JP4824548B2 - 光センサ用のウィンドウ取付け - Google Patents

光センサ用のウィンドウ取付け Download PDF

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Publication number
JP4824548B2
JP4824548B2 JP2006513260A JP2006513260A JP4824548B2 JP 4824548 B2 JP4824548 B2 JP 4824548B2 JP 2006513260 A JP2006513260 A JP 2006513260A JP 2006513260 A JP2006513260 A JP 2006513260A JP 4824548 B2 JP4824548 B2 JP 4824548B2
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JP
Japan
Prior art keywords
window
housing
sensor
optical
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2006513260A
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English (en)
Japanese (ja)
Other versions
JP2006524609A5 (enExample
JP2006524609A (ja
Inventor
スタラード、チャールズ・アール．
ウェルマン、ウィリアム・エイチ．
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of JP2006524609A publication Critical patent/JP2006524609A/ja
Publication of JP2006524609A5 publication Critical patent/JP2006524609A5/ja
Application granted granted Critical
Publication of JP4824548B2 publication Critical patent/JP4824548B2/ja
Anticipated expiration legal-status Critical
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G01J1/04—Optical or mechanical part supplementary adjustable parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/028—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
JP2006513260A 2003-04-23 2004-04-23 光センサ用のウィンドウ取付け Expired - Lifetime JP4824548B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/422,391 US7002139B2 (en) 2003-04-23 2003-04-23 Window mounting for optical sensor
US10/422,391 2003-04-23
PCT/US2004/012575 WO2004094230A2 (en) 2003-04-23 2004-04-23 Window mounting for optical sensor

Publications (3)

Publication Number Publication Date
JP2006524609A JP2006524609A (ja) 2006-11-02
JP2006524609A5 JP2006524609A5 (enExample) 2007-06-21
JP4824548B2 true JP4824548B2 (ja) 2011-11-30

Family

ID=33298872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006513260A Expired - Lifetime JP4824548B2 (ja) 2003-04-23 2004-04-23 光センサ用のウィンドウ取付け

Country Status (5)

Country Link
US (1) US7002139B2 (enExample)
EP (1) EP1616357B1 (enExample)
JP (1) JP4824548B2 (enExample)
KR (1) KR100733938B1 (enExample)
WO (1) WO2004094230A2 (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7109560B2 (en) * 2002-01-18 2006-09-19 Abb Research Ltd Micro-electromechanical system and method for production thereof
US20050087615A1 (en) * 2003-10-28 2005-04-28 Benjamin Valles Thermal shielding assembly for sensors
EP1622205A3 (en) * 2004-07-29 2006-02-08 Schott AG Electronic package incorporating electronic components generating and/or receiving light-based signals
US20070057169A1 (en) * 2005-09-14 2007-03-15 Chung-Chi Hsiao Package structure for an optical sensor
US20100254154A1 (en) * 2006-04-12 2010-10-07 Flight Safety Technologies, Inc Central laser source based passive countermeasure system
JP5156475B2 (ja) * 2008-05-14 2013-03-06 株式会社キーエンス 光走査型光電スイッチ
KR200448900Y1 (ko) 2009-09-15 2010-06-07 손준해 마이크로웨이브 모션센서 하우징
WO2012129521A1 (en) * 2011-03-23 2012-09-27 Gentex Corporation Lens cleaning apparatus
WO2012148730A1 (en) * 2011-04-29 2012-11-01 Bae Systems Information And Electronic Systems Integration Inc. Replaceable dome assembly
US9500837B2 (en) 2014-06-03 2016-11-22 Goodrich Corporation Bonding structure with CTE gradient for mounting an optical element in a frame
US9683885B2 (en) * 2014-11-17 2017-06-20 Bae Systems Information And Electronic Systems Integration Inc. Dome coating for countermeasure anti-icing functionality
US10151635B1 (en) * 2017-06-08 2018-12-11 Raytheon Company Real time correction of optical window thermal gradients
US10443676B2 (en) 2017-09-20 2019-10-15 Rosemount Aerospace Inc. Isolated seeker optics
US10451892B2 (en) 2017-09-20 2019-10-22 Rosemount Aerospace Inc. Active isolation for seeker optics
EP3515153B1 (en) * 2018-01-19 2020-07-29 Axis AB Camera with heating arrangement, and method of heating a camera viewing window
CN108760631B (zh) * 2018-05-24 2024-01-30 中国人民解放军陆军沈阳军事代表局驻长春地区军事代表室 一种具有温度自适应功能的光学窗口
DE102020203075A1 (de) * 2019-05-26 2020-11-26 Robert Bosch Gesellschaft mit beschränkter Haftung Dichtungsanordnung zur statischen Abdichtung einer vereisungsgefährdeten Bauteilkomponente
ES2956368T3 (es) * 2020-03-04 2023-12-20 Ott Hydromet B V Cúpula transparente para un piranómetro
JP2021162730A (ja) * 2020-03-31 2021-10-11 パナソニックＩｐマネジメント株式会社 撮像装置および車両用視認装置
JP7205622B2 (ja) * 2020-04-17 2023-01-17 株式会社村田製作所 振動装置
DE102020206549A1 (de) * 2020-05-26 2021-12-02 Siemens Mobility GmbH Sensormodul sowie Schienenfahrzeug mit einem solchen Sensormodul
CN113511341B (zh) * 2021-07-01 2023-04-28 中国电子科技集团公司第十一研究所 一种新型光电吊舱光窗安装结构及其安装方法
CN114228955A (zh) * 2021-12-02 2022-03-25 中国科学院西安光学精密机械研究所 一种半球型光学窗口的万米级耐压密封舱
US11807353B2 (en) * 2022-02-01 2023-11-07 The Boeing Company Hypersonic aircraft window system
TWI860757B (zh) * 2023-06-21 2024-11-01 佳凌科技股份有限公司 除霧鏡頭鏡筒結構

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4621279A (en) * 1983-10-13 1986-11-04 Telefunken Electronic Gmbh Non-evacuated, rapidly coolable housing for an opto-electronic semiconductor component
FR2583890A1 (fr) * 1985-06-24 1986-12-26 Telecommunications Sa Hublot d'etancheite pour systeme optronique infrarouge
US4699335A (en) * 1985-10-16 1987-10-13 The United States Of America As Represented By The Secretary Of The Air Force Aircraft window clamping device
JPH07234100A (ja) * 1993-08-23 1995-09-05 Hughes Aircraft Co センサ窓のコンプライアントな取付け装置
US6130448A (en) * 1998-08-21 2000-10-10 Gentex Corporation Optical sensor package and method of making same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5812479A (ja) 1981-07-15 1983-01-24 Hitachi Ltd 固体撮像装置
FR2606148B1 (fr) * 1986-10-31 1989-01-06 Oreal Dispositif destine a tester a chaud la resistance mecanique de recipients pressurises
DE19604201A1 (de) * 1996-02-06 1997-08-07 Braun Ag Schutzkappe
US6097553A (en) * 1999-02-01 2000-08-01 Raytheon Company Window structure with non-radial mounting support having graded thermal expansion

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4621279A (en) * 1983-10-13 1986-11-04 Telefunken Electronic Gmbh Non-evacuated, rapidly coolable housing for an opto-electronic semiconductor component
FR2583890A1 (fr) * 1985-06-24 1986-12-26 Telecommunications Sa Hublot d'etancheite pour systeme optronique infrarouge
US4699335A (en) * 1985-10-16 1987-10-13 The United States Of America As Represented By The Secretary Of The Air Force Aircraft window clamping device
JPH07234100A (ja) * 1993-08-23 1995-09-05 Hughes Aircraft Co センサ窓のコンプライアントな取付け装置
US6130448A (en) * 1998-08-21 2000-10-10 Gentex Corporation Optical sensor package and method of making same

Also Published As

Publication number Publication date
KR20060006044A (ko) 2006-01-18
WO2004094230A2 (en) 2004-11-04
WO2004094230A3 (en) 2005-01-06
EP1616357B1 (en) 2016-01-06
JP2006524609A (ja) 2006-11-02
EP1616357A2 (en) 2006-01-18
KR100733938B1 (ko) 2007-06-29
US20040211892A1 (en) 2004-10-28
US7002139B2 (en) 2006-02-21

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