JP4952083B2 - 圧電発振器 - Google Patents

圧電発振器 Download PDF

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Publication number
JP4952083B2
JP4952083B2 JP2006170996A JP2006170996A JP4952083B2 JP 4952083 B2 JP4952083 B2 JP 4952083B2 JP 2006170996 A JP2006170996 A JP 2006170996A JP 2006170996 A JP2006170996 A JP 2006170996A JP 4952083 B2 JP4952083 B2 JP 4952083B2
Authority
JP
Japan
Prior art keywords
lead
oscillation circuit
piezoelectric
circuit element
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006170996A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008005087A (ja
JP2008005087A5 (enExample
Inventor
誠一 千葉
裕吾 小山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2006170996A priority Critical patent/JP4952083B2/ja
Publication of JP2008005087A publication Critical patent/JP2008005087A/ja
Publication of JP2008005087A5 publication Critical patent/JP2008005087A5/ja
Application granted granted Critical
Publication of JP4952083B2 publication Critical patent/JP4952083B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Oscillators With Electromechanical Resonators (AREA)
JP2006170996A 2006-06-21 2006-06-21 圧電発振器 Expired - Fee Related JP4952083B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006170996A JP4952083B2 (ja) 2006-06-21 2006-06-21 圧電発振器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006170996A JP4952083B2 (ja) 2006-06-21 2006-06-21 圧電発振器

Publications (3)

Publication Number Publication Date
JP2008005087A JP2008005087A (ja) 2008-01-10
JP2008005087A5 JP2008005087A5 (enExample) 2009-07-09
JP4952083B2 true JP4952083B2 (ja) 2012-06-13

Family

ID=39009141

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006170996A Expired - Fee Related JP4952083B2 (ja) 2006-06-21 2006-06-21 圧電発振器

Country Status (1)

Country Link
JP (1) JP4952083B2 (enExample)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003031752A (ja) * 2001-07-11 2003-01-31 Sony Corp リードフレーム、半導体装置、およびその製造方法
JP3918794B2 (ja) * 2002-12-10 2007-05-23 セイコーエプソン株式会社 圧電発振器およびその製造方法並びに電子機器

Also Published As

Publication number Publication date
JP2008005087A (ja) 2008-01-10

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