JP4964554B2 - レーザ加工方法 - Google Patents

レーザ加工方法 Download PDF

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Publication number
JP4964554B2
JP4964554B2 JP2006271981A JP2006271981A JP4964554B2 JP 4964554 B2 JP4964554 B2 JP 4964554B2 JP 2006271981 A JP2006271981 A JP 2006271981A JP 2006271981 A JP2006271981 A JP 2006271981A JP 4964554 B2 JP4964554 B2 JP 4964554B2
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JP
Japan
Prior art keywords
value
laser
total light
region
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2006271981A
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English (en)
Japanese (ja)
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JP2008087053A (ja
JP2008087053A5 (https=
Inventor
一弘 渥美
耕司 久野
達也 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
Original Assignee
Hamamatsu Photonics KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2006271981A priority Critical patent/JP4964554B2/ja
Application filed by Hamamatsu Photonics KK filed Critical Hamamatsu Photonics KK
Priority to US12/444,119 priority patent/US9012805B2/en
Priority to KR1020097003672A priority patent/KR101579317B1/ko
Priority to PCT/JP2007/068657 priority patent/WO2008041579A1/ja
Priority to CN2007800371832A priority patent/CN101522361B/zh
Priority to EP07807872.2A priority patent/EP2070633B1/en
Priority to TW096137021A priority patent/TWI424898B/zh
Publication of JP2008087053A publication Critical patent/JP2008087053A/ja
Publication of JP2008087053A5 publication Critical patent/JP2008087053A5/ja
Application granted granted Critical
Publication of JP4964554B2 publication Critical patent/JP4964554B2/ja
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Anticipated expiration legal-status Critical

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B23K26/048—Automatically focusing the laser beam by controlling the distance between laser head and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
JP2006271981A 2006-10-03 2006-10-03 レーザ加工方法 Active JP4964554B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2006271981A JP4964554B2 (ja) 2006-10-03 2006-10-03 レーザ加工方法
KR1020097003672A KR101579317B1 (ko) 2006-10-03 2007-09-26 레이저 가공방법
PCT/JP2007/068657 WO2008041579A1 (fr) 2006-10-03 2007-09-26 Procédé d'usinage au laser
CN2007800371832A CN101522361B (zh) 2006-10-03 2007-09-26 激光加工方法
US12/444,119 US9012805B2 (en) 2006-10-03 2007-09-26 Laser working method
EP07807872.2A EP2070633B1 (en) 2006-10-03 2007-09-26 Laser working method
TW096137021A TWI424898B (zh) 2006-10-03 2007-10-02 Laser processing method and laser processing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006271981A JP4964554B2 (ja) 2006-10-03 2006-10-03 レーザ加工方法

Publications (3)

Publication Number Publication Date
JP2008087053A JP2008087053A (ja) 2008-04-17
JP2008087053A5 JP2008087053A5 (https=) 2010-01-07
JP4964554B2 true JP4964554B2 (ja) 2012-07-04

Family

ID=39268441

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006271981A Active JP4964554B2 (ja) 2006-10-03 2006-10-03 レーザ加工方法

Country Status (7)

Country Link
US (1) US9012805B2 (https=)
EP (1) EP2070633B1 (https=)
JP (1) JP4964554B2 (https=)
KR (1) KR101579317B1 (https=)
CN (1) CN101522361B (https=)
TW (1) TWI424898B (https=)
WO (1) WO2008041579A1 (https=)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
ATE493226T1 (de) * 2002-03-12 2011-01-15 Hamamatsu Photonics Kk Verfahren zum schneiden eines bearbeiteten objekts
TWI326626B (en) * 2002-03-12 2010-07-01 Hamamatsu Photonics Kk Laser processing method
ES2639733T3 (es) 2002-03-12 2017-10-30 Hamamatsu Photonics K.K. Método de división de sustrato
TWI520269B (zh) * 2002-12-03 2016-02-01 濱松赫德尼古斯股份有限公司 Cutting method of semiconductor substrate
FR2852250B1 (fr) * 2003-03-11 2009-07-24 Jean Luc Jouvin Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau
CN1758985A (zh) * 2003-03-12 2006-04-12 浜松光子学株式会社 激光加工方法
CN1826207B (zh) * 2003-07-18 2010-06-16 浜松光子学株式会社 激光加工方法、激光加工装置以及加工产品
JP4563097B2 (ja) 2003-09-10 2010-10-13 浜松ホトニクス株式会社 半導体基板の切断方法
JP4509578B2 (ja) 2004-01-09 2010-07-21 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP4601965B2 (ja) * 2004-01-09 2010-12-22 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP4598407B2 (ja) * 2004-01-09 2010-12-15 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
EP1742253B1 (en) 2004-03-30 2012-05-09 Hamamatsu Photonics K.K. Laser processing method
US8604383B2 (en) * 2004-08-06 2013-12-10 Hamamatsu Photonics K.K. Laser processing method
JP4762653B2 (ja) * 2005-09-16 2011-08-31 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP4907965B2 (ja) * 2005-11-25 2012-04-04 浜松ホトニクス株式会社 レーザ加工方法
JP4804911B2 (ja) * 2005-12-22 2011-11-02 浜松ホトニクス株式会社 レーザ加工装置
JP4907984B2 (ja) 2005-12-27 2012-04-04 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップ
ES2428826T3 (es) 2006-07-03 2013-11-11 Hamamatsu Photonics K.K. Procedimiento de procesamiento por láser y chip
JP5183892B2 (ja) 2006-07-03 2013-04-17 浜松ホトニクス株式会社 レーザ加工方法
CN102489883B (zh) 2006-09-19 2015-12-02 浜松光子学株式会社 激光加工方法和激光加工装置
JP4954653B2 (ja) 2006-09-19 2012-06-20 浜松ホトニクス株式会社 レーザ加工方法
JP5101073B2 (ja) * 2006-10-02 2012-12-19 浜松ホトニクス株式会社 レーザ加工装置
JP5132911B2 (ja) * 2006-10-03 2013-01-30 浜松ホトニクス株式会社 レーザ加工方法
CN102357739B (zh) * 2006-10-04 2014-09-10 浜松光子学株式会社 激光加工方法
JP5336054B2 (ja) * 2007-07-18 2013-11-06 浜松ホトニクス株式会社 加工情報供給装置を備える加工情報供給システム
JP5449665B2 (ja) * 2007-10-30 2014-03-19 浜松ホトニクス株式会社 レーザ加工方法
JP5134928B2 (ja) * 2007-11-30 2013-01-30 浜松ホトニクス株式会社 加工対象物研削方法
JP5054496B2 (ja) * 2007-11-30 2012-10-24 浜松ホトニクス株式会社 加工対象物切断方法
JP5692969B2 (ja) 2008-09-01 2015-04-01 浜松ホトニクス株式会社 収差補正方法、この収差補正方法を用いたレーザ加工方法、この収差補正方法を用いたレーザ照射方法、収差補正装置、及び、収差補正プログラム
JP5254761B2 (ja) 2008-11-28 2013-08-07 浜松ホトニクス株式会社 レーザ加工装置
JP5241525B2 (ja) 2009-01-09 2013-07-17 浜松ホトニクス株式会社 レーザ加工装置
JP5241527B2 (ja) 2009-01-09 2013-07-17 浜松ホトニクス株式会社 レーザ加工装置
EP2394775B1 (en) 2009-02-09 2019-04-03 Hamamatsu Photonics K.K. Workpiece cutting method
CN102317030B (zh) * 2009-04-07 2014-08-20 浜松光子学株式会社 激光加工装置以及激光加工方法
JP5491761B2 (ja) 2009-04-20 2014-05-14 浜松ホトニクス株式会社 レーザ加工装置
JP5552373B2 (ja) 2010-06-02 2014-07-16 浜松ホトニクス株式会社 レーザ加工方法
US8828873B2 (en) * 2010-07-26 2014-09-09 Hamamatsu Photonics K.K. Method for manufacturing semiconductor device
US8722516B2 (en) 2010-09-28 2014-05-13 Hamamatsu Photonics K.K. Laser processing method and method for manufacturing light-emitting device
KR20130039955A (ko) 2011-10-13 2013-04-23 현대자동차주식회사 용접용 레이저 장치
JP6000700B2 (ja) * 2012-07-10 2016-10-05 株式会社ディスコ レーザー加工方法
JP6073643B2 (ja) * 2012-10-25 2017-02-01 株式会社小糸製作所 車両用ランプとその製造方法
JP6342949B2 (ja) * 2016-05-17 2018-06-13 ファナック株式会社 反射光を抑制しながらレーザ加工を行うレーザ加工装置及びレーザ加工方法
CN111263678A (zh) * 2017-10-25 2020-06-09 株式会社尼康 加工装置、加工系统、及移动体的制造方法
US10589445B1 (en) * 2018-10-29 2020-03-17 Semivation, LLC Method of cleaving a single crystal substrate parallel to its active planar surface and method of using the cleaved daughter substrate
US11024501B2 (en) 2018-12-29 2021-06-01 Cree, Inc. Carrier-assisted method for parting crystalline material along laser damage region
US10562130B1 (en) 2018-12-29 2020-02-18 Cree, Inc. Laser-assisted method for parting crystalline material
US10576585B1 (en) 2018-12-29 2020-03-03 Cree, Inc. Laser-assisted method for parting crystalline material
JP6989549B2 (ja) * 2019-03-13 2022-01-05 フタバ産業株式会社 接合体の製造方法
US10611052B1 (en) 2019-05-17 2020-04-07 Cree, Inc. Silicon carbide wafers with relaxed positive bow and related methods
JPWO2022254844A1 (https=) 2021-06-01 2022-12-08
JP7680301B2 (ja) * 2021-08-02 2025-05-20 株式会社Ｓｃｒｅｅｎホールディングス 光照射装置、および、光照射方法

Family Cites Families (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4546231A (en) * 1983-11-14 1985-10-08 Group Ii Manufacturing Ltd. Creation of a parting zone in a crystal structure
JPS63149513A (ja) 1986-12-12 1988-06-22 Sankyo Seiki Mfg Co Ltd 光学式変位計測方法
KR0171947B1 (ko) 1995-12-08 1999-03-20 김주용 반도체소자 제조를 위한 노광 방법 및 그를 이용한 노광장치
JP4067602B2 (ja) * 1996-12-09 2008-03-26 富士通株式会社 高さ検査方法、それを実施する高さ検査装置
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
ES2639733T3 (es) * 2002-03-12 2017-10-30 Hamamatsu Photonics K.K. Método de división de sustrato
ATE493226T1 (de) * 2002-03-12 2011-01-15 Hamamatsu Photonics Kk Verfahren zum schneiden eines bearbeiteten objekts
TWI326626B (en) * 2002-03-12 2010-07-01 Hamamatsu Photonics Kk Laser processing method
TWI520269B (zh) * 2002-12-03 2016-02-01 濱松赫德尼古斯股份有限公司 Cutting method of semiconductor substrate
US7489454B2 (en) * 2002-12-05 2009-02-10 Hamamatsu Photonics K.K. Laser processing device
JP2004188422A (ja) * 2002-12-06 2004-07-08 Hamamatsu Photonics Kk レーザ加工装置及びレーザ加工方法
FR2852250B1 (fr) * 2003-03-11 2009-07-24 Jean Luc Jouvin Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau
CN1758985A (zh) * 2003-03-12 2006-04-12 浜松光子学株式会社 激光加工方法
CN1826207B (zh) * 2003-07-18 2010-06-16 浜松光子学株式会社 激光加工方法、激光加工装置以及加工产品
JP4563097B2 (ja) * 2003-09-10 2010-10-13 浜松ホトニクス株式会社 半導体基板の切断方法
JP2005086175A (ja) * 2003-09-11 2005-03-31 Hamamatsu Photonics Kk 半導体薄膜の製造方法、半導体薄膜、半導体薄膜チップ、電子管、及び光検出素子
JP2005150537A (ja) 2003-11-18 2005-06-09 Disco Abrasive Syst Ltd 板状物の加工方法および加工装置
US7719017B2 (en) * 2004-01-07 2010-05-18 Hamamatsu Photonics K.K. Semiconductor light-emitting device and its manufacturing method
JP4601965B2 (ja) * 2004-01-09 2010-12-22 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP4509578B2 (ja) * 2004-01-09 2010-07-21 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP4598407B2 (ja) * 2004-01-09 2010-12-15 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP3708104B2 (ja) * 2004-01-13 2005-10-19 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
CN1938827B (zh) * 2004-03-30 2010-05-26 浜松光子学株式会社 激光加工方法及半导体芯片
EP1742253B1 (en) * 2004-03-30 2012-05-09 Hamamatsu Photonics K.K. Laser processing method
JP4536407B2 (ja) * 2004-03-30 2010-09-01 浜松ホトニクス株式会社 レーザ加工方法及び加工対象物
JP4634089B2 (ja) * 2004-07-30 2011-02-16 浜松ホトニクス株式会社 レーザ加工方法
US8604383B2 (en) * 2004-08-06 2013-12-10 Hamamatsu Photonics K.K. Laser processing method
JP4732063B2 (ja) * 2004-08-06 2011-07-27 浜松ホトニクス株式会社 レーザ加工方法
JP4754801B2 (ja) * 2004-10-13 2011-08-24 浜松ホトニクス株式会社 レーザ加工方法
JP4781661B2 (ja) * 2004-11-12 2011-09-28 浜松ホトニクス株式会社 レーザ加工方法
JP4917257B2 (ja) * 2004-11-12 2012-04-18 浜松ホトニクス株式会社 レーザ加工方法
JP4198123B2 (ja) * 2005-03-22 2008-12-17 浜松ホトニクス株式会社 レーザ加工方法
JP4776994B2 (ja) * 2005-07-04 2011-09-21 浜松ホトニクス株式会社 加工対象物切断方法
JP4749799B2 (ja) * 2005-08-12 2011-08-17 浜松ホトニクス株式会社 レーザ加工方法
JP4762653B2 (ja) * 2005-09-16 2011-08-31 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP4237745B2 (ja) * 2005-11-18 2009-03-11 浜松ホトニクス株式会社 レーザ加工方法
JP4907965B2 (ja) * 2005-11-25 2012-04-04 浜松ホトニクス株式会社 レーザ加工方法
JP4804911B2 (ja) * 2005-12-22 2011-11-02 浜松ホトニクス株式会社 レーザ加工装置
JP4907984B2 (ja) * 2005-12-27 2012-04-04 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップ
ES2428826T3 (es) * 2006-07-03 2013-11-11 Hamamatsu Photonics K.K. Procedimiento de procesamiento por láser y chip
JP5183892B2 (ja) * 2006-07-03 2013-04-17 浜松ホトニクス株式会社 レーザ加工方法
JP4954653B2 (ja) * 2006-09-19 2012-06-20 浜松ホトニクス株式会社 レーザ加工方法
CN102489883B (zh) * 2006-09-19 2015-12-02 浜松光子学株式会社 激光加工方法和激光加工装置
JP5101073B2 (ja) * 2006-10-02 2012-12-19 浜松ホトニクス株式会社 レーザ加工装置
JP5132911B2 (ja) * 2006-10-03 2013-01-30 浜松ホトニクス株式会社 レーザ加工方法
CN102357739B (zh) * 2006-10-04 2014-09-10 浜松光子学株式会社 激光加工方法
JP5336054B2 (ja) * 2007-07-18 2013-11-06 浜松ホトニクス株式会社 加工情報供給装置を備える加工情報供給システム
JP4402708B2 (ja) * 2007-08-03 2010-01-20 浜松ホトニクス株式会社 レーザ加工方法、レーザ加工装置及びその製造方法
JP5225639B2 (ja) * 2007-09-06 2013-07-03 浜松ホトニクス株式会社 半導体レーザ素子の製造方法
JP5342772B2 (ja) * 2007-10-12 2013-11-13 浜松ホトニクス株式会社 加工対象物切断方法
JP5449665B2 (ja) * 2007-10-30 2014-03-19 浜松ホトニクス株式会社 レーザ加工方法
JP5054496B2 (ja) * 2007-11-30 2012-10-24 浜松ホトニクス株式会社 加工対象物切断方法
JP5134928B2 (ja) * 2007-11-30 2013-01-30 浜松ホトニクス株式会社 加工対象物研削方法
JP5241525B2 (ja) * 2009-01-09 2013-07-17 浜松ホトニクス株式会社 レーザ加工装置

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WO2008041579A1 (fr) 2008-04-10
US20100006548A1 (en) 2010-01-14
CN101522361A (zh) 2009-09-02
CN101522361B (zh) 2012-01-25
KR101579317B1 (ko) 2015-12-21
US9012805B2 (en) 2015-04-21
EP2070633A4 (en) 2014-04-30
EP2070633A1 (en) 2009-06-17
JP2008087053A (ja) 2008-04-17
EP2070633B1 (en) 2016-01-27
TW200824828A (en) 2008-06-16
TWI424898B (zh) 2014-02-01
KR20090073089A (ko) 2009-07-02

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