JP4940669B2 - Support for mounting semiconductor elements - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a support for mounting a semiconductor element capable of reducing cracks of a solder fillet. <P>SOLUTION: A support 100 for mounting a semiconductor element comprises a metal member; and insulating members 104a, 104b, and 104c, where the metal member is arranged, and comprises corners 102a, 102b, 102c, and 102d consisting of a main surface on which a semiconductor element is mounted, a rear surface on the side opposite to the main surface, and side surfaces. The support 100 comprises a notch 101b, provided by partially cutting the insulating member 104a from the side surface to the rear surface between the adjoining corners. The notch 101b is preferably a rectangular solid, having a major axis in the lengthwise direction of the side surface of the support 100. <P>COPYRIGHT: (C)2007,JPO&amp;INPIT

Description

  The present invention provides a support for mounting a light emitting element such as a light emitting diode or a laser diode, particularly when a light emitting device mounted with a light emitting element is soldered to a wiring board, reliability is ensured even when used for a long time. The present invention relates to a support for mounting a semiconductor element that does not decrease.

  In recent years, semiconductor light emitting devices such as high output light emitting diodes (LEDs) and laser diodes (LDs) have been developed. Such a semiconductor light emitting element is mounted on a support provided with a conductor wiring to form a light emitting device. Furthermore, the light emitting device is electrically and mechanically connected to the mounting substrate by soldering the conductor wiring of the support to the conductor wiring applied to the mounting substrate.

  Hereinafter, a conventional light emitting device will be described in detail. For example, a light emitting device disclosed in Japanese Patent Application Laid-Open No. 2004-281994 includes a light emitting diode chip and a package that is a support body having a recess for arranging the light emitting diode chip. Here, the package is provided with conductor wiring on the bottom surface of the recess, and the electrodes of the light-emitting diode chip are electrically connected via conductive wires.

  As the output of light-emitting elements such as light-emitting diodes increases, a package made mainly of ceramics having excellent heat resistance and light resistance is preferably used as the support. The ceramic package has a substantially rectangular parallelepiped shape, and has cutout portions at four corners when viewed from the opening direction of the recess. Conductor wiring that is electrically connected to the conductor wiring exposed at the bottom surface of the recess is disposed on the wall surface of the notch. A package made of such a ceramic material is divided into individual pieces for each package by dividing a ceramic substrate having a through-hole penetrating in a cylindrical shape in the thickness direction along a separation groove including the through-hole. It has been Therefore, the cutouts at the four corners of the ceramic package are formed by arcuate inner wall surfaces obtained by dividing the cylindrical inner wall surface of the through hole when the ceramic substrate is separated into pieces.

  In a light emitting device having such a package, the conductor wiring exposed at the cutouts at the four corners of the package, the conductor wiring provided on the back surface of the package, and the conductor wiring provided on the mounting substrate of the light emitting device are soldered. Attached. As a result, the light emitting device and the mounting substrate are electrically and mechanically connected. At this time, the solder has a shape called a fillet in which part of the solder crawls up the wall surface of the notch and spreads toward the mounting substrate.

JP 2004-281994 A.

  However, the shape of the fillet that crawls up the arc-shaped wall surface of the notch described above becomes thinner and taper away from the mounting substrate. In particular, the notches provided at the four corners of the support need to be provided as small as possible from the viewpoints of downsizing the light emitting device and securing a wider light emitting surface. Therefore, the shape of the fillet is further thin and must be tapered. Such a fillet is a tapered portion, and may receive a stress due to a difference in thermal expansion coefficient between the mounting substrate and the support and cause damage such as a crack. If such cracks are left unattended, electrical and mechanical connection failures between the light emitting device and the mounting substrate will occur, so the reliability of the light emitting device used in an environment that is prone to vibration for a long time will be increased. It becomes a factor to reduce.

  Therefore, an object of the present invention is to provide a support for mounting a semiconductor element that can reduce cracks in a solder fillet when soldered to a mounting substrate.

  In order to achieve the above object, a support for mounting a semiconductor element according to the present invention includes a metal member and an insulating member on which the metal member is arranged, and a main surface on which the semiconductor element is mounted. And a support for mounting a semiconductor element having a back surface opposite to the main surface and a corner provided by a side surface, the support being formed from the side surface to the back surface of the insulating member. A cutout portion provided by cutting out a part of the cutout portion, the cutout portion being provided between two corner portions adjacent to each other among the plurality of corner portions provided by the side surface of the support; It is characterized by being.

  It is preferable that the notch is opened in the region surrounded by at least three points of the intersection of the diagonal line in the outer shape and the intersection of the corner part and the diagonal line with respect to the back surface or the side surface.

  The general shape of the notch is preferably a rectangular parallelepiped having a long axis along the longitudinal direction of the side surface of the support.

  It is preferable that a part of the metal member disposed on the back surface of the support is disposed so as to extend to a part of the wall surface of the notch.

  It is preferable that the metal member has a part extending on the wall surface of the notch part and a part arranged at a distance from the outer edge of the support when viewed from the back side.

  The metal member has a first part where the semiconductor element is disposed on the main surface, a second part electrically connected to the first part and extended on the back surface of the support, A third portion insulated from the first portion and the second portion and partially extended on the back surface of the support, and on the back surface of the support, the second portion The area of the part is larger than the area of the third part, and the capacity of the notch provided on the second part side is preferably smaller than the capacity of the notch provided on the third part side. .

  The bottom surface of the notch is preferably an exposed surface of the insulating member when viewed from the back surface of the support.

  The corner portion of the support preferably has a recess in which the insulating member is exposed on the inner wall surface.

  The insulating member is made of ceramics, and the outermost surface of the metal member is preferably silver or gold.

  INDUSTRIAL APPLICABILITY The present invention can provide a highly reliable support for mounting a semiconductor element in which cracks in a solder fillet are reduced when soldered to a mounting substrate.

  The best mode for carrying out the present invention will be described below with reference to the drawings. However, the form shown below exemplifies a support for mounting a semiconductor element to embody the technical idea of the present invention, and the present invention limits the support for mounting a semiconductor element to the following. is not.

  Further, the present specification by no means specifies the members shown in the claims to the members of the embodiments. The dimensions, materials, shapes, relative arrangements, and the like of the components described in the embodiments are not intended to limit the scope of the present invention only to the description unless otherwise specified. It is just an example. Note that the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of explanation. Further, in the following description, the same name and reference sign indicate the same or the same members, and detailed description will be omitted as appropriate. Furthermore, each element constituting the present invention may be configured such that a plurality of elements are constituted by the same member and the plurality of elements are shared by one member, and conversely, the function of one member is constituted by a plurality of members. It can also be realized by sharing.

  A metal member and an insulating member on which the metal member is disposed, and a corner provided by a main surface on which a semiconductor element is mounted, a back surface opposite to the main surface, and side surfaces adjacent to each other In order to prevent the fillet from being damaged when the support is soldered to the mounting substrate, the inventor has made various studies. As a result, the support for mounting a semiconductor element has a notch portion in which a part of the insulating member is cut out from the side surface to a part of the back surface, and two notched corner portions are adjacent to each other. The problem was solved by having it in between. Hereinafter, the support of this embodiment will be described in detail with reference to the drawings.

  FIG. 1 is a perspective view seen from a direction in which the main surface of the support in this embodiment can be visually recognized. FIG. 2 is a perspective view seen from the direction in which the back surface of the support of this embodiment can be visually recognized. FIG. 3 is a side view of the support of this embodiment. FIG. 4 is a top view of the support according to this embodiment. Furthermore, FIG. 5 is a rear view of the support of this embodiment.

  The support in this embodiment includes a metal member and an insulating member on which the metal member is disposed. The metal member is used as a conductor wiring connected to the electrode of the mounted semiconductor element or as a reflection wall that reflects light from the light emitting element. The insulating member is for fixing a semiconductor element or a metal member, and is also a member for insulating and separating the conductor wiring. Furthermore, the support body of this embodiment has a main surface having a mounting portion on which a semiconductor element is mounted, a back surface provided on the opposite side facing the main surface, and a corner portion provided by adjacent side surfaces. A support for mounting a semiconductor element. The back surface of the support is a surface opposite to the mounting surface on which the semiconductor element is mounted, and can be a mounting surface when a semiconductor device using the support of this embodiment is arranged on a mounting substrate.

  With respect to such a support for mounting a semiconductor element, when the support has a rectangular parallelepiped shape, the fillet formed at a corner portion far from the center of the support is easily damaged by stress. Has been found by those.

  Therefore, the notch portion in the support body of the present embodiment is provided in a portion where the distance from the center portion is smaller than the corner portion of the support body. That is, the notch part of this embodiment is provided between two corners adjacent to each other when viewed from the back or side of the support, among the plurality of corners provided by the adjacent side surfaces of the support. . More specifically, the notch portion of the present embodiment has a portion including a ridge line formed by the back surface and the side surface of the support body between two adjacent corner portions from a part of the back surface to a part of the side surface. Cut out to drown. As a result, when soldering with the back surface of the support facing the mounting substrate, fillets can be formed by avoiding portions that are susceptible to stress among the respective portions of the support, thereby providing a highly reliable support. be able to. Furthermore, it is preferable that a notch part is formed in the center of the site | part containing the said ridgeline. This is because the stress applied to the fillet formed in the notch can be uniformly dispersed, and damage to the fillet due to the concentration of the stress on a specific part can be suppressed.

  By the way, when the appearance of the support is a rectangular parallelepiped like the conventional support, the shape of the fillet formed at the corner that is far from the center of the support has a large inclination angle with respect to the mounting substrate. It has been found by the present inventor that they are susceptible to stress damage. That is, according to the study of the present inventor, it has been found that when the maximum inclination angle of the outermost surface of the fillet formed on the support is 45 degrees or more, the frequency of occurrence of damage to the fillet increases.

  Therefore, if the angle between the mounting substrate on which the support is disposed or the back surface of the support and an arbitrary tangent plane on the outermost surface of the fillet is θ, the shape of the notch portion has a maximum angle θ of 45 degrees or less. It is preferable to be formed so that Further, with respect to the support of this embodiment, the shape and size of the notch portion of the support are set so that the maximum inclination angle of the outermost surface of the fillet with respect to the mounting substrate is 45 degrees or less, and the amount of solder that forms the fillet Is preferably adjusted to correspond to such a notch.

  The notch portion of the support is in the region surrounded by the intersection of the diagonal line of the outer shape and at least three of the intersection points of the corner part and the diagonal line on the back surface or the side surface of the support body. Is preferably opened. For example, as shown in FIGS. 4 and 5, when the back and side shapes of the support are rectangular in shape, the notches are rectangular vertices with respect to the sides of the support as shown in FIG. The intersection of two diagonal lines X and Y drawn from the corner, the intersection of the corner 102a and the diagonal X, and the intersection of the corner 102b adjacent to the corner 102a and the diagonal Y are surrounded by three points. It is preferable that the opening is made in a region having a triangular outer shape. That is, the opening shape of the notch portion on the back surface or the side surface of the support body is a shape that fits inside the triangle formed on the back surface side of the support body. For example, the opening shape of the notch can be a rectangle that fits inside a triangle. Thereby, a fillet can be formed avoiding the site | part which is easy to receive stress among the outer walls of the support body soldered to the mounting substrate. In particular, the shape of such a notch can be easily designed on the support.

  Furthermore, it is preferable that the opening area in the side surface or the back surface of the notch is 1/9 or less of the entire area of the side surface or the back surface. Thereby, the shape of a notch part can be easily designed to a support body.

  It is preferable that the shape of the notch part of a support body is a rectangular parallelepiped which has the long axis along the longitudinal direction of the external shape of the side surface of a support body. Thereby, the height of the fillet from the mounting substrate is limited, the fillet extended along the longitudinal direction of the side surface of the support body can be formed, and damage to the fillet can be suppressed. Furthermore, it is preferable that the ridge line and the apex portion forming the outer shape of the cutout portion of the rectangular parallelepiped are chamfered. By chamfering, damage to the fillet can be more effectively prevented as compared with a shape in which those portions are angular.

  It is preferable that a part of the metal member disposed on the back surface of the support body is disposed so as to extend from the back surface of the support body to a part of the wall surface of the notch. Accordingly, when the support is soldered to the mounting substrate, the solder spreads along the metal member arranged from the back surface of the support to the cutout portion. Therefore, it is possible to easily form a fillet over the back surface and the cutout portion of the support. In addition, it is preferable that the insulating member forming the support body is exposed on the bottom surface of the notch portion when viewed from the back surface side of the support body. Since the bottom surface of the notch is an exposed surface of the insulating member, it is possible to suppress the solder from creeping up from the insulating member forming the bottom surface. Therefore, when the support is soldered to the mounting substrate, the height of the fillet from the mounting substrate can be limited, and damage to the fillet can be reduced as compared with the conventional case. Further, among the wall surfaces forming the notch, the bottom surface is the exposed surface of the insulating member, and the other wall surface is covered with a metal member, so that when the support is soldered to the mounting substrate, the fillet Is formed quickly. Therefore, the workability of the soldering work can be improved.

  Furthermore, the metal member arranged on the support body, the part extending on the wall surface of the notch part, the part arranged with a space from the outer edge of the support member as viewed from the direction of the back surface of the support body, It is preferable to have. As a result, it is possible to suppress the solder from creeping in the direction of the other side surface where the notch is not opened, to guide the solder to the direction where the notch is opened, and to easily form a fillet at the notch. .

  For the purpose of improving heat dissipation from the semiconductor element, the metal member on which the semiconductor element is mounted extends to the back surface (mounting surface) of the support body continuously with the metal member, and is arranged in a relatively large area. May be. On the other hand, the metal member insulated from the metal member having the mounting portion of the semiconductor element is arranged to extend to the back surface of the support body with a relatively small area. Here, when the amount of solder for soldering the support to the mounting substrate is the same, considering that the solder spreads on the metal member widely arranged on the back surface of the support, the capacity of the notch is It is preferable to make it smaller than the capacity of the notch. Details will be described below.

  As shown in FIGS. 2, 4, and 5, the support in this embodiment is provided with a metal member as a conductor wiring. That is, the metal member disposed on the support includes a first portion 201a where the semiconductor element 401 is disposed on the main surface side of the support, and a back surface of the support that is electrically connected to the first portion 201a. And a second portion 201b (main surface side) and 202b (back side) insulated from the first portion 201a and the second portion 201b. Further, the support is provided with notches 101a and 101b on the second part 201b side and the third part 202b side, respectively. At this time, the area of the second part 201b extending on the back surface of the support is larger than the area of the third part 202b extending on the back surface of the support and on the second part 201b side. The capacity of the provided notch 101a is preferably smaller than the capacity of the notch 101b provided on the third portion 202b side.

  Thereby, the stress concerning the whole solder can be placed on the back surface of the support body to be uniform, and the stress concentration on the fillet in a specific direction can be suppressed. Therefore, it can be set as the support body by which the damage of the fillet was suppressed.

  The corner of the support is preferably a recess formed by the inner wall surface from which the insulating member forming the support is exposed. That is, it is preferable that the corner of the support is a recess, and the insulating wall forming the support is exposed on the inner wall surface of the recess without being covered with the metal member. As a result, it is possible to suppress the solder from creeping up to the corners of the support and to fill the notches with the fillets.

  In addition, by using a support having such a recess at the corner of the support, the support can be easily separated into individual supports from the substrate, which is an aggregate of the support, and the support can be mass-produced. . For example, when forming a support using ceramics, which will be described later, as a material for the insulating member, the recesses where the insulating member is exposed at the corners of the support are provided on the ceramic substrate before being separated into individual packages. The through hole has a shape formed by a circular arc surface divided. Since the insulating member is exposed in the concave portions formed in the corners of the support, it is easy to form the support. That is, compared to the case where the metal member is arranged on the inner wall surface of the through hole by using the slit including the through hole as a dividing groove without arranging the metal member on the inner wall surface of the through hole as in this embodiment. Thus, the ceramic substrate can be easily separated.

  The insulating member for forming the support body is mainly made of ceramics, and the outermost surface of the metal member disposed on the insulating member is preferably silver. By using ceramics as the material for the insulating member, a support having high light resistance can be obtained. Moreover, when a semiconductor element is a light emitting element, it can be set as a support body with high light extraction efficiency by making the outermost surface of a metal member into silver. Hereinafter, each structure of this form is explained in full detail.

(Support)
The support of this embodiment has a main surface on which a semiconductor element is mounted and a back surface provided on the opposite side of the main surface, and metal members for light reflection and wiring are arranged on the main surface and the back surface. It has been done. Such a support can be formed by disposing a metal member on the insulating member. For example, the support in this embodiment can be a package in which a lead frame mainly made of aluminum or iron-containing copper is insert-molded in a resin.

  The insulating member in this embodiment is a member for arranging a metal member and forming a support. Examples of the material for the insulating member include BT resin, glass epoxy resin, ceramics, and glass. The notch part in this embodiment can be formed integrally with the molding of the support body by providing a shape corresponding to the notch part in the mold for molding the insulating member.

  The support of this embodiment can be made a highly heat-resistant support by using ceramics as a material for the insulating member. The ceramic is preferably, for example, alumina, aluminum nitride, mullite, silicon carbide, or silicon nitride. Specifically, 90 to 96% by weight of the raw material powder is alumina, and 4 to 10% by weight of viscosity, talc, magnesia, calcia, silica and the like are added as sintering aids and sintered in a temperature range of 1500 to 1700 ° C. 40-60% by weight of the sintered ceramics and raw material powder is alumina, and 60-40% by weight of borosilicate glass, cordierite, forsterite, mullite, etc. are added as a sintering aid in the temperature range of 800-1200 ° C. For example, a sintered ceramic substrate may be used. By using alumina as the ceramic material, when the ceramic substrate is separated into individual pieces, it is possible to obtain a support with few cracks and cracks on the dividing surface. Further, by using aluminum nitride as a ceramic material, a support having high heat dissipation and high flatness of a mounting surface on which a semiconductor element is disposed can be obtained. Since the flatness of the mounting surface is high, the mounting accuracy of the semiconductor element can be improved.

  A ceramic green sheet obtained by molding a ceramic powder and a material obtained by mixing a binder resin into a sheet shape is laminated and fired to obtain a support having a desired shape. Or it can be set as the support body which has a recessed part by forming and laminating | stacking through-hole of various magnitude | sizes in a ceramic green sheet. The metal underlayer disposed on such a support is fired by applying a predetermined pattern of conductive paste containing fine particles of refractory metal such as tungsten and molybdenum at the stage of an unfired ceramic green sheet. Can be obtained. Furthermore, after firing the ceramic green sheet, it is possible to form a metal member or conductor wiring disposed in the recess by sequentially plating nickel, gold, or silver on an underlayer formed in advance. It is preferable to dispose silver having a high reflectance with respect to light from the light emitting element on the outermost surface.

  In addition, as described above, the support made of ceramics can be formed by forming the conductor wiring on a pre-fired ceramic plate material in addition to integrally forming the conductor wiring and the insulating portion. . Moreover, the support body which has a notch part can also be formed by laminating | stacking and bonding the board | plate material of the ceramic which has a pre-baked various shape.

  When forming a support using ceramics as a material for an insulating member, the formation of the notch in this embodiment is performed by forming a shape corresponding to the notch in a mold for molding unfired ceramics. There is a method of integrally forming a notch. In addition, a through hole having an opening corresponding to the size and shape of the notch portion may be formed in the ceramic green sheet described above, and the ceramic green sheet may be formed by laminating and firing together with other ceramic green sheets. When the latter forming method is used, the separation groove for separating the support from the fired body of the ceramic green sheet is provided at a position including the recess formed by the opening of the through hole. Thereby, a part of the opening of the divided recess is used as the opening of the notch formed on the back side of the support, and the cross section of the recess formed on the divided surface is formed on the side of the support. It can be set as the opening part of the notch part.

  In addition, as described above, the effect of facilitating the individualization of the ceramic substrate is particularly significant when the insulating member is exposed without the bottom surface of the notch being covered with the metal member. is there. That is, since the metal member is not disposed on the bottom surface of the dividing groove, the ceramic substrate can be further easily separated.

(Semiconductor element)
The semiconductor element in this embodiment can be a light emitting element, a light receiving element, a protective element (for example, a Zener diode or a capacitor) that protects the semiconductor element from destruction due to overvoltage, or a combination thereof. Here, a light emitting element (LED chip) will be described as an example of a semiconductor element. Examples of the semiconductor light-emitting element that constitutes the LED chip include those using various semiconductors such as ZnSe and GaN. However, in the case of a light-emitting device having a fluorescent material, the short-circuit that can efficiently excite the fluorescent material. wavelength capable of emitting nitride semiconductor _{(in X Al Y Ga 1-} X-Y N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) is preferably exemplified. Various emission wavelengths can be selected depending on the material of the semiconductor layer and the degree of mixed crystal. For example, the optical semiconductor element can be a light emitting element or a light receiving element that inputs and outputs not only light in the visible light region but also ultraviolet rays and infrared rays.

  The semiconductor element can be electrically and mechanically connected to the conductor wiring of the support via a conductive material (for example, gold or solder) called a bump, and the electrode is connected to an auxiliary member called a submount. Can be connected.

  The adhesive that fixes the semiconductor element and the support is, for example, a conductive adhesive such as gold paste or silver paste, or at least one selected from Au, Ag, Bi, Cu, In, Pb, Sn, and Zn. A eutectic material (eg, Au—Sn) containing at least one of the above, or a brazing material containing at least one selected from Au and Ag. By using an adhesive containing such a metal material, the electrode disposed on the back surface of the semiconductor element and the conductor wiring of the support are electrically connected, or heat dissipation from the semiconductor element is improved. be able to. The adhesive for fixing the semiconductor element and the support can be, for example, a translucent resin such as an epoxy resin or a silicone resin.

(Coating member)
A covering member (also referred to as a “sealing member”) in this embodiment is a member that protects a semiconductor element, a conductive wire, and the like placed on a support from dust, moisture, external force, and the like. Examples of the material for the covering member include silicone resin, epoxy resin, and urea resin. The covering member may contain various materials such as a colorant, a light stabilizer, and a fluorescent material as desired. Specifically, colorants such as pigments and dyes are included for the purpose of cutting unnecessary wavelengths according to the light emission wavelength and light reception wavelength of the light emitting element.

  The fluorescent substance that can be contained in the covering member converts light of the light emitting element, and the light that is converted from the light emitting element to a longer wavelength is more efficient than the one that converts to a shorter wavelength. When the light from the light-emitting element is high-energy short-wavelength visible light, an yttrium-aluminum-garnet-based phosphor (hereinafter referred to as “YAG: Ce”), which is a kind of aluminum oxide-based phosphor, is preferably used. Used. The YAG: Ce phosphor absorbs a part of the blue light from the LED chip depending on its content and emits a yellow light that is a complementary color. Therefore, a high output light emitting diode that emits a white mixed light is used. It can be formed relatively easily.

  Examples according to the present invention will be described in detail below. Needless to say, the present invention is not limited to the following examples.

  FIG. 1 is a perspective view seen from a direction in which the main surface of the support in the present embodiment can be visually recognized. FIG. 2 is a perspective view seen from the direction in which the back surface of the support body of the present embodiment can be visually recognized. FIG. 3 is a side view of the support of this embodiment. FIG. 4 is a top view of a semiconductor device provided with the support of the present embodiment. Furthermore, FIG. 5 is a rear view of the support body of the present embodiment.

  The support in this example is a piece obtained by firing a laminate of ceramic green sheets having through holes of various shapes and then dividing the substrate, which is a fired body. The support in this example has a rectangular parallelepiped shape, and has a recess on the opposite side of the back surface facing the mounting substrate. In the support of this embodiment, a semiconductor element can be mounted on the bottom surface of the recess.

  Hereinafter, the laminate of ceramic green sheets will be described more specifically. In FIG. 1 to FIG. 3, the interfaces of the individual ceramic green sheets are indicated by solid lines, which indicates that the support in this example was formed by laminating ceramic green sheets, In the support obtained in this manner, the interface between the individual ceramic green sheets is not always clear.

  The laminated body of ceramic green sheets of this example mainly composed of alumina includes a first ceramic green sheet 104a having a through hole for forming a cutout portion of the support, and an inner wall surface of the recess of the support. A second ceramic green sheet 104b having a through-hole for forming, and a third ceramic green sheet 104c having a through-hole for forming a part of the inner wall surface of the recess formed in the support. These are laminated in order from the back side.

  Here, with respect to the first ceramic green sheet 104a, tungsten serving as an underlayer of the conductor wiring is disposed on the inner wall surface of the through hole for forming the notch portion of the support. The first ceramic green sheet 104a is also for forming the bottom surface of the concave portion of the support. Therefore, in order to provide a support in which conductor wiring is disposed on the bottom surface of the recess, tungsten serving as a base layer for the conductor wiring is disposed on the surface of the first ceramic green sheet 104a. In addition, this underlayer is interposed between the first ceramic green sheet 104a and the second ceramic green sheet 104b and connected to the underlayer disposed on the inner wall surface of the through hole forming the notch. And extend to the back side of the support.

  The through hole of the second ceramic green sheet 104b has a shape in which the inner diameter gradually increases in one opening direction. Thereby, the inner diameter increases in the opening direction of the recess, and the semiconductor device can be improved in light extraction efficiency.

  The through hole of the third ceramic green sheet 104c has an inner diameter larger than the maximum value of the inner diameter of the through hole in the second ceramic green sheet 104b. Thereby, a level | step difference can be formed in the opening part of the recessed part of a support body. This level | step difference is made into the holding means of the coating | coated member which coat | covers the inner wall surface of a recessed part, and can suppress peeling from the support body of a coating | coated member.

  The support of the present embodiment formed by firing the laminate of ceramic green sheets as described above has an upper surface and a rear surface with a 3.5 mm square as an outer edge, and a 3.5 mm × 0.8 mm rectangle. The outer shape of the rectangular parallelepiped is surrounded by a side surface having an outer edge. Moreover, the notch part in a present Example is provided as the notch part 101a and the notch part 101b between the corner | angular parts formed by the side surface of the support body. That is, as shown in FIG. 4, the support in this example has corners at the four corners when viewed from the top surface direction. Furthermore, the notch 101a is formed between the corner 102c and the corner 102d. Further, the notch 101b is formed between the corner 102a and the corner 102b. The notch in the present embodiment has a shape in which a part of the portion including the intersection line between the side surface and the back surface is cut out. It is formed so as to be symmetric with respect to the center of the support (for example, the center of the back surface of the support).

  The notch has a rectangular parallelepiped shape in which the major axis of the general shape is along the longitudinal direction of the side surface of the support. Regarding the size of the notch, the width is 1.0 mm, the height from the back surface of the support is 0.2 mm corresponding to the thickness of the first ceramic green sheet 104a after firing, and the depth is 0.2 mm. The thickness of the support after firing the ceramic green sheet laminate is 0.8 mm. Therefore, the size of the notch is such that the area of the opening on the side surface of the support is 1/9 or less of the area of the side surface.

  The support in this example is obtained by firing a laminated body of ceramic green sheets and then plating a nickel and silver layer on a tungsten base layer to form a conductor wiring. The conductor wiring of the present embodiment includes a first part 201a where the semiconductor element 401 is disposed, and a second part 201b that is electrically connected to the first part 201a and extends to the back surface of the support. And third portions 202a (main surface side) and 202b (rear surface side) insulated from the first portion 201a and the second portion 201b. Note that the conductor wiring formed by plating the underlayer disposed on the inner wall surface of the notch portion is not disposed on the bottom surface of the notch portion when viewed from the back side of the support, and the side wall surface of the notch portion. Is arranged. Moreover, this conductor wiring has connected each part of the conductor wiring arrange | positioned at the bottom face and back surface of the recessed part of a support body.

  As shown in FIG. 4, in the conductor wiring of this example, the first portion 201 a has an extending portion that becomes narrower and extends in the direction of the inner wall surface of the recess. The extending portions are provided in three directions when viewed from the center of the bottom surface of the recess, and are connected to the underlying layers interposed between the first ceramic green sheet 104a and the second ceramic green sheet 104b, respectively. It is connected to the second part 201b. Note that two regions corresponding to the upper surface of the first ceramic green sheet 104a are exposed between the three extending portions provided in the three directions without being covered with the conductor wiring. These two regions have an arc shape along the inner wall surface of the recess, and the same area is exposed symmetrically.

  The area of the second part 201b in this embodiment is larger than the area of the third part 202b extending on the back surface of the support. In this embodiment, the capacity of the notch 101a provided on the second part 201b side is equal to the capacity of the notch 101b provided on the third part 202b side.

  The semiconductor device using the support in the present embodiment is disposed in the first part 201a and the 800 μm square LED chip 401 disposed in the first part 201a of the conductor wiring disposed on the bottom surface of the recess. A Zener diode 420 and a conductive wire 403 that connects the electrodes of these semiconductor elements to the first portion 201a and the second portion 202a of the conductor wiring are provided.

  A covering member (not shown) for protecting the LED chip 401 and the conductive wire 403 from the external environment is disposed in the concave portion of the support in this embodiment. The step provided in the opening of the support can sufficiently secure a contact area with the covering member and can suppress the peeling of the covering member from the support. Furthermore, the covering member contains a YAG: Ce phosphor in a silicone resin, and the phosphor is settled around the LED chip by its own weight. Thereby, the semiconductor device using the support in the present embodiment can output the light of the LED chip whose wavelength is converted by the YAG: Ce phosphor. In particular, when the LED chip emits blue light, the light-emitting device can emit mixed-color light of the LED chip light and fluorescence from the YAG: Ce phosphor.

  The present invention can be used as a support for mounting a semiconductor element.

FIG. 1: shows the typical perspective view of the support body concerning one Example of this invention. FIG. 2 shows a schematic perspective view of a support according to an embodiment of the present invention. FIG. 3: shows the typical side view of the support body concerning one Example of this invention. FIG. 4 shows a schematic top view of a support according to an embodiment of the present invention. FIG. 5: shows the typical rear view of the support body concerning one Example of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Support body 101a, 101b ... Notch part 102a, 102b, 102c, 102d ... Corner | angular part 103 ... Recessed part 104a, 104b, 104c ... Ceramics green sheet 201a ... No. of metal member One part 201b ... Second part 202a, 202b of metal member ... Third part 401 of metal member ... LED chip 402 ... Zener diode 403 ... Conductive wire

Claims (7)

A metal member and an insulating member on which the metal member is disposed, a main surface on which a semiconductor element is mounted , a back surface having a quadrangle facing the main surface as an outer edge, the back surface and the main surface A support for mounting a semiconductor element having a rectangular parallelepiped general shape with a plurality of side surfaces ,
Said support has a respective corner portions in the four corners when viewed from the main surface side of the support, between the corner portions adjacent to each other, a portion of the insulating member toward the rear from the side And having a cutout portion provided by cutting out one side of the square of the back surface, and the metal member extends from the back surface of the support body to at least a part of the wall surface of the cutout portion. ,
The metal member includes a first part where the semiconductor element is disposed, a second part electrically connected to the first part and provided on the back surface of the support, the first part, and A third portion insulated from the second portion and provided on the main surface and the back surface of the support;
In the back surface of the support, the area of the second part is larger than the area of the third part,
The support for mounting a semiconductor element, wherein a capacity of a notch provided on the second part side is smaller than a capacity of a notch provided on the third part side . The said notch part is opened in the area | region enclosed by at least three points among the intersection of the diagonal line in the external shape, and the intersection of the said corner | angular part and the said diagonal line about the said back surface or a side surface. Support for mounting semiconductor elements. 3. The support for mounting a semiconductor element according to claim 1, wherein an outline shape of the notch is a rectangular parallelepiped. 4. The support for mounting a semiconductor element according to claim 1, wherein a bottom surface of the cutout portion is an exposed surface of the insulating member when viewed from a back surface of the support. 5. The corner part of the said support body is a support body for semiconductor element mounting as described in any one of Claim 1 to 4 which has the recessed part by which the said insulating member was exposed to the inner wall face. The support for mounting a semiconductor element according to claim 1, wherein the insulating member is made of ceramics, and the outermost surface of the metal member is silver or gold. 7. The support for mounting a semiconductor element according to claim 1, wherein an opening area of the notch is 1/9 or less of an area of the side surface or the back surface.

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