JP4959149B2 - 試料検査装置 - Google Patents

試料検査装置 Download PDF

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Publication number
JP4959149B2
JP4959149B2 JP2005134136A JP2005134136A JP4959149B2 JP 4959149 B2 JP4959149 B2 JP 4959149B2 JP 2005134136 A JP2005134136 A JP 2005134136A JP 2005134136 A JP2005134136 A JP 2005134136A JP 4959149 B2 JP4959149 B2 JP 4959149B2
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JP
Japan
Prior art keywords
focus
sample
focus value
electron beam
point
Prior art date
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Expired - Lifetime
Application number
JP2005134136A
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English (en)
Japanese (ja)
Other versions
JP2006310223A (ja
JP2006310223A5 (enExample
Inventor
利文 金馬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2005134136A priority Critical patent/JP4959149B2/ja
Priority to PCT/JP2006/308843 priority patent/WO2006120917A1/ja
Priority to US11/913,387 priority patent/US7964844B2/en
Priority to KR1020077027719A priority patent/KR101213587B1/ko
Priority to TW095115198A priority patent/TWI390648B/zh
Publication of JP2006310223A publication Critical patent/JP2006310223A/ja
Publication of JP2006310223A5 publication Critical patent/JP2006310223A5/ja
Application granted granted Critical
Publication of JP4959149B2 publication Critical patent/JP4959149B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/21Means for adjusting the focus
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/21Focus adjustment
    • H01J2237/216Automatic focusing methods
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/248Components associated with the control of the tube
    • H01J2237/2482Optical means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26Electron or ion microscopes
    • H01J2237/28Scanning microscopes
    • H01J2237/2813Scanning microscopes characterised by the application
    • H01J2237/2817Pattern inspection

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2005134136A 2005-05-02 2005-05-02 試料検査装置 Expired - Lifetime JP4959149B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2005134136A JP4959149B2 (ja) 2005-05-02 2005-05-02 試料検査装置
PCT/JP2006/308843 WO2006120917A1 (ja) 2005-05-02 2006-04-27 試料検査装置
US11/913,387 US7964844B2 (en) 2005-05-02 2006-04-27 Sample inspection apparatus
KR1020077027719A KR101213587B1 (ko) 2005-05-02 2006-04-27 시료검사장치
TW095115198A TWI390648B (zh) 2005-05-02 2006-04-28 樣本檢查裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005134136A JP4959149B2 (ja) 2005-05-02 2005-05-02 試料検査装置

Publications (3)

Publication Number Publication Date
JP2006310223A JP2006310223A (ja) 2006-11-09
JP2006310223A5 JP2006310223A5 (enExample) 2008-05-29
JP4959149B2 true JP4959149B2 (ja) 2012-06-20

Family

ID=37396426

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005134136A Expired - Lifetime JP4959149B2 (ja) 2005-05-02 2005-05-02 試料検査装置

Country Status (5)

Country Link
US (1) US7964844B2 (enExample)
JP (1) JP4959149B2 (enExample)
KR (1) KR101213587B1 (enExample)
TW (1) TWI390648B (enExample)
WO (1) WO2006120917A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2126955A1 (en) * 2007-01-25 2009-12-02 NFAB Limited Improved particle beam generator
JP2008252070A (ja) * 2007-03-07 2008-10-16 Nuflare Technology Inc 荷電粒子ビームの焦点合わせ方法及び荷電粒子ビームの非点調整方法
JP5243912B2 (ja) * 2008-01-24 2013-07-24 日本電子株式会社 荷電粒子ビーム装置におけるビーム位置較正方法
JP5325802B2 (ja) 2010-01-28 2013-10-23 株式会社日立ハイテクノロジーズ 観察方法および観察装置
US8519353B2 (en) * 2010-12-29 2013-08-27 Varian Semiconductor Equipment Associates, Inc. Method and apparatus for controlling an asymmetric electrostatic lens about a central ray trajectory of an ion beam
JP5331828B2 (ja) * 2011-01-14 2013-10-30 株式会社日立ハイテクノロジーズ 荷電粒子線装置
US8912488B2 (en) * 2012-11-15 2014-12-16 Fei Company Automated sample orientation
US9110039B2 (en) * 2013-07-25 2015-08-18 Kla-Tencor Corporation Auto-focus system and methods for die-to-die inspection
JP6309366B2 (ja) * 2014-06-30 2018-04-11 株式会社ホロン 荷電粒子線装置における高さ測定装置およびオートフォーカス装置
JP7455676B2 (ja) 2020-06-05 2024-03-26 株式会社日立ハイテク 電子顕微鏡および電子顕微鏡のフォーカス調整方法
JP7367215B2 (ja) * 2020-06-08 2023-10-23 株式会社日立ハイテク 荷電粒子線装置、およびそのフォーカス調整方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2542356C2 (de) * 1975-09-19 1977-10-20 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Fokussierung der Objektivlinse eines Korpuskular-Durchstrahlungs-Rastermikroskops und Einrichtung zur selbsttätigen Durchführung des Verfahrens, sowie Anwendung
JPH053013A (ja) * 1991-06-24 1993-01-08 Shimadzu Corp 自動焦点調節装置
JPH07245075A (ja) * 1994-03-04 1995-09-19 Horon:Kk 自動焦点合わせ装置
JPH1048163A (ja) * 1996-08-07 1998-02-20 Shimadzu Corp 表面分析方法およびその装置
JPH11149895A (ja) * 1997-08-11 1999-06-02 Hitachi Ltd 電子線式検査または測定装置およびその方法、高さ検出装置並びに電子線式描画装置
US6107637A (en) * 1997-08-11 2000-08-22 Hitachi, Ltd. Electron beam exposure or system inspection or measurement apparatus and its method and height detection apparatus
JP2000228166A (ja) * 1999-02-05 2000-08-15 Horon:Kk 試料観察装置
JP4610798B2 (ja) * 2001-06-19 2011-01-12 エスアイアイ・ナノテクノロジー株式会社 レーザ欠陥検出機能を備えた走査型電子顕微鏡とそのオートフォーカス方法
US6946656B2 (en) * 2001-07-12 2005-09-20 Hitachi, Ltd. Sample electrification measurement method and charged particle beam apparatus
JP4388270B2 (ja) * 2002-11-18 2009-12-24 株式会社日立ハイテクノロジーズ 表面検査方法及び表面検査装置
TWI345054B (en) * 2003-05-30 2011-07-11 Ebara Corp Specimen inspection device and method, and method for making a semiconductor device using such specimen inspection device and method
WO2007035834A2 (en) * 2005-09-21 2007-03-29 Kla-Tencor Technologies Corporation Methods and systems for creating a recipe for a defect review process

Also Published As

Publication number Publication date
TW200701384A (en) 2007-01-01
JP2006310223A (ja) 2006-11-09
US20090212214A1 (en) 2009-08-27
TWI390648B (zh) 2013-03-21
KR20080011304A (ko) 2008-02-01
WO2006120917A1 (ja) 2006-11-16
KR101213587B1 (ko) 2013-01-18
US7964844B2 (en) 2011-06-21

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