JP4843071B2 - プリント配線板の検査装置及び検査方法 - Google Patents

プリント配線板の検査装置及び検査方法 Download PDF

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JP4843071B2
JP4843071B2 JP2009135027A JP2009135027A JP4843071B2 JP 4843071 B2 JP4843071 B2 JP 4843071B2 JP 2009135027 A JP2009135027 A JP 2009135027A JP 2009135027 A JP2009135027 A JP 2009135027A JP 4843071 B2 JP4843071 B2 JP 4843071B2
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measured
net
wiring board
printed wiring
external capacitor
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JP2010283129A (ja
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頼夫 秀平
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MicroCraft KK
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MicroCraft KK
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JP2009135027A 2009-06-04 2009-06-04 プリント配線板の検査装置及び検査方法 Active JP4843071B2 (ja)

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JP2009135027A JP4843071B2 (ja) 2009-06-04 2009-06-04 プリント配線板の検査装置及び検査方法
CN200910149200.2A CN101907669B (zh) 2009-06-04 2009-07-06 印刷线路板的检查装置和检查方法

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JP2009135027A JP4843071B2 (ja) 2009-06-04 2009-06-04 プリント配線板の検査装置及び検査方法

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JP2010283129A JP2010283129A (ja) 2010-12-16
JP4843071B2 true JP4843071B2 (ja) 2011-12-21

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180001918A (ko) * 2016-06-28 2018-01-05 세메스 주식회사 반도체 소자를 검사하기 위한 인서트 조립체와 테스트 소켓의 불량 검사 방법

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013024582A (ja) * 2011-07-15 2013-02-04 Nidec-Read Corp 基板検査装置及び基板検査方法
JP5832200B2 (ja) * 2011-08-29 2015-12-16 マイクロクラフト株式会社 Ｘ線を用いた配線板の不良解析用画像の取得装置及び方法
JP2014020815A (ja) * 2012-07-13 2014-02-03 Hioki Ee Corp 基板検査装置および基板検査方法
JP5727976B2 (ja) * 2012-07-31 2015-06-03 ヤマハファインテック株式会社 プリント基板の絶縁検査装置及び絶縁検査方法
CN103323635B (zh) * 2013-06-21 2015-12-02 深圳市华星光电技术有限公司 用于检测接触效果的探针模组
JP2015111082A (ja) * 2013-12-06 2015-06-18 富士通テレコムネットワークス株式会社 布線試験装置、布線試験方法及び基準値測定装置
CN106443299B (zh) * 2016-09-27 2019-01-04 惠州市金百泽电路科技有限公司 一种侦断印制电路板台阶孔开短路功能性缺陷的检测方法
CN107167688B (zh) * 2017-05-05 2019-07-05 福耀玻璃工业集团股份有限公司 一种汽车玻璃导电印刷线的检测装置
JP6780859B2 (ja) * 2017-09-25 2020-11-04 日本電産リード株式会社 基板検査装置、及び基板検査方法
CN109164311A (zh) * 2018-07-13 2019-01-08 智车优行科技（上海）有限公司 故障检测方法和装置、电子设备
CN109727562B (zh) * 2019-01-25 2022-05-06 南京京东方显示技术有限公司 一种面板检测装置及检测方法
KR102405296B1 (ko) * 2020-05-19 2022-06-07 주식회사 에머릭스 기판 검사 장치

Family Cites Families (6)

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Publication number Priority date Publication date Assignee Title
JPH0636008B2 (ja) * 1987-02-24 1994-05-11 富士通株式会社 プリント基板試験方法
US5266901A (en) * 1992-05-29 1993-11-30 International Business Machines Corp. Apparatus and method for resistive detection and waveform analysis of interconenction networks
JPH07146323A (ja) * 1993-11-22 1995-06-06 Inter Tec:Kk 液晶表示器用ガラス基板の検査方法及び検査装置
US5438272A (en) * 1994-05-09 1995-08-01 International Business Machines Corporation Voltage-stressing and testing of networks using moving probes
JP3821171B2 (ja) * 1995-11-10 2006-09-13 オー・エイチ・ティー株式会社 検査装置及び検査方法
US6573728B2 (en) * 2001-08-29 2003-06-03 International Business Machines Corporation Method and circuit for electrical testing of isolation resistance of large capacitance network

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180001918A (ko) * 2016-06-28 2018-01-05 세메스 주식회사 반도체 소자를 검사하기 위한 인서트 조립체와 테스트 소켓의 불량 검사 방법
KR102521076B1 (ko) 2016-06-28 2023-04-12 세메스 주식회사 반도체 소자를 검사하기 위한 인서트 조립체와 테스트 소켓의 불량 검사 방법

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CN101907669A (zh) 2010-12-08
CN101907669B (zh) 2014-03-26
JP2010283129A (ja) 2010-12-16

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