JP4937655B2 - 電気めっき装置 - Google Patents

電気めっき装置 Download PDF

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Publication number
JP4937655B2
JP4937655B2 JP2006195686A JP2006195686A JP4937655B2 JP 4937655 B2 JP4937655 B2 JP 4937655B2 JP 2006195686 A JP2006195686 A JP 2006195686A JP 2006195686 A JP2006195686 A JP 2006195686A JP 4937655 B2 JP4937655 B2 JP 4937655B2
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JP
Japan
Prior art keywords
wafer
holder
wafer holder
electrode
electroplating apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2006195686A
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English (en)
Japanese (ja)
Other versions
JP2008024962A (ja
JP2008024962A5 (enExample
Inventor
敦 永島
弘 押部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tosetz Inc
Original Assignee
Tosetz Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tosetz Inc filed Critical Tosetz Inc
Priority to JP2006195686A priority Critical patent/JP4937655B2/ja
Priority to US11/779,362 priority patent/US7828944B2/en
Publication of JP2008024962A publication Critical patent/JP2008024962A/ja
Publication of JP2008024962A5 publication Critical patent/JP2008024962A5/ja
Application granted granted Critical
Publication of JP4937655B2 publication Critical patent/JP4937655B2/ja
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Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C25D5/06—Brush or pad plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2006195686A 2006-07-18 2006-07-18 電気めっき装置 Active JP4937655B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006195686A JP4937655B2 (ja) 2006-07-18 2006-07-18 電気めっき装置
US11/779,362 US7828944B2 (en) 2006-07-18 2007-07-18 Electroplating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006195686A JP4937655B2 (ja) 2006-07-18 2006-07-18 電気めっき装置

Publications (3)

Publication Number Publication Date
JP2008024962A JP2008024962A (ja) 2008-02-07
JP2008024962A5 JP2008024962A5 (enExample) 2009-09-03
JP4937655B2 true JP4937655B2 (ja) 2012-05-23

Family

ID=38970402

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006195686A Active JP4937655B2 (ja) 2006-07-18 2006-07-18 電気めっき装置

Country Status (2)

Country Link
US (1) US7828944B2 (enExample)
JP (1) JP4937655B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110088571A (ko) * 2008-11-14 2011-08-03 레플리서러스 그룹 에스에이에스 전도성 기판 도금 시스템 및 기판 홀더
EP2780762B1 (en) 2011-11-15 2017-06-28 Ashwin-Ushas Corporation, Inc. Complimentary polymer electrochromic device
US9207515B2 (en) 2013-03-15 2015-12-08 Ashwin-Ushas Corporation, Inc. Variable-emittance electrochromic devices and methods of preparing the same
US9632059B2 (en) 2015-09-03 2017-04-25 Ashwin-Ushas Corporation, Inc. Potentiostat/galvanostat with digital interface
US9482880B1 (en) 2015-09-15 2016-11-01 Ashwin-Ushas Corporation, Inc. Electrochromic eyewear
US9945045B2 (en) 2015-12-02 2018-04-17 Ashwin-Ushas Corporation, Inc. Electrochemical deposition apparatus and methods of using the same
CN117500959B (zh) * 2022-12-09 2024-08-06 株式会社荏原制作所 镀覆装置
TWI838020B (zh) * 2022-12-19 2024-04-01 日商荏原製作所股份有限公司 鍍覆裝置
KR102532724B1 (ko) * 2022-12-20 2023-05-16 주식회사 스마트코리아피씨비 수평도금용 클램핑장치

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4428815A (en) * 1983-04-28 1984-01-31 Western Electric Co., Inc. Vacuum-type article holder and methods of supportively retaining articles
JPH0781197B2 (ja) * 1989-05-22 1995-08-30 日本電気株式会社 半導体基板鍍金装置
JPH05295597A (ja) * 1992-04-24 1993-11-09 Fujitsu Ltd めっき装置
JPH08253891A (ja) * 1995-03-15 1996-10-01 Fujitsu Ltd めっき方法とめっき装置
JP3583883B2 (ja) * 1997-01-24 2004-11-04 日本エレクトロプレイテイング・エンジニヤース株式会社 自動ウェーハめっき装置
JP3257668B2 (ja) * 1997-09-18 2002-02-18 ティーディーケイ株式会社 電極組立体、カソード装置及びメッキ装置
JPH11200096A (ja) * 1997-11-06 1999-07-27 Ebara Corp ウエハのメッキ用治具
US6416647B1 (en) * 1998-04-21 2002-07-09 Applied Materials, Inc. Electro-chemical deposition cell for face-up processing of single semiconductor substrates
JP3534238B2 (ja) * 1999-09-17 2004-06-07 大日本スクリーン製造株式会社 基板メッキ装置
JP2005136225A (ja) * 2003-10-30 2005-05-26 Ebara Corp 基板処理装置及び方法
JP2005171307A (ja) * 2003-12-10 2005-06-30 Tdk Corp ウエハ、その製造方法及びメッキ装置
JP4456878B2 (ja) * 2004-01-09 2010-04-28 新光電気工業株式会社 部分めっき装置
JP2006328470A (ja) * 2005-05-25 2006-12-07 Tousetsu:Kk 電気めっき装置

Also Published As

Publication number Publication date
US7828944B2 (en) 2010-11-09
US20080017503A1 (en) 2008-01-24
JP2008024962A (ja) 2008-02-07

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