JP4952318B2 - エレクトロルミネッセンス装置の製造方法 - Google Patents

エレクトロルミネッセンス装置の製造方法 Download PDF

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Publication number
JP4952318B2
JP4952318B2 JP2007070901A JP2007070901A JP4952318B2 JP 4952318 B2 JP4952318 B2 JP 4952318B2 JP 2007070901 A JP2007070901 A JP 2007070901A JP 2007070901 A JP2007070901 A JP 2007070901A JP 4952318 B2 JP4952318 B2 JP 4952318B2
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Japan
Prior art keywords
desiccant
layer
substrate
light emitting
organic
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JP2007070901A
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English (en)
Japanese (ja)
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JP2008234921A5 (enExample
JP2008234921A (ja
Inventor
徹 二村
耕造 下神
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
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Seiko Epson Corp
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Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2007070901A priority Critical patent/JP4952318B2/ja
Priority to US12/036,472 priority patent/US8044579B2/en
Publication of JP2008234921A publication Critical patent/JP2008234921A/ja
Publication of JP2008234921A5 publication Critical patent/JP2008234921A5/ja
Application granted granted Critical
Publication of JP4952318B2 publication Critical patent/JP4952318B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2007070901A 2007-03-19 2007-03-19 エレクトロルミネッセンス装置の製造方法 Active JP4952318B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007070901A JP4952318B2 (ja) 2007-03-19 2007-03-19 エレクトロルミネッセンス装置の製造方法
US12/036,472 US8044579B2 (en) 2007-03-19 2008-02-25 Electroluminescent device with liquid-repellent portion and electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007070901A JP4952318B2 (ja) 2007-03-19 2007-03-19 エレクトロルミネッセンス装置の製造方法

Publications (3)

Publication Number Publication Date
JP2008234921A JP2008234921A (ja) 2008-10-02
JP2008234921A5 JP2008234921A5 (enExample) 2010-01-07
JP4952318B2 true JP4952318B2 (ja) 2012-06-13

Family

ID=39773991

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007070901A Active JP4952318B2 (ja) 2007-03-19 2007-03-19 エレクトロルミネッセンス装置の製造方法

Country Status (2)

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US (1) US8044579B2 (enExample)
JP (1) JP4952318B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101107160B1 (ko) 2009-07-10 2012-01-25 삼성모바일디스플레이주식회사 유기 발광 표시 장치 및 그 제조 방법
WO2015097877A1 (ja) * 2013-12-27 2015-07-02 パイオニアＯｌｅｄライティングデバイス株式会社 光装置及び光装置の製造方法
CN105609532B (zh) * 2015-12-21 2019-11-22 上海天马有机发光显示技术有限公司 阵列基板及其制作方法、显示面板
CN105489786B (zh) * 2016-02-29 2018-01-02 上海天马有机发光显示技术有限公司 阵列基板的封装结构及封装方法、显示面板
CN108470854A (zh) * 2018-04-25 2018-08-31 深圳市华星光电技术有限公司 Woled显示面板及其制作方法
CN110854291A (zh) * 2019-10-30 2020-02-28 深圳市华星光电半导体显示技术有限公司 一种显示面板及其制备方法
CN110752318B (zh) * 2019-11-28 2022-12-06 昆山国显光电有限公司 显示面板

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6924594B2 (en) * 2000-10-03 2005-08-02 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
JP2003100449A (ja) 2001-09-26 2003-04-04 Canon Inc 有機エレクトロルミネッセンスパネル
JP3975739B2 (ja) 2001-12-14 2007-09-12 旭硝子株式会社 有機ｅｌディスプレイ用対向基板の製造方法および有機ｅｌディスプレイの製造方法
TWI258317B (en) * 2002-01-25 2006-07-11 Semiconductor Energy Lab A display device and method for manufacturing thereof
JP2003223986A (ja) 2002-01-30 2003-08-08 Toyota Industries Corp 有機ｅｌディスプレイの防湿構造
JP2003228302A (ja) 2002-02-04 2003-08-15 Toshiba Electronic Engineering Corp 表示装置及びその製造方法
JP2003297558A (ja) 2002-04-03 2003-10-17 Seiko Epson Corp エレクトロルミネッセンス装置とその製造方法、電子機器
US7541734B2 (en) * 2003-10-03 2009-06-02 Semiconductor Energy Laboratory Co., Ltd. Light emitting device having a layer with a metal oxide and a benzoxazole derivative
JP2005268202A (ja) * 2004-02-16 2005-09-29 Seiko Epson Corp 有機エレクトロルミネッセンス装置、有機エレクトロルミネッセンス装置の製造方法、及び電子機器
JP2006164708A (ja) * 2004-12-06 2006-06-22 Semiconductor Energy Lab Co Ltd 電子機器および発光装置
JP2006222071A (ja) * 2005-01-17 2006-08-24 Seiko Epson Corp 発光装置、発光装置の製造方法、及び電子機器
JP4870933B2 (ja) * 2005-03-04 2012-02-08 東北パイオニア株式会社 自発光パネルおよび自発光パネルの製造方法
JP2006332019A (ja) * 2005-04-28 2006-12-07 Seiko Epson Corp 有機エレクトロルミネッセンス装置、及び有機エレクトロルミネッセンス装置の製造方法
US20060290276A1 (en) * 2005-06-22 2006-12-28 Eastman Kodak Company OLED device having spacers
JP4600254B2 (ja) * 2005-11-22 2010-12-15 セイコーエプソン株式会社 発光装置および電子機器
JP2008218004A (ja) * 2007-02-28 2008-09-18 Hitachi Displays Ltd 有機ｅｌ表示装置

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Publication number Publication date
US8044579B2 (en) 2011-10-25
US20080231182A1 (en) 2008-09-25
JP2008234921A (ja) 2008-10-02

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