JP4830807B2 - 電子装置 - Google Patents

電子装置 Download PDF

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Publication number
JP4830807B2
JP4830807B2 JP2006315321A JP2006315321A JP4830807B2 JP 4830807 B2 JP4830807 B2 JP 4830807B2 JP 2006315321 A JP2006315321 A JP 2006315321A JP 2006315321 A JP2006315321 A JP 2006315321A JP 4830807 B2 JP4830807 B2 JP 4830807B2
Authority
JP
Japan
Prior art keywords
heat
circuit board
heat sink
housing
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006315321A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008130879A5 (enExample
JP2008130879A (ja
Inventor
宣正 半田
良一 奥田
岳史 石川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2006315321A priority Critical patent/JP4830807B2/ja
Publication of JP2008130879A publication Critical patent/JP2008130879A/ja
Publication of JP2008130879A5 publication Critical patent/JP2008130879A5/ja
Application granted granted Critical
Publication of JP4830807B2 publication Critical patent/JP4830807B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2006315321A 2006-11-22 2006-11-22 電子装置 Expired - Fee Related JP4830807B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006315321A JP4830807B2 (ja) 2006-11-22 2006-11-22 電子装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006315321A JP4830807B2 (ja) 2006-11-22 2006-11-22 電子装置

Publications (3)

Publication Number Publication Date
JP2008130879A JP2008130879A (ja) 2008-06-05
JP2008130879A5 JP2008130879A5 (enExample) 2009-12-24
JP4830807B2 true JP4830807B2 (ja) 2011-12-07

Family

ID=39556400

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006315321A Expired - Fee Related JP4830807B2 (ja) 2006-11-22 2006-11-22 電子装置

Country Status (1)

Country Link
JP (1) JP4830807B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5168175B2 (ja) * 2009-02-04 2013-03-21 日立電線株式会社 光伝送モジュール
JP2014154688A (ja) * 2013-02-07 2014-08-25 Denso Corp 半導体装置およびその製造方法
JP5974988B2 (ja) 2013-06-21 2016-08-23 株式会社デンソー 電子装置
JP7531718B2 (ja) 2021-07-26 2024-08-09 三菱電機株式会社 電子装置及び電動パワーステアリング装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5138523A (en) * 1991-10-18 1992-08-11 International Business Machines Corporation Digitizer tablet having cooling apparatus with base and integrated heat sink
JP3652102B2 (ja) * 1998-02-27 2005-05-25 京セラ株式会社 電子回路モジュール
JP4407067B2 (ja) * 2001-03-14 2010-02-03 株式会社デンソー 電子装置
JP4434055B2 (ja) * 2005-03-23 2010-03-17 株式会社明電舎 電子機器ユニットの冷却構造
JP4593416B2 (ja) * 2005-09-22 2010-12-08 株式会社デンソー 電子制御装置

Also Published As

Publication number Publication date
JP2008130879A (ja) 2008-06-05

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