JP4901412B2 - プラズマ閉込め装置及びプラズマの閉込め方法 - Google Patents
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Description
11 プラズマ処理装置
13 側壁
12 処理容器
14 外側表面
15 内側表面
21 内側表面
20 上部
23 内側表面
22 底部
24 周辺端部
25 間隙または空間
30 内部空洞
31 上部電極
32 下部電極
33 処理区域
35 第一吸気端
34 排気路
36 第二排気端
37 排気装置または気体移動アッセンブリ
40 複数の絶縁部材
42 第一表面
43 第二表面
41 本体
44 側壁
45 空洞
50 複数の狭い通路
51 第一端
52 第二端
54 円形の通路
55 線状の通路
56 周辺端部
60 導電・接地部材
62 上表面
61 本体
63 突出部
64 底面
65 側壁
70 プラズマ閉込め装置
71 電気接地部材
72 外側周辺端部
73 内側周辺端部
74 上表面
75 底面
76 複数の通路
80 絶縁層
90 導電性サポートリング
91 外側周辺端部
92 内側周辺端部
100 複数の導電部材
101 複数のリング
102 複数の通路
110 プラズマ閉込め装置
111 電気接地部材
112 外側周辺端部
113 内側周辺端部
114 上表面
115 底面
116 複数の通路
117 プラズマ処理装置
120 絶縁層
130 複数の導電部材
131 上端
132 下端
133 複数の通路
134 切欠区域
135 複数の支持部材
140 第二部分の複数の導電部材
141 上端
142 下端
143 支持部材
144 複数の通路
145 通路
Claims (16)
- プラズマ処理装置で用いるプラズマ閉込め装置であって、プラズマ処理装置の処理区域と排気区域間に配置され、
電気接地部材と、前記電気接地部材上に配置され、電気的に絶縁された導電部材と、
前記電気接地部材と前記導電部材間に配置された電気絶縁層と、
を含み、前記導電部材がさらに複数の通路を形成し、前記複数の通路を介してプラズマが処理区域と排気区域間を移動し、前記プラズマが荷電種と中性種を持ち、前記複数の通路が前記荷電種をクエンチし、中性種を通過させる寸法に形成され、
前記プラズマを励起するために高周波放出が前記プラズマ処理装置の処理区域に供給され、前記高周波放出が前記プラズマ処理装置の排気区域に到達しないよう前記電気接地部材が阻止することを特徴とする、プラズマ閉込め装置。 - 前記電気接地部材と前記導電部材間に配置された電気絶縁スペーサを含む、請求項1に記載のプラズマ閉込め装置。
- 前記電気接地部材または前記導電部材が、少なくとも部分的に陽極酸化された、請求項1に記載のプラズマ閉込め装置。
- 前記導電部材がプラズマ処理装置の処理区域で生成されるプラズマによるエッチングに耐性を有する材料で被覆された、請求項1に記載のプラズマ閉込め装置。
- 前記導電部材または前記電気接地部材が、エッチングに耐性を有する材料で導電部材上を被覆する前に、少なくとも一部が陽極酸化された、請求項4に記載のプラズマ閉込め装置。
- 前記電気絶縁層が、電気接地部材または前記導電部材の表面の陽極酸化または被覆のいずれかにより形成される、請求項1に記載のプラズマ閉込め装置。
- 前記導電部材が複数の同心リングから成る、請求項1に記載のプラズマ閉込め装置。
- 前記導電部材が、長い穿孔または孔を備えた板体から成る、請求項1に記載のプラズマ閉込め装置。
- 前記導電部材が接地から電気的に浮遊する、請求項1に記載のプラズマ閉込め装置。
- 前記導電部材が相互に嵌合されて前記複数の通路を形成する第一部分及び第二部分を備え、前記複数の通路がプラズマの荷電種を消滅させ、中性種を通過させる寸法に形成された、請求項1に記載のプラズマ閉込め装置。
- プラズマ処理装置で用いるプラズマ閉込め装置であって、プラズマ処理装置の処理区域と排気区域間に配置され、
上表面を有する接地された板体と、
前記接地された板体の上表面を少なくとも一部被覆する電気絶縁層と、
複数の間隔をあけた導電部材と、
を含み、これら導電部材が電気的に接続され、且つ処理区域と排気区域間に配置されると共に、少なくとも1つの導電部材が前記電気絶縁層に少なくとも一部接触し、
前記接地された板体が、それを通過して延伸された少なくとも1つの通路を形成し、且つ、前記接地された板体が周辺端部部分を備え、前記電気絶縁層が前記周辺端部部分の上表面上に配置され、
前記導電部材が同心に配置された複数のリングから成り、相互間に個別の通路を形成し、前記複数の通路が前記荷電種をクエンチし、中性種を通過させる寸法に形成され、
前記プラズマを励起するために高周波放出が前記プラズマ処理装置の処理区域に供給され、前記高周波放出が前記プラズマ処理装置の排気区域に到達しないよう前記接地された板体が阻止するプラズマ閉込め装置。 - 前記導電部材が金属から製造され、さらにその後陽極酸化されるか、処理区域内で形成されたプラズマによるエッチングに耐性を有する材料で被覆した金属から製造される、請求項11に記載のプラズマ閉込め装置。
- 前記導電部材が半導電性材料から製造される、請求項11に記載のプラズマ閉込め装置。
- 前記プラズマ処理装置が、処理区域を形成する導電性容器本体を備え、前記容器本体上に陽極と陰極が取り付けられ、前記陰極が導電殻体内に収容され、前記接地された板体が前記陰極の導電殻体または導電性容器本体に電気的に接続される、請求項11に記載のプラズマ閉込め装置。
- プラズマ閉込め装置であって、
自身を通り延伸された少なくとも1つの通路を形成する電気接地部材と、
前記電気接地部材を少なくとも一部被覆して配置された電気絶縁層と、
前記電気絶縁層上に配置され、電気接地部材から間隔をあけ配置された第一の複数の間隔をあけ同心に配置された導電リングと、
前記第一の複数の導電リングと嵌合されて相互に組み込まれる第二の複数の間隔をあけ同心に配置された導電リングと、
を含み、前記第一及び第二の複数の導電リングの相互間に荷電種をクエンチし、中性種を通過させる寸法に複数の通路が形成され、
前記第一及び第二の複数の導電リングが接地から電気的に浮遊し、
前記プラズマを励起するために高周波放出が前記プラズマ処理装置の処理区域に供給され、前記高周波放出が前記プラズマ処理装置の排気区域に到達しないよう前記電気接地部材が阻止するプラズマ閉込め装置。 - 前記第一及び第二の複数の導電リングがさらに陽極酸化された金属またはY2O3で被覆された金属から成る、請求項15に記載のプラズマ閉込め装置。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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CNB2005100305763A CN100516291C (zh) | 2005-10-14 | 2005-10-14 | 等离子体处理装置 |
CN200510030576.3 | 2005-10-14 | ||
CN200610116449.X | 2006-09-22 | ||
CN200610116449A CN101150909B (zh) | 2006-09-22 | 2006-09-22 | 等离子体约束装置 |
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US20070085483A1 (en) | 2007-04-19 |
US8608851B2 (en) | 2013-12-17 |
KR100875796B1 (ko) | 2008-12-24 |
US10187965B2 (en) | 2019-01-22 |
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US20140103805A1 (en) | 2014-04-17 |
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