JP5552373B2 - レーザ加工方法 - Google Patents
レーザ加工方法 Download PDFInfo
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- JP5552373B2 JP5552373B2 JP2010127045A JP2010127045A JP5552373B2 JP 5552373 B2 JP5552373 B2 JP 5552373B2 JP 2010127045 A JP2010127045 A JP 2010127045A JP 2010127045 A JP2010127045 A JP 2010127045A JP 5552373 B2 JP5552373 B2 JP 5552373B2
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- 238000003672 processing method Methods 0.000 title claims description 19
- 230000000630 rising effect Effects 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 238000012986 modification Methods 0.000 claims description 3
- 230000004048 modification Effects 0.000 claims description 3
- 230000000052 comparative effect Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 8
- 239000000835 fiber Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000001394 metastastic effect Effects 0.000 description 1
- 206010061289 metastatic neoplasm Diseases 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Description
厚さ300μmのシリコン基板を加工対象物として用意し、この加工対象物に対しレーザ光を表面側から照射し、切断予定ラインに沿って改質領域を厚さ方向に3列形成した。これを、レーザ光のパルス波形及びパルスピッチを変えて複数回実施した。そして、改質領域形成後の複数の加工対象物について、分割力を評価した。なお、パルスピッチは、切断予定ラインに沿って隣接する一対の改質スポット間距離を意味する。
次に、レーザ光のパルス波形を、上記実施例Aで記載した実施例1〜3に係る第1〜第3パルス波形O1〜O3の間で変えると共に、パルスエネルギを低PE値である12μJ/pulseとした以外は上記実施例Aと同様にし、改質領域形成後の複数の加工対象物について分割力を評価した。
次に、レーザ光のパルス波形を、上記実施例Aで記載した実施例1〜3に係る第1〜第3パルス波形O1〜O3の間で変えると共に、パルスエネルギを高PE値である36μJ/pulseとした以外は上記実施例Aと同様にし、改質領域形成後の複数の加工対象物について分割力を評価した。
Claims (5)
- 加工対象物にレーザ光を集光させ、前記加工対象物に改質領域を切断予定ラインに沿って形成するレーザ加工方法であって、
半値幅と立上がりから立下がりまでの時間幅とが互いに等しいパルス波形を有する前記レーザ光を前記加工対象物に照射することで、前記切断予定ラインに沿って改質スポットを複数形成し、複数の前記改質スポットによって前記改質領域を形成する改質領域形成工程を含み、
前記改質領域形成工程においては、
前記レーザ光のパルスエネルギが所定値よりも低い第1値の場合、その前半側にピーク値が位置し且つ鋸刃状となるよう構成された第1パルス波形を前記パルス波形として設定すると共に、
前記パルスエネルギが前記所定値よりも高い第2値の場合、その後半側にピーク値が位置し且つ鋸刃状となるよう構成された第2パルス波形を前記パルス波形として設定することを特徴とするレーザ加工方法。 - 前記第1パルス波形は、急峻に立ち上がってピーク値に達した後に徐々に下降し、その後急峻に立ち下がる波形であり、
前記第2パルス波形は、急峻に立ち上がった後に徐々に上昇してピーク値に達し、その後急峻に立ち下がる波形であることを特徴とする請求項1記載のレーザ加工方法。 - 前記改質領域形成工程においては、
前記パルスエネルギが前記所定値の場合、矩形状となるよう構成された第3パルス波形を前記パルス波形として設定することを特徴とする請求項1又は2記載のレーザ加工方法。 - 前記改質領域形成工程においては、
前記加工対象物におけるレーザ光照射面の反対面側に前記改質スポットを形成する場合、前記パルスエネルギを前記第1値とすることを特徴とする請求項1〜3の何れか一項記載のレーザ加工方法。 - 前記改質領域形成工程においては、
前記加工対象物におけるレーザ光照射面の反対面側に前記改質スポットを形成する場合、前記パルスエネルギを前記第2値とすることを特徴とする請求項1〜3の何れか一項記載のレーザ加工方法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010127045A JP5552373B2 (ja) | 2010-06-02 | 2010-06-02 | レーザ加工方法 |
EP11789639.9A EP2578349B1 (en) | 2010-06-02 | 2011-05-20 | Laser processing method |
CN201180027408.2A CN102933347B (zh) | 2010-06-02 | 2011-05-20 | 激光加工方法 |
US13/701,031 US9409256B2 (en) | 2010-06-02 | 2011-05-20 | Laser processing method |
KR1020127021574A KR101934558B1 (ko) | 2010-06-02 | 2011-05-20 | 레이저 가공 방법 |
PCT/JP2011/061674 WO2011152230A1 (ja) | 2010-06-02 | 2011-05-20 | レーザ加工方法 |
TW100119015A TWI515071B (zh) | 2010-06-02 | 2011-05-31 | Laser processing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010127045A JP5552373B2 (ja) | 2010-06-02 | 2010-06-02 | レーザ加工方法 |
Publications (2)
Publication Number | Publication Date |
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JP2011251314A JP2011251314A (ja) | 2011-12-15 |
JP5552373B2 true JP5552373B2 (ja) | 2014-07-16 |
Family
ID=45066609
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010127045A Active JP5552373B2 (ja) | 2010-06-02 | 2010-06-02 | レーザ加工方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9409256B2 (ja) |
EP (1) | EP2578349B1 (ja) |
JP (1) | JP5552373B2 (ja) |
KR (1) | KR101934558B1 (ja) |
CN (1) | CN102933347B (ja) |
TW (1) | TWI515071B (ja) |
WO (1) | WO2011152230A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2465634B1 (en) * | 2009-08-11 | 2021-11-10 | Hamamatsu Photonics K.K. | Laser machining device and laser machining method |
JP2013063454A (ja) * | 2011-09-16 | 2013-04-11 | Hamamatsu Photonics Kk | レーザ加工方法及びレーザ加工装置 |
KR101445829B1 (ko) * | 2012-07-27 | 2014-09-30 | 주식회사 이오테크닉스 | 레이저 가공장치 및 레이저 가공방법 |
JP2016072278A (ja) * | 2014-09-26 | 2016-05-09 | 株式会社ディスコ | ウエーハの加工方法 |
JP7188886B2 (ja) | 2018-01-29 | 2022-12-13 | 浜松ホトニクス株式会社 | 加工装置 |
US11024501B2 (en) | 2018-12-29 | 2021-06-01 | Cree, Inc. | Carrier-assisted method for parting crystalline material along laser damage region |
US10562130B1 (en) | 2018-12-29 | 2020-02-18 | Cree, Inc. | Laser-assisted method for parting crystalline material |
US10576585B1 (en) | 2018-12-29 | 2020-03-03 | Cree, Inc. | Laser-assisted method for parting crystalline material |
US10611052B1 (en) | 2019-05-17 | 2020-04-07 | Cree, Inc. | Silicon carbide wafers with relaxed positive bow and related methods |
JP2024136181A (ja) * | 2023-03-23 | 2024-10-04 | 株式会社東京精密 | レーザ加工方法、レーザ加工装置及びレーザ光源 |
Family Cites Families (22)
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JPH07273387A (ja) * | 1994-03-31 | 1995-10-20 | Fanuc Ltd | 出力波形制御方式 |
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JP4244611B2 (ja) * | 2002-10-22 | 2009-03-25 | パナソニック株式会社 | セラミックグリーンシートの穴加工方法 |
US6998567B2 (en) * | 2003-01-31 | 2006-02-14 | Trimedyne, Inc. | Generation and application of efficient solid-state laser pulse trains |
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CN102317030B (zh) | 2009-04-07 | 2014-08-20 | 浜松光子学株式会社 | 激光加工装置以及激光加工方法 |
-
2010
- 2010-06-02 JP JP2010127045A patent/JP5552373B2/ja active Active
-
2011
- 2011-05-20 WO PCT/JP2011/061674 patent/WO2011152230A1/ja active Application Filing
- 2011-05-20 KR KR1020127021574A patent/KR101934558B1/ko active IP Right Grant
- 2011-05-20 CN CN201180027408.2A patent/CN102933347B/zh active Active
- 2011-05-20 US US13/701,031 patent/US9409256B2/en active Active
- 2011-05-20 EP EP11789639.9A patent/EP2578349B1/en active Active
- 2011-05-31 TW TW100119015A patent/TWI515071B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR20130081202A (ko) | 2013-07-16 |
US9409256B2 (en) | 2016-08-09 |
US20130068739A1 (en) | 2013-03-21 |
EP2578349A4 (en) | 2017-05-31 |
EP2578349B1 (en) | 2019-12-04 |
EP2578349A1 (en) | 2013-04-10 |
TW201210729A (en) | 2012-03-16 |
WO2011152230A1 (ja) | 2011-12-08 |
CN102933347A (zh) | 2013-02-13 |
TWI515071B (zh) | 2016-01-01 |
JP2011251314A (ja) | 2011-12-15 |
KR101934558B1 (ko) | 2019-01-03 |
CN102933347B (zh) | 2015-04-22 |
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