JP4907273B2 - 配線基板 - Google Patents
配線基板 Download PDFInfo
- Publication number
- JP4907273B2 JP4907273B2 JP2006237048A JP2006237048A JP4907273B2 JP 4907273 B2 JP4907273 B2 JP 4907273B2 JP 2006237048 A JP2006237048 A JP 2006237048A JP 2006237048 A JP2006237048 A JP 2006237048A JP 4907273 B2 JP4907273 B2 JP 4907273B2
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- core
- function unit
- layer
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
Landscapes
- Ceramic Capacitors (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
[第2実施形態]
11…基板コア
12…コア主面としての上面
13…コア裏面としての下面
21…半導体集積回路素子としてのICチップ
23…半導体集積回路素子搭載領域としてのICチップ搭載領域
24,25…プロセッサコア
28,29…I/O回路部
31…ビルドアップ層としての第1ビルドアップ層
32…第2ビルドアップ層
33,34,35,36…層間絶縁層としての樹脂絶縁層
39…ビルドアップ層の表面
42…導体層
51,52…半導体集積回路素子搭載領域としてのICチップ搭載領域
101…セラミックキャパシタ
102…キャパシタ主面としての上面
103…キャパシタ裏面としての下面
105…セラミック誘電体層
107,108…キャパシタ機能部
141…第1内部電極層
142…第2内部電極層
161…抵抗体
171…電源用導体部としての第1電源用導体部
173…電源用導体部としての第2電源用導体部
Claims (4)
- コア主面及びコア裏面を有する基板コアと、
キャパシタ主面及びキャパシタ裏面を有するとともに、セラミック誘電体層を介して第1内部電極層と第2内部電極層とが交互に積層配置された構造を持ち、キャパシタ機能部及び前記キャパシタ機能部よりも小容量の別系統用キャパシタ機能部を有し、前記コア主面と前記キャパシタ主面とを同じ側に向けた状態で前記基板コア内に埋設されたセラミックキャパシタと、
層間絶縁層及び導体層を前記コア主面及び前記キャパシタ主面の上にて交互に積層した構造を有し、その表面にプロセッサコア及びI/O回路部を有する半導体集積回路素子を搭載可能な半導体集積回路素子搭載領域が設定されたビルドアップ層と
を備え、
前記別系統用キャパシタ機能部は、平面視で前記キャパシタ機能部に比べて小さくかつ平面視で前記キャパシタ機能部の外周側に配置され、
前記キャパシタ機能部と前記別系統用キャパシタ機能部とは互いに電気的に独立し、
前記キャパシタ機能部は前記プロセッサコアに電気的に接続可能であり、前記別系統用キャパシタ機能部は前記I/O回路部に電気的に接続可能である
ことを特徴とする配線基板。 - 前記半導体集積回路素子搭載領域の面積は、前記セラミックキャパシタの前記キャパシタ主面の面積と同等またはそれよりも小さくなるように設定され、
前記半導体集積回路素子搭載領域は、前記セラミックキャパシタの厚さ方向から見たときに、前記セラミックキャパシタの前記キャパシタ主面内に位置する
ことを特徴とする請求項1に記載の配線基板。 - 前記ビルドアップ層は第1ビルドアップ層であり、
層間絶縁層及び導体層を前記コア裏面及び前記キャパシタ裏面の上にて交互に積層した構造を有する第2ビルドアップ層を備えることを特徴とする請求項1または2に記載の配線基板。 - コア主面及びコア裏面を有する基板コアと、
キャパシタ主面及びキャパシタ裏面を有するとともに、セラミック誘電体層を介して第1内部電極層と第2内部電極層とが交互に積層配置された構造を持ち、キャパシタ機能部及び前記キャパシタ機能部よりも小容量の別系統用キャパシタ機能部を有し、前記コア主面と前記キャパシタ主面とを同じ側に向けた状態で前記基板コア内に埋設されたセラミックキャパシタと、
層間絶縁層及び導体層を前記コア主面及び前記キャパシタ主面の上にて交互に積層した構造を有し、その表面にプロセッサコアを有する半導体集積回路素子を搭載可能な半導体集積回路素子搭載領域が設定されたビルドアップ層と
を備え、
前記別系統用キャパシタ機能部は、平面視で前記キャパシタ機能部に比べて小さくかつ平面視で前記キャパシタ機能部の外周側に配置され、
前記キャパシタ機能部と前記別系統用キャパシタ機能部とは互いに電気的に独立し、
前記キャパシタ機能部は前記プロセッサコアに電気的に接続可能であり、前記別系統用キャパシタ機能部は前記半導体集積回路素子における前記プロセッサコア以外の回路部に電気的に接続可能であることを特徴とする配線基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006237048A JP4907273B2 (ja) | 2005-09-01 | 2006-08-31 | 配線基板 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005254030 | 2005-09-01 | ||
JP2005254030 | 2005-09-01 | ||
JP2006237048A JP4907273B2 (ja) | 2005-09-01 | 2006-08-31 | 配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007096291A JP2007096291A (ja) | 2007-04-12 |
JP4907273B2 true JP4907273B2 (ja) | 2012-03-28 |
Family
ID=37981552
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006237048A Expired - Fee Related JP4907273B2 (ja) | 2005-09-01 | 2006-08-31 | 配線基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4907273B2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5138277B2 (ja) | 2007-05-31 | 2013-02-06 | 京セラSlcテクノロジー株式会社 | 配線基板およびその製造方法 |
JP5139171B2 (ja) * | 2008-02-05 | 2013-02-06 | 日本特殊陶業株式会社 | ビアアレイ型積層セラミックコンデンサ及びその製造方法、コンデンサ内蔵配線基板 |
US8391015B2 (en) * | 2008-03-17 | 2013-03-05 | Ibiden Co., Ltd. | Capacitor-incorporated printed wiring board and electronic component |
JP5283492B2 (ja) * | 2008-12-01 | 2013-09-04 | 日本特殊陶業株式会社 | 配線基板 |
CN102771200A (zh) * | 2010-02-22 | 2012-11-07 | 三洋电机株式会社 | 多层印刷电路板及其制造方法 |
JP5659042B2 (ja) * | 2011-02-28 | 2015-01-28 | 日本特殊陶業株式会社 | キャパシタ内蔵光電気混載パッケージ |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000165053A (ja) * | 1998-11-30 | 2000-06-16 | Pfu Ltd | 高速信号配線 |
JP2002329976A (ja) * | 2001-04-26 | 2002-11-15 | Kyocera Corp | 多層配線基板 |
JP4458812B2 (ja) * | 2002-10-30 | 2010-04-28 | 京セラ株式会社 | コンデンサ、コンデンサの製造方法、配線基板、デカップリング回路及び高周波回路 |
JP4160863B2 (ja) * | 2003-06-24 | 2008-10-08 | 日本特殊陶業株式会社 | 中間基板 |
JP2005039243A (ja) * | 2003-06-24 | 2005-02-10 | Ngk Spark Plug Co Ltd | 中間基板 |
-
2006
- 2006-08-31 JP JP2006237048A patent/JP4907273B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JP2007096291A (ja) | 2007-04-12 |
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