JP4940669B2 - 半導体素子搭載用の支持体 - Google Patents

半導体素子搭載用の支持体 Download PDF

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Publication number
JP4940669B2
JP4940669B2 JP2006015988A JP2006015988A JP4940669B2 JP 4940669 B2 JP4940669 B2 JP 4940669B2 JP 2006015988 A JP2006015988 A JP 2006015988A JP 2006015988 A JP2006015988 A JP 2006015988A JP 4940669 B2 JP4940669 B2 JP 4940669B2
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Japan
Prior art keywords
support
semiconductor element
notch
back surface
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2006015988A
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English (en)
Japanese (ja)
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JP2007201041A5 (enrdf_load_stackoverflow
JP2007201041A (ja
Inventor
拓也 乃一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2006015988A priority Critical patent/JP4940669B2/ja
Publication of JP2007201041A publication Critical patent/JP2007201041A/ja
Publication of JP2007201041A5 publication Critical patent/JP2007201041A5/ja
Application granted granted Critical
Publication of JP4940669B2 publication Critical patent/JP4940669B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

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  • Led Device Packages (AREA)
JP2006015988A 2006-01-25 2006-01-25 半導体素子搭載用の支持体 Active JP4940669B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006015988A JP4940669B2 (ja) 2006-01-25 2006-01-25 半導体素子搭載用の支持体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006015988A JP4940669B2 (ja) 2006-01-25 2006-01-25 半導体素子搭載用の支持体

Publications (3)

Publication Number Publication Date
JP2007201041A JP2007201041A (ja) 2007-08-09
JP2007201041A5 JP2007201041A5 (enrdf_load_stackoverflow) 2009-01-08
JP4940669B2 true JP4940669B2 (ja) 2012-05-30

Family

ID=38455343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006015988A Active JP4940669B2 (ja) 2006-01-25 2006-01-25 半導体素子搭載用の支持体

Country Status (1)

Country Link
JP (1) JP4940669B2 (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5167977B2 (ja) * 2007-09-06 2013-03-21 日亜化学工業株式会社 半導体装置
JP5656247B2 (ja) * 2010-10-05 2015-01-21 シチズン電子株式会社 半導体発光装置及び半導体発光装置の組み込み構造
JP6015052B2 (ja) * 2011-10-13 2016-10-26 日亜化学工業株式会社 半導体装置
JP6829687B2 (ja) * 2015-08-10 2021-02-10 ヌヴォトンテクノロジージャパン株式会社 発光装置
JP6668656B2 (ja) * 2015-09-28 2020-03-18 日亜化学工業株式会社 パッケージ、発光装置、発光モジュール、及び、パッケージの製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3286917B2 (ja) * 1999-05-06 2002-05-27 株式会社村田製作所 電子部品用パッケージおよび電子部品
JP2001203554A (ja) * 2000-01-21 2001-07-27 Murata Mfg Co Ltd 圧電共振部品およびその製造方法
JP4068367B2 (ja) * 2002-03-08 2008-03-26 シチズンホールディングス株式会社 圧電デバイス用集合基板、圧電デバイス及びその製造方法
JP3864417B2 (ja) * 2003-09-29 2006-12-27 株式会社大真空 電子部品用パッケージ
JP4670251B2 (ja) * 2004-04-13 2011-04-13 日亜化学工業株式会社 発光装置

Also Published As

Publication number Publication date
JP2007201041A (ja) 2007-08-09

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