JP4916658B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

Info

Publication number
JP4916658B2
JP4916658B2 JP2004363424A JP2004363424A JP4916658B2 JP 4916658 B2 JP4916658 B2 JP 4916658B2 JP 2004363424 A JP2004363424 A JP 2004363424A JP 2004363424 A JP2004363424 A JP 2004363424A JP 4916658 B2 JP4916658 B2 JP 4916658B2
Authority
JP
Japan
Prior art keywords
circuit
antenna
signal
electrically connected
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004363424A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005202943A (ja
JP2005202943A5 (enExample
Inventor
潤 小山
利彦 齋藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP2004363424A priority Critical patent/JP4916658B2/ja
Publication of JP2005202943A publication Critical patent/JP2005202943A/ja
Publication of JP2005202943A5 publication Critical patent/JP2005202943A5/ja
Application granted granted Critical
Publication of JP4916658B2 publication Critical patent/JP4916658B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Support Of Aerials (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Thin Film Transistor (AREA)
JP2004363424A 2003-12-19 2004-12-15 半導体装置 Expired - Fee Related JP4916658B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004363424A JP4916658B2 (ja) 2003-12-19 2004-12-15 半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003423861 2003-12-19
JP2003423861 2003-12-19
JP2004363424A JP4916658B2 (ja) 2003-12-19 2004-12-15 半導体装置

Publications (3)

Publication Number Publication Date
JP2005202943A JP2005202943A (ja) 2005-07-28
JP2005202943A5 JP2005202943A5 (enExample) 2008-02-07
JP4916658B2 true JP4916658B2 (ja) 2012-04-18

Family

ID=34829377

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004363424A Expired - Fee Related JP4916658B2 (ja) 2003-12-19 2004-12-15 半導体装置

Country Status (1)

Country Link
JP (1) JP4916658B2 (enExample)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007026289A1 (en) * 2005-09-02 2007-03-08 Nxp B.V. Charge pump circuit for rfid integrated circuits
EP1770610A3 (en) * 2005-09-29 2010-12-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2007063786A1 (en) * 2005-11-29 2007-06-07 Semiconductor Energy Laboratory Co., Ltd. Antenna and manufacturing method thereof, semiconductor device including antenna and manufacturing method thereof, and radio communication system
WO2007077850A1 (en) * 2005-12-27 2007-07-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
WO2007122699A1 (ja) * 2006-04-18 2007-11-01 Hitachi Ulsi Systems Co. Ltd. 半導体集積回路および書き換え可能型タグ
EP1863090A1 (en) 2006-06-01 2007-12-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
JP2008010849A (ja) * 2006-06-01 2008-01-17 Semiconductor Energy Lab Co Ltd 半導体装置及び半導体装置の作製方法
KR101349880B1 (ko) * 2006-10-02 2014-01-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치
JP5038080B2 (ja) * 2006-10-02 2012-10-03 株式会社半導体エネルギー研究所 半導体装置及び電子機器
US8002193B2 (en) 2007-03-12 2011-08-23 Visa U.S.A. Inc. Payment card dynamically receiving power from external source
US8235299B2 (en) 2007-07-04 2012-08-07 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
EP2568419B1 (en) 2007-07-18 2015-02-25 Murata Manufacturing Co., Ltd. Apparatus comprising an RFID device
EP2251934B1 (en) 2008-03-03 2018-05-02 Murata Manufacturing Co. Ltd. Wireless ic device and wireless communication system
EP2840648B1 (en) 2008-05-21 2016-03-23 Murata Manufacturing Co., Ltd. Wireless IC device
JP5218558B2 (ja) 2008-05-26 2013-06-26 株式会社村田製作所 無線ｉｃデバイスシステム及び無線ｉｃデバイスの真贋判定方法
JP2010002971A (ja) * 2008-06-18 2010-01-07 Brother Ind Ltd 無線タグ
JP5217675B2 (ja) * 2008-06-18 2013-06-19 ブラザー工業株式会社 無線タグ
JP4605318B2 (ja) 2008-11-17 2011-01-05 株式会社村田製作所 アンテナ及び無線ｉｃデバイス
EP2385580B1 (en) 2009-01-30 2014-04-09 Murata Manufacturing Co., Ltd. Antenna and wireless ic device
WO2010119854A1 (ja) 2009-04-14 2010-10-21 株式会社村田製作所 無線ｉｃデバイス用部品及び無線ｉｃデバイス
JP4687832B2 (ja) 2009-04-21 2011-05-25 株式会社村田製作所 アンテナ装置
WO2011040393A1 (ja) 2009-09-30 2011-04-07 株式会社村田製作所 回路基板及びその製造方法
JP5304580B2 (ja) 2009-10-02 2013-10-02 株式会社村田製作所 無線ｉｃデバイス
CN102549838B (zh) 2009-11-04 2015-02-04 株式会社村田制作所 通信终端及信息处理系统
JP5652470B2 (ja) 2010-03-03 2015-01-14 株式会社村田製作所 無線通信モジュール及び無線通信デバイス
WO2011118379A1 (ja) 2010-03-24 2011-09-29 株式会社村田製作所 Ｒｆｉｄシステム
JP5630499B2 (ja) 2010-03-31 2014-11-26 株式会社村田製作所 アンテナ装置及び無線通信デバイス
CN102859790B (zh) 2010-07-28 2015-04-01 株式会社村田制作所 天线装置及通信终端设备
WO2012093541A1 (ja) 2011-01-05 2012-07-12 株式会社村田製作所 無線通信デバイス
WO2012096365A1 (ja) 2011-01-14 2012-07-19 株式会社村田製作所 Ｒｆｉｄチップパッケージ及びｒｆｉｄタグ
CN103119786B (zh) 2011-02-28 2015-07-22 株式会社村田制作所 无线通信器件
WO2012121185A1 (ja) 2011-03-08 2012-09-13 株式会社村田製作所 アンテナ装置及び通信端末機器
JP5482964B2 (ja) 2011-04-13 2014-05-07 株式会社村田製作所 無線ｉｃデバイス及び無線通信端末
WO2012157596A1 (ja) 2011-05-16 2012-11-22 株式会社村田製作所 無線ｉｃデバイス
CN103370834B (zh) 2011-07-14 2016-04-13 株式会社村田制作所 无线通信器件
JP5333707B2 (ja) 2011-07-15 2013-11-06 株式会社村田製作所 無線通信デバイス
WO2013011865A1 (ja) 2011-07-19 2013-01-24 株式会社村田製作所 アンテナモジュール、アンテナ装置、ｒｆｉｄタグおよび通信端末装置
CN203553354U (zh) 2011-09-09 2014-04-16 株式会社村田制作所 天线装置及无线器件
WO2013080991A1 (ja) 2011-12-01 2013-06-06 株式会社村田製作所 無線ｉｃデバイス及びその製造方法
KR20130105938A (ko) 2012-01-30 2013-09-26 가부시키가이샤 무라타 세이사쿠쇼 무선 ic 디바이스
WO2013125610A1 (ja) 2012-02-24 2013-08-29 株式会社村田製作所 アンテナ装置および無線通信装置
WO2013153697A1 (ja) 2012-04-13 2013-10-17 株式会社村田製作所 Ｒｆｉｄタグの検査方法及び検査装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05122108A (ja) * 1991-10-29 1993-05-18 Omron Corp データキヤリア
EP1034942A4 (en) * 1996-12-26 2005-07-06 Hitachi Ltd SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
JP2000020665A (ja) * 1998-06-30 2000-01-21 Toshiba Corp 半導体装置
JP3967487B2 (ja) * 1999-02-23 2007-08-29 株式会社東芝 Ｉｃカード
JP2002150250A (ja) * 2000-11-16 2002-05-24 Matsushita Electric Ind Co Ltd 非接触ｉｃカード用ｉｃチップ
JP3944394B2 (ja) * 2002-01-08 2007-07-11 株式会社日立製作所 表示装置
JP2003339156A (ja) * 2002-05-20 2003-11-28 Denso Corp 昇圧回路

Also Published As

Publication number Publication date
JP2005202943A (ja) 2005-07-28

Similar Documents

Publication Publication Date Title
JP4916658B2 (ja) 半導体装置
KR101113259B1 (ko) 반도체장치
JP4536496B2 (ja) 半導体装置及び半導体装置の駆動方法
TWI448971B (zh) 半導體裝置
US7471188B2 (en) Semiconductor device and driving method thereof
US8430326B2 (en) Semiconductor device
CN101084616B (zh) 无线芯片
KR101146599B1 (ko) 반도체 장치 및 그를 갖는 제품
CN1930580A (zh) 半导体设备、无线芯片、ic卡、ic标签、应答器、帐单、证券、护照、电子设备、书包和服装
JP2005259121A (ja) 半導体装置、ｉｃカード、ｉｃタグ、ｒｆｉｄ、トランスポンダ、紙幣、有価証券、パスポート、電子機器、バッグ及び衣類
JP5179849B2 (ja) 半導体装置
JP5038080B2 (ja) 半導体装置及び電子機器

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20071214

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20071214

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110126

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110201

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20110920

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111130

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20111205

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120124

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120125

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150203

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4916658

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150203

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees