JP4852891B2 - ウェハホルダ、ウェハ積層方法及び積層型半導体装置製造方法 - Google Patents

ウェハホルダ、ウェハ積層方法及び積層型半導体装置製造方法 Download PDF

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JP4852891B2
JP4852891B2 JP2005158556A JP2005158556A JP4852891B2 JP 4852891 B2 JP4852891 B2 JP 4852891B2 JP 2005158556 A JP2005158556 A JP 2005158556A JP 2005158556 A JP2005158556 A JP 2005158556A JP 4852891 B2 JP4852891 B2 JP 4852891B2
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wafer
holder
wafers
wafer holder
coupling
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JP2006339191A (ja
JP2006339191A5 (enExample
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修 山下
栄裕 前田
元英 影山
英也 井上
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Nikon Corp
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JP2005158556A 2005-05-31 2005-05-31 ウェハホルダ、ウェハ積層方法及び積層型半導体装置製造方法 Expired - Lifetime JP4852891B2 (ja)

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JP2006339191A5 JP2006339191A5 (enExample) 2008-07-24
JP4852891B2 true JP4852891B2 (ja) 2012-01-11

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Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5098165B2 (ja) * 2005-12-08 2012-12-12 株式会社ニコン ウェハの接合方法、接合装置及び積層型半導体装置の製造方法
TWI471971B (zh) 2007-10-30 2015-02-01 尼康股份有限公司 Substrate holding member, substrate bonding apparatus, laminated substrate manufacturing apparatus, substrate bonding method, laminated substrate manufacturing method, and laminated semiconductor device manufacturing method
KR200465252Y1 (ko) 2007-11-30 2013-02-08 주식회사 케이씨텍 기판 정렬 장치
WO2009113317A1 (ja) * 2008-03-13 2009-09-17 株式会社ニコン 基板ホルダ、基板ホルダユニット、基板搬送装置および基板貼り合わせ装置
JP5417751B2 (ja) * 2008-06-30 2014-02-19 株式会社ニコン 接合装置および接合方法
JP2010153645A (ja) * 2008-12-25 2010-07-08 Nikon Corp 積層半導体装置の製造方法
JP5549108B2 (ja) * 2009-04-20 2014-07-16 株式会社ニコン 重ね合わせ装置、重ね合わせ方法及び半導体装置の製造方法
JP5487698B2 (ja) * 2009-04-20 2014-05-07 株式会社ニコン 複数の基板を重ね合わせる重ね合わせ装置、及び半導体装置の製造方法
JP5970909B2 (ja) * 2012-03-28 2016-08-17 株式会社ニコン クランプ機構及び基板貼り合わせ装置
JP2013232663A (ja) * 2013-06-20 2013-11-14 Nikon Corp 基板ホルダ装置及び基板張り合わせ装置
JP5765405B2 (ja) * 2013-11-19 2015-08-19 株式会社ニコン 基板接合装置及び基板接合方法
JP2020145438A (ja) * 2020-04-14 2020-09-10 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 基板をボンディングする方法および装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5850337A (ja) * 1981-09-21 1983-03-24 Matsushita Electric Ind Co Ltd 可動体保持装置
JPH03126244A (ja) * 1989-10-12 1991-05-29 Fujitsu Ltd 半導体製造装置
US5370301A (en) * 1994-01-04 1994-12-06 Texas Instruments Incorporated Apparatus and method for flip-chip bonding
JP3409222B2 (ja) * 1994-09-28 2003-05-26 東芝機械株式会社 試料保持装置
JP2004103799A (ja) * 2002-09-09 2004-04-02 Canon Inc 基板保持装置、デバイス製造装置及びデバイス製造方法
JP3646720B2 (ja) * 2003-06-19 2005-05-11 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器

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