JP4941554B2 - フィルム状回路接続材料及び回路部材の接続構造 - Google Patents

フィルム状回路接続材料及び回路部材の接続構造 Download PDF

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JP4941554B2
JP4941554B2 JP2009514131A JP2009514131A JP4941554B2 JP 4941554 B2 JP4941554 B2 JP 4941554B2 JP 2009514131 A JP2009514131 A JP 2009514131A JP 2009514131 A JP2009514131 A JP 2009514131A JP 4941554 B2 JP4941554 B2 JP 4941554B2
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Prior art keywords
circuit
film
connection
circuit member
compound
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Japanese (ja)
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JPWO2008139996A1 (ja
Inventor
日臣 望月
征宏 有福
和良 小島
宏治 小林
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Showa Denko Materials Co Ltd
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
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JP2009514131A 2007-05-09 2008-05-07 フィルム状回路接続材料及び回路部材の接続構造 Expired - Fee Related JP4941554B2 (ja)

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KR20130042017A (ko) * 2010-07-26 2013-04-25 히타치가세이가부시끼가이샤 접착제 조성물, 접속 구조체, 및 접속 구조체의 제조 방법
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JP2015098575A (ja) * 2013-10-16 2015-05-28 日立化成株式会社 接着剤組成物及び接続体
JP6417675B2 (ja) * 2014-03-03 2018-11-07 日立化成株式会社 接着剤組成物及び接続体
KR102397238B1 (ko) * 2015-06-10 2022-05-11 쇼와덴코머티리얼즈가부시끼가이샤 접착제 조성물 및 접속체
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CN107613675A (zh) * 2017-08-10 2018-01-19 维沃移动通信有限公司 一种柔性电路板的压合方法、集成电路板及移动终端
CN107946677A (zh) * 2017-12-15 2018-04-20 安徽中科中涣防务装备技术有限公司 一种安全锂电池芯阻燃结构
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TWI378751B (zh) 2012-12-01
CN101675715B (zh) 2011-06-08
JPWO2008139996A1 (ja) 2010-08-05
TWI378745B (zh) 2012-12-01
KR20090086465A (ko) 2009-08-12
CN102199404B (zh) 2013-12-04
TW201130940A (en) 2011-09-16
CN101982515A (zh) 2011-03-02
WO2008139996A1 (ja) 2008-11-20
CN101982515B (zh) 2013-07-03
TW200913808A (en) 2009-03-16
CN101675715A (zh) 2010-03-17
KR101100507B1 (ko) 2011-12-29

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