JP4908619B2 - 電子機器 - Google Patents
電子機器 Download PDFInfo
- Publication number
- JP4908619B2 JP4908619B2 JP2010198059A JP2010198059A JP4908619B2 JP 4908619 B2 JP4908619 B2 JP 4908619B2 JP 2010198059 A JP2010198059 A JP 2010198059A JP 2010198059 A JP2010198059 A JP 2010198059A JP 4908619 B2 JP4908619 B2 JP 4908619B2
- Authority
- JP
- Japan
- Prior art keywords
- housing
- pad
- portable computer
- wiring pattern
- rib
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
- G06F1/169—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being an integrated pointing device, e.g. trackball in the palm rest area, mini-joystick integrated between keyboard keys, touch pads or touch stripes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/033—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor
- G06F3/0354—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor with detection of 2D relative movements between the device, or an operating part thereof, and a plane or surface, e.g. 2D mice, trackballs, pens or pucks
- G06F3/03547—Touch pads, in which fingers can move on a surface
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09045—Locally raised area or protrusion of insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
Description
筐体と、配線パターンと、複数の凸部と、凹部と、パッド部と、補強部と、電子部品とを具備する。前記配線パターンは、導電性の接着剤によって前記筐体の内面に設けられる。前記凸部は、前記筐体の内面に複数の列を形成して並ぶ。前記凹部は、前記凸部と他の前記凸部とによって規定される。前記パッド部は、前記導電性の接着剤によって前記凹部に前記配線パターンよりも厚く設けられ、前記配線パターンの端部に接続される。前記補強部は、前記複数の凸部の列の間に位置して前記パッド部に隣接し、前記筐体の内面から突出した第1のリブと、前記第1のリブと交差する方向に向かって延びた第2のリブと、を有する。前記電子部品は、前記パッド部を押圧する端子を有する。
以下に、出願当初の特許請求の範囲の内容を付記する。
[1]筐体と、
導電性の接着剤によって前記筐体の内面に形成された配線パターンと、
前記筐体の内面に設けられた凹部と、
前記導電性の接着剤によって前記凹部に設けられ、前記配線パターンの端部に接続されたパッド部と、
前記パッド部に接触する端子を有した電子部品と、
を具備した電子機器。
[2]前記筐体の内面に並んで設けられた複数の凸部をさらに具備し、
前記凹部は、一つの前記凸部と他の前記凸部とによって規定された[1]に記載の電子機器。
[3]前記パッド部の厚みが前記配線パターンの厚みよりも大きい[2]に記載の電子機器。
[4]前記筐体の内面に設けられるとともに前記パッド部に隣接する補強部をさらに具備し、
前記電子部品の端子が前記パッド部を押圧する[3]に記載の電子機器。
[5]前記補強部が、前記筐体の内面から突出した第1のリブを有した[4]に記載の電子機器。
[6]前記補強部が、前記第1のリブと交差する方向に向かって延びた第2のリブを有した[5]に記載の電子機器。
[7]幾つかの前記凸部を含む第1の凸部列と、
余の前記凸部を含むとともに前記第1の凸部列と平行に延びた第2の凸部列と、
をさらに具備し、
前記補強部が前記第1の凸部列と前記第2の凸部列との間に位置した[6]に記載の電子機器。
[8]前記パッド部と前記電子部品の端子との間に介在し、前記パッド部よりも硬い導電部をさらに具備した[7]に記載の電子機器。
[9]前記パッド部が、前記電子部品の端子に接触される凹面を有した[7]に記載の電子機器。
Claims (6)
- 筐体と、
導電性の接着剤によって前記筐体の内面に設けられた配線パターンと、
前記筐体の内面に複数の列を形成して並んだ複数の凸部と、
前記凸部と他の前記凸部とによって規定された凹部と、
前記導電性の接着剤によって前記凹部に前記配線パターンよりも厚く設けられ、前記配線パターンの端部に接続されたパッド部と、
前記複数の凸部の列の間に位置して前記パッド部に隣接し、前記筐体の内面から突出した第1のリブと、前記第1のリブと交差する方向に向かって延びた第2のリブと、を有した補強部と、
前記パッド部を押圧する端子を有した電子部品と、
を具備した電子機器。 - 筐体と、
導電性の接着剤によって前記筐体の内面に設けられた配線パターンと、
前記筐体の内面に複数の列を形成して並んだ複数の凸部と、
前記導電性の接着剤によって前記複数の凸部の間に設けられ、前記配線パターンの端部に接続されたパッド部と、
前記複数の凸部の列の間に位置し、前記パッド部に接する補強部と、
前記パッド部を押圧する端子を有した電子部品と、
を具備した電子機器。 - 前記補強部が、前記筐体の内面から突出した第1のリブを有した請求項2に記載の電子機器。
- 前記補強部が、前記第1のリブと交差する方向に向かって延びた第2のリブを有した請求項3に記載の電子機器。
- 前記パッド部と前記電子部品の端子との間に介在し、前記パッド部よりも硬い導電部をさらに具備した請求項1または4に記載の電子機器。
- 前記パッド部が、前記電子部品の端子に接触される凹面を有した請求項1または4に記載の電子機器。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010198059A JP4908619B2 (ja) | 2010-09-03 | 2010-09-03 | 電子機器 |
US13/093,650 US8451616B2 (en) | 2010-09-03 | 2011-04-25 | Electronic apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010198059A JP4908619B2 (ja) | 2010-09-03 | 2010-09-03 | 電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012054514A JP2012054514A (ja) | 2012-03-15 |
JP4908619B2 true JP4908619B2 (ja) | 2012-04-04 |
Family
ID=45770571
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010198059A Active JP4908619B2 (ja) | 2010-09-03 | 2010-09-03 | 電子機器 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8451616B2 (ja) |
JP (1) | JP4908619B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014083952A1 (ja) * | 2012-11-28 | 2014-06-05 | シャープ株式会社 | 構造体 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4330163A (en) * | 1979-12-05 | 1982-05-18 | E. I. Du Pont De Nemours And Company | Zero insertion force connector for LSI circuit package |
JPH02222599A (ja) * | 1989-02-23 | 1990-09-05 | Toshiba Corp | 電子機器の筐体 |
US5061192A (en) * | 1990-12-17 | 1991-10-29 | International Business Machines Corporation | High density connector |
JP2002134873A (ja) * | 2000-10-24 | 2002-05-10 | Nippon Dempa Kogyo Co Ltd | チップ素子の実装方法及び表面実装用の水晶発振器 |
JP2002353595A (ja) * | 2001-05-28 | 2002-12-06 | Matsushita Electric Works Ltd | 電子回路部品及びその製造方法 |
US6586684B2 (en) * | 2001-06-29 | 2003-07-01 | Intel Corporation | Circuit housing clamp and method of manufacture therefor |
JP2003060365A (ja) * | 2001-08-21 | 2003-02-28 | Mitsubishi Electric Corp | 携帯端末 |
TW573841U (en) * | 2003-03-19 | 2004-01-21 | Hon Hai Prec Ind Co Ltd | Electrical connector assembly |
JP4256719B2 (ja) * | 2003-05-14 | 2009-04-22 | パナソニック株式会社 | 電子部品実装体およびその製造方法 |
-
2010
- 2010-09-03 JP JP2010198059A patent/JP4908619B2/ja active Active
-
2011
- 2011-04-25 US US13/093,650 patent/US8451616B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2012054514A (ja) | 2012-03-15 |
US20120057279A1 (en) | 2012-03-08 |
US8451616B2 (en) | 2013-05-28 |
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