JP4926246B2 - 有機ｅｌ装置の製造装置 - Google Patents

有機ｅｌ装置の製造装置 Download PDF

Info

Publication number
JP4926246B2
JP4926246B2 JP2009515127A JP2009515127A JP4926246B2 JP 4926246 B2 JP4926246 B2 JP 4926246B2 JP 2009515127 A JP2009515127 A JP 2009515127A JP 2009515127 A JP2009515127 A JP 2009515127A JP 4926246 B2 JP4926246 B2 JP 4926246B2
Authority
JP
Japan
Prior art keywords
chamber
organic
heating
manufacturing
working
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2009515127A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2008142966A1 (ja
Inventor
純一 永田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Priority to JP2009515127A priority Critical patent/JP4926246B2/ja
Publication of JPWO2008142966A1 publication Critical patent/JPWO2008142966A1/ja
Application granted granted Critical
Publication of JP4926246B2 publication Critical patent/JP4926246B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/811—Controlling the atmosphere during processing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2009515127A 2007-05-16 2008-04-30 有機ｅｌ装置の製造装置 Active JP4926246B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009515127A JP4926246B2 (ja) 2007-05-16 2008-04-30 有機ｅｌ装置の製造装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007130007 2007-05-16
JP2007130007 2007-05-16
JP2009515127A JP4926246B2 (ja) 2007-05-16 2008-04-30 有機ｅｌ装置の製造装置
PCT/JP2008/058247 WO2008142966A1 (ja) 2007-05-16 2008-04-30 有機ｅｌ装置の製造装置

Publications (2)

Publication Number Publication Date
JPWO2008142966A1 JPWO2008142966A1 (ja) 2010-08-05
JP4926246B2 true JP4926246B2 (ja) 2012-05-09

Family

ID=40031682

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009515127A Active JP4926246B2 (ja) 2007-05-16 2008-04-30 有機ｅｌ装置の製造装置

Country Status (5)

Country Link
JP (1) JP4926246B2 (ko)
KR (1) KR101139737B1 (ko)
CN (1) CN101682954B (ko)
TW (1) TWI416986B (ko)
WO (1) WO2008142966A1 (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10434804B2 (en) 2008-06-13 2019-10-08 Kateeva, Inc. Low particle gas enclosure systems and methods
US12018857B2 (en) 2008-06-13 2024-06-25 Kateeva, Inc. Gas enclosure assembly and system
JP2012043689A (ja) * 2010-08-20 2012-03-01 Toshiba Tec Corp 有機ｅｌ装置の製造方法
US9093667B2 (en) * 2011-02-02 2015-07-28 Joled Inc. Method for producing electroluminescence device
KR102280282B1 (ko) * 2012-11-30 2021-07-21 카티바, 인크. 산업용 프린팅 시스템의 유지 방법
EP3474317B1 (en) * 2013-03-13 2022-06-22 Kateeva, Inc. Gas enclosure systems and methods utilizing an auxiliary enclosure
KR102163521B1 (ko) 2013-05-15 2020-10-12 삼성디스플레이 주식회사 유기 발광 표시 장치의 제조 장치 및 유기 발광 표시 장치의 제조 방법
TWI825653B (zh) * 2013-06-10 2023-12-11 美商凱特伊夫公司 低粒氣體封裝系統與方法
KR101878084B1 (ko) 2013-12-26 2018-07-12 카티바, 인크. 전자 장치의 열 처리를 위한 장치 및 기술
EP3975229A1 (en) 2014-01-21 2022-03-30 Kateeva, Inc. Apparatus and techniques for electronic device encapsulation
CN110265326B (zh) 2014-04-30 2024-03-08 科迪华公司 用于衬底涂覆的气垫设备和技术
JP6757363B2 (ja) * 2017-10-06 2020-09-16 株式会社Ｊｏｌｅｄ 有機ｅｌ表示パネルの製造方法及び封止層形成装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4066661B2 (ja) * 2002-01-23 2008-03-26 セイコーエプソン株式会社 有機ｅｌ装置の製造装置および液滴吐出装置
US6791660B1 (en) * 2002-02-12 2004-09-14 Seiko Epson Corporation Method for manufacturing electrooptical device and apparatus for manufacturing the same, electrooptical device and electronic appliances
JP4115757B2 (ja) * 2002-06-26 2008-07-09 ランテクニカルサービス株式会社 ディスプレイパネル基板の貼り合わせ方法及び装置
JP4652120B2 (ja) * 2004-05-21 2011-03-16 株式会社半導体エネルギー研究所 半導体装置の製造装置、およびパターン形成方法
US20050257738A1 (en) * 2004-05-21 2005-11-24 Semiconductor Energy Laboratory Co., Ltd. Manufacturing apparatus of semiconductor device and pattern-forming method
JP2006019087A (ja) * 2004-06-30 2006-01-19 Optrex Corp 有機ｅｌ表示素子の製造方法
JP2006119286A (ja) * 2004-10-20 2006-05-11 Ran Technical Service Kk 基板の貼り合わせ装置及び貼り合わせ方法
JP2006221029A (ja) * 2005-02-14 2006-08-24 Seiko Epson Corp 基板処理装置及び制御装置

Also Published As

Publication number Publication date
KR101139737B1 (ko) 2012-04-26
KR20090130245A (ko) 2009-12-21
JPWO2008142966A1 (ja) 2010-08-05
CN101682954A (zh) 2010-03-24
WO2008142966A1 (ja) 2008-11-27
TWI416986B (zh) 2013-11-21
CN101682954B (zh) 2014-10-29
TW200915912A (en) 2009-04-01

Similar Documents

Publication Publication Date Title
JP4926246B2 (ja) 有機ｅｌ装置の製造装置
JP7177521B2 (ja) 補助エンクロージャを利用するガスエンクロージャシステムおよび方法
JP7311914B2 (ja) インク送達システムおよび方法
JP7265280B2 (ja) 印刷システムアセンブリおよび方法
TWI780030B (zh) 形成用於一半導體基板並具有低溼度值的一乾淨的環境的方法及系統
TWI423371B (zh) A substrate processing apparatus and a particle adhesion preventing method
JP2007031821A (ja) 真空処理装置
JP2011065967A (ja) 有機ｅｌ用加熱乾燥装置
JP2019212645A (ja) 印刷システムアセンブリおよび方法
JP2008115441A (ja) 成膜マスク交換方法および成膜マスク交換システム
JP2018535508A5 (ko)
KR101661178B1 (ko) 기판 프로세싱 장치
KR200491734Y1 (ko) 정밀 생산용 환경 유지 시스템 및 방법
US10092854B2 (en) Device and method for applying a material to a substrate
KR102333617B1 (ko) 기판 처리 시스템
EP3608497B1 (en) Thermal treatment of pane elements for vacuum insulating glass units
US20190280204A1 (en) Printing System Assemblies and Methods
JP2010043795A (ja) 連続雰囲気炉
TWI810088B (zh) 用於列印之系統
JP5697500B2 (ja) 真空蒸着装置及び薄膜の形成方法
JP2012092396A (ja) 蒸着方法及び蒸着装置

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111108

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111226

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20111226

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120131

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120207

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150217

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4926246

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250