WO2008139996A1 - フィルム状回路接続材料及び回路部材の接続構造 - Google Patents

フィルム状回路接続材料及び回路部材の接続構造 Download PDF

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Publication number
WO2008139996A1
WO2008139996A1 PCT/JP2008/058489 JP2008058489W WO2008139996A1 WO 2008139996 A1 WO2008139996 A1 WO 2008139996A1 JP 2008058489 W JP2008058489 W JP 2008058489W WO 2008139996 A1 WO2008139996 A1 WO 2008139996A1
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WIPO (PCT)
Prior art keywords
circuit
film
connecting material
connection structure
circuit connecting
Prior art date
Application number
PCT/JP2008/058489
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English (en)
French (fr)
Japanese (ja)
Inventor
Nichiomi Mochizuki
Motohiro Arifuku
Kazuyoshi Kojima
Kouji Kobayashi
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to KR1020097013931A priority Critical patent/KR101100507B1/ko
Priority to CN2008800141483A priority patent/CN101675715B/zh
Priority to JP2009514131A priority patent/JP4941554B2/ja
Publication of WO2008139996A1 publication Critical patent/WO2008139996A1/ja

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    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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    • C08G18/755—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group and at least one isocyanate or isothiocyanate group linked to a secondary carbon atom of the cycloaliphatic ring, e.g. isophorone diisocyanate
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    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
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    • C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
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PCT/JP2008/058489 2007-05-09 2008-05-07 フィルム状回路接続材料及び回路部材の接続構造 WO2008139996A1 (ja)

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KR1020097013931A KR101100507B1 (ko) 2007-05-09 2008-05-07 필름상 회로 접속 재료 및 회로 부재의 접속 구조
CN2008800141483A CN101675715B (zh) 2007-05-09 2008-05-07 膜状电路连接材料及电路部件的连接结构
JP2009514131A JP4941554B2 (ja) 2007-05-09 2008-05-07 フィルム状回路接続材料及び回路部材の接続構造

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JP2007124436 2007-05-09

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012014562A1 (ja) * 2010-07-26 2012-02-02 日立化成工業株式会社 接着剤組成物、接続構造体、接続構造体の製造方法及び接着剤組成物の応用
WO2012014563A1 (ja) * 2010-07-26 2012-02-02 日立化成工業株式会社 接着剤組成物、接続構造体、接続構造体の製造方法及び接着剤組成物の応用
CN104559898A (zh) * 2013-10-16 2015-04-29 日立化成株式会社 粘接剂组合物和连接体
CN104559902A (zh) * 2013-10-09 2015-04-29 日立化成株式会社 电路连接材料、电路构件的连接结构体、和电路构件的连接结构体的制造方法
JP2015166406A (ja) * 2014-03-03 2015-09-24 日立化成株式会社 接着剤組成物及び接続体
JPWO2016199252A1 (ja) * 2015-06-10 2018-03-29 日立化成株式会社 接着剤組成物及び接続体
JP2018184607A (ja) * 2018-06-27 2018-11-22 日立化成株式会社 接着剤組成物及び接続体
JP2020521852A (ja) * 2017-05-31 2020-07-27 ダウ グローバル テクノロジーズ エルエルシー 溶剤系接着剤組成物

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9412717B2 (en) * 2011-11-04 2016-08-09 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and methods for molded underfills in flip chip packaging
KR102608218B1 (ko) * 2015-11-04 2023-11-30 가부시끼가이샤 레조낙 접착제 조성물 및 구조체
CN107613675A (zh) * 2017-08-10 2018-01-19 维沃移动通信有限公司 一种柔性电路板的压合方法、集成电路板及移动终端
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DE102018206632A1 (de) 2018-04-27 2019-10-31 Tesa Se Latent reaktiver Klebefilm

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01103678A (ja) * 1987-10-15 1989-04-20 Sunstar Giken Kk ポリウレタン接着剤
JPH0790236A (ja) * 1993-09-24 1995-04-04 Soken Kagaku Kk 異方導電性接着剤
WO2007046190A1 (ja) * 2005-10-18 2007-04-26 Hitachi Chemical Company, Ltd. 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH674518A5 (zh) * 1987-09-09 1990-06-15 Inventa Ag
JP2002204052A (ja) * 2000-12-28 2002-07-19 Hitachi Chem Co Ltd 回路接続材料及びそれを用いた回路端子の接続方法、接続構造
JP2003064331A (ja) * 2001-08-30 2003-03-05 Hitachi Chem Co Ltd 熱架橋型回路接続材料及びそれを用いた回路板の製造方法
JP4649815B2 (ja) * 2002-03-27 2011-03-16 日立化成工業株式会社 回路接続用接着剤組成物及びそれを用いた回路接続構造体
JP3858740B2 (ja) * 2002-03-27 2006-12-20 日立化成工業株式会社 回路接続用接着剤組成物及びそれを用いた回路接続構造体
TWI276117B (en) * 2003-07-04 2007-03-11 Natoco Co Ltd Coated conductive particle, conductive material, anisotropic conductive adhesive and anisotropic conductive junction structure
JP2005255706A (ja) * 2004-03-09 2005-09-22 Lintec Corp 粘接着剤組成物、光ディスク製造用シートおよび光ディスク
JP2005347273A (ja) * 2005-06-06 2005-12-15 Hitachi Chem Co Ltd 熱架橋型回路接続材料及びそれを用いた回路板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01103678A (ja) * 1987-10-15 1989-04-20 Sunstar Giken Kk ポリウレタン接着剤
JPH0790236A (ja) * 1993-09-24 1995-04-04 Soken Kagaku Kk 異方導電性接着剤
WO2007046190A1 (ja) * 2005-10-18 2007-04-26 Hitachi Chemical Company, Ltd. 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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CN105860910A (zh) * 2010-07-26 2016-08-17 日立化成株式会社 粘接剂组合物、连接结构体、连接结构体的制造方法以及粘接剂组合物的应用
CN105176471A (zh) * 2010-07-26 2015-12-23 日立化成工业株式会社 粘接剂组合物、连接结构体、连接结构体的制造方法、以及粘接剂组合物的应用
CN102449095A (zh) * 2010-07-26 2012-05-09 日立化成工业株式会社 粘接剂组合物、连接结构体、连接结构体的制造方法以及粘接剂组合物的应用
CN103589384A (zh) * 2010-07-26 2014-02-19 日立化成工业株式会社 粘接剂组合物、连接结构体、连接结构体的制造方法、以及粘接剂组合物的应用
JP5454578B2 (ja) * 2010-07-26 2014-03-26 日立化成株式会社 接着剤組成物、接続構造体、接続構造体の製造方法及び接着剤組成物の応用
WO2012014563A1 (ja) * 2010-07-26 2012-02-02 日立化成工業株式会社 接着剤組成物、接続構造体、接続構造体の製造方法及び接着剤組成物の応用
WO2012014562A1 (ja) * 2010-07-26 2012-02-02 日立化成工業株式会社 接着剤組成物、接続構造体、接続構造体の製造方法及び接着剤組成物の応用
CN102449096A (zh) * 2010-07-26 2012-05-09 日立化成工业株式会社 粘接剂组合物、连接结构体、连接结构体的制造方法、以及粘接剂组合物的应用
JP5855459B2 (ja) * 2010-07-26 2016-02-09 日立化成株式会社 回路部材の接続構造体
CN103589384B (zh) * 2010-07-26 2016-03-02 日立化成株式会社 粘接剂组合物、连接结构体、连接结构体的制造方法、以及粘接剂组合物的应用
CN104559902A (zh) * 2013-10-09 2015-04-29 日立化成株式会社 电路连接材料、电路构件的连接结构体、和电路构件的连接结构体的制造方法
CN104559898A (zh) * 2013-10-16 2015-04-29 日立化成株式会社 粘接剂组合物和连接体
JP2015166406A (ja) * 2014-03-03 2015-09-24 日立化成株式会社 接着剤組成物及び接続体
JPWO2016199252A1 (ja) * 2015-06-10 2018-03-29 日立化成株式会社 接着剤組成物及び接続体
US11773303B2 (en) 2017-05-31 2023-10-03 Dow Global Technologies Llc Solvent-based adhesive compositions
JP2020521852A (ja) * 2017-05-31 2020-07-27 ダウ グローバル テクノロジーズ エルエルシー 溶剤系接着剤組成物
JP7149292B2 (ja) 2017-05-31 2022-10-06 ダウ グローバル テクノロジーズ エルエルシー 溶剤系接着剤組成物
JP2018184607A (ja) * 2018-06-27 2018-11-22 日立化成株式会社 接着剤組成物及び接続体

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TWI378751B (zh) 2012-12-01
CN101675715B (zh) 2011-06-08
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TWI378745B (zh) 2012-12-01
KR20090086465A (ko) 2009-08-12
JP4941554B2 (ja) 2012-05-30
CN102199404B (zh) 2013-12-04
TW201130940A (en) 2011-09-16
CN101982515A (zh) 2011-03-02
CN101982515B (zh) 2013-07-03
TW200913808A (en) 2009-03-16
CN101675715A (zh) 2010-03-17
KR101100507B1 (ko) 2011-12-29

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