一
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Disco Corp
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Disco Corp
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Priority to JP2006186327A priority Critical patent/JP4977411B2/ja
Priority to TW096124349A priority patent/TWI413173B/zh
Publication of JP2008012566A publication Critical patent/JP2008012566A/ja
Application granted granted Critical
Publication of JP4977411B2 publication Critical patent/JP4977411B2/ja
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  • Laser Beam Processing (AREA)
  • Dicing (AREA)
JP2006186327A 2006-07-06 2006-07-06 レーザー加工装置 Active JP4977411B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006186327A JP4977411B2 (ja) 2006-07-06 2006-07-06 レーザー加工装置
TW096124349A TWI413173B (zh) 2006-07-06 2007-07-04 Laser processing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006186327A JP4977411B2 (ja) 2006-07-06 2006-07-06 レーザー加工装置

Publications (2)

Publication Number Publication Date
JP2008012566A JP2008012566A (ja) 2008-01-24
JP4977411B2 true JP4977411B2 (ja) 2012-07-18

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ID=39070115

Family Applications (1)

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JP2006186327A Active JP4977411B2 (ja) 2006-07-06 2006-07-06 レーザー加工装置

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JP (1) JP4977411B2 (zh)
TW (1) TWI413173B (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5117920B2 (ja) * 2008-04-28 2013-01-16 株式会社ディスコ レーザー加工装置
JP5243098B2 (ja) 2008-05-09 2013-07-24 株式会社ディスコ レーザー加工装置
JP5199789B2 (ja) * 2008-08-25 2013-05-15 株式会社ディスコ レーザー加工装置及びレーザー加工方法
JP5221254B2 (ja) * 2008-08-28 2013-06-26 株式会社ディスコ レーザー加工装置
JP5851784B2 (ja) * 2011-09-28 2016-02-03 株式会社ディスコ 高さ位置検出装置およびレーザー加工機
JP5902540B2 (ja) * 2012-04-02 2016-04-13 株式会社ディスコ レーザー加工方法およびレーザー加工装置
TWI555599B (zh) * 2013-02-25 2016-11-01 先進科技新加坡有限公司 在雷射劃刻裝置中執行光束特徵化之方法，及可執行此方法之雷射劃刻裝置
JP6250329B2 (ja) 2013-08-19 2017-12-20 株式会社ディスコ 加工装置
JP6345928B2 (ja) 2013-11-18 2018-06-20 株式会社ディスコ 検出装置
JP6215666B2 (ja) * 2013-11-19 2017-10-18 株式会社ディスコ 加工装置
CN117881215A (zh) 2013-12-02 2024-04-12 株式会社半导体能源研究所 显示装置及其制造方法
JP2015200537A (ja) * 2014-04-07 2015-11-12 株式会社ディスコ 凹凸検出装置
KR20170017019A (ko) * 2015-07-09 2017-02-15 주식회사 이오테크닉스 집광점 검출장치
KR20170015866A (ko) * 2015-07-09 2017-02-10 주식회사 이오테크닉스 레이저 가공장치
JP6831253B2 (ja) * 2017-01-27 2021-02-17 株式会社ディスコ レーザー加工装置
JP7043124B2 (ja) * 2017-09-22 2022-03-29 株式会社ディスコ ウェーハの加工方法
JP7325897B2 (ja) * 2019-04-18 2023-08-15 株式会社ディスコ 加工装置及び被加工物の加工方法
JP7515336B2 (ja) 2020-07-31 2024-07-12 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62244588A (ja) * 1986-04-18 1987-10-24 Nec Corp 自動焦点機構
JP3169354B2 (ja) * 1998-12-10 2001-05-21 川崎重工業株式会社 レーザ溶接加工モニタリング装置
JP2001334376A (ja) * 2000-05-26 2001-12-04 Nec Toyama Ltd レーザ加工装置及びレーザ光スポット位置補正方法
JP2004188422A (ja) * 2002-12-06 2004-07-08 Hamamatsu Photonics Kk レーザ加工装置及びレーザ加工方法
JP2005021916A (ja) * 2003-06-30 2005-01-27 Olympus Corp 欠陥修正機能付き顕微鏡装置
JP4601965B2 (ja) * 2004-01-09 2010-12-22 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP2005297012A (ja) * 2004-04-13 2005-10-27 Disco Abrasive Syst Ltd レーザー加工装置
JP4299185B2 (ja) * 2004-04-27 2009-07-22 株式会社ディスコ レーザー加工装置
JP2006159254A (ja) * 2004-12-07 2006-06-22 Disco Abrasive Syst Ltd レーザー加工装置
JP4734101B2 (ja) * 2005-11-30 2011-07-27 株式会社ディスコ レーザー加工装置

Also Published As

Publication number Publication date
JP2008012566A (ja) 2008-01-24
TWI413173B (zh) 2013-10-21
TW200823985A (en) 2008-06-01

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