KR100733938B1 - 광학 센서 커버 시스템 - Google Patents

광학 센서 커버 시스템 Download PDF

Info

Publication number
KR100733938B1
KR100733938B1 KR1020057019957A KR20057019957A KR100733938B1 KR 100733938 B1 KR100733938 B1 KR 100733938B1 KR 1020057019957 A KR1020057019957 A KR 1020057019957A KR 20057019957 A KR20057019957 A KR 20057019957A KR 100733938 B1 KR100733938 B1 KR 100733938B1
Authority
KR
South Korea
Prior art keywords
window
housing
optical
optics
delete delete
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020057019957A
Other languages
English (en)
Korean (ko)
Other versions
KR20060006044A (ko
Inventor
챨스 알. 스탈라드
윌리암 에이치. 웰맨
Original Assignee
레이던 컴퍼니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 레이던 컴퍼니 filed Critical 레이던 컴퍼니
Publication of KR20060006044A publication Critical patent/KR20060006044A/ko
Application granted granted Critical
Publication of KR100733938B1 publication Critical patent/KR100733938B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G01J1/04—Optical or mechanical part supplementary adjustable parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/028—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
KR1020057019957A 2003-04-23 2004-04-23 광학 센서 커버 시스템 Expired - Fee Related KR100733938B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/422,391 US7002139B2 (en) 2003-04-23 2003-04-23 Window mounting for optical sensor
US10/422,391 2003-04-23

Publications (2)

Publication Number Publication Date
KR20060006044A KR20060006044A (ko) 2006-01-18
KR100733938B1 true KR100733938B1 (ko) 2007-06-29

Family

ID=33298872

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057019957A Expired - Fee Related KR100733938B1 (ko) 2003-04-23 2004-04-23 광학 센서 커버 시스템

Country Status (5)

Country Link
US (1) US7002139B2 (enExample)
EP (1) EP1616357B1 (enExample)
JP (1) JP4824548B2 (enExample)
KR (1) KR100733938B1 (enExample)
WO (1) WO2004094230A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200448900Y1 (ko) 2009-09-15 2010-06-07 손준해 마이크로웨이브 모션센서 하우징

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7109560B2 (en) * 2002-01-18 2006-09-19 Abb Research Ltd Micro-electromechanical system and method for production thereof
US20050087615A1 (en) * 2003-10-28 2005-04-28 Benjamin Valles Thermal shielding assembly for sensors
EP1622205A3 (en) * 2004-07-29 2006-02-08 Schott AG Electronic package incorporating electronic components generating and/or receiving light-based signals
US20070057169A1 (en) * 2005-09-14 2007-03-15 Chung-Chi Hsiao Package structure for an optical sensor
US20100254154A1 (en) * 2006-04-12 2010-10-07 Flight Safety Technologies, Inc Central laser source based passive countermeasure system
JP5156475B2 (ja) * 2008-05-14 2013-03-06 株式会社キーエンス 光走査型光電スイッチ
WO2012129521A1 (en) * 2011-03-23 2012-09-27 Gentex Corporation Lens cleaning apparatus
WO2012148730A1 (en) * 2011-04-29 2012-11-01 Bae Systems Information And Electronic Systems Integration Inc. Replaceable dome assembly
US9500837B2 (en) 2014-06-03 2016-11-22 Goodrich Corporation Bonding structure with CTE gradient for mounting an optical element in a frame
US9683885B2 (en) * 2014-11-17 2017-06-20 Bae Systems Information And Electronic Systems Integration Inc. Dome coating for countermeasure anti-icing functionality
US10151635B1 (en) * 2017-06-08 2018-12-11 Raytheon Company Real time correction of optical window thermal gradients
US10443676B2 (en) 2017-09-20 2019-10-15 Rosemount Aerospace Inc. Isolated seeker optics
US10451892B2 (en) 2017-09-20 2019-10-22 Rosemount Aerospace Inc. Active isolation for seeker optics
EP3515153B1 (en) * 2018-01-19 2020-07-29 Axis AB Camera with heating arrangement, and method of heating a camera viewing window
CN108760631B (zh) * 2018-05-24 2024-01-30 中国人民解放军陆军沈阳军事代表局驻长春地区军事代表室 一种具有温度自适应功能的光学窗口
DE102020203075A1 (de) * 2019-05-26 2020-11-26 Robert Bosch Gesellschaft mit beschränkter Haftung Dichtungsanordnung zur statischen Abdichtung einer vereisungsgefährdeten Bauteilkomponente
ES2956368T3 (es) * 2020-03-04 2023-12-20 Ott Hydromet B V Cúpula transparente para un piranómetro
JP2021162730A (ja) * 2020-03-31 2021-10-11 パナソニックＩｐマネジメント株式会社 撮像装置および車両用視認装置
JP7205622B2 (ja) * 2020-04-17 2023-01-17 株式会社村田製作所 振動装置
DE102020206549A1 (de) * 2020-05-26 2021-12-02 Siemens Mobility GmbH Sensormodul sowie Schienenfahrzeug mit einem solchen Sensormodul
CN113511341B (zh) * 2021-07-01 2023-04-28 中国电子科技集团公司第十一研究所 一种新型光电吊舱光窗安装结构及其安装方法
CN114228955A (zh) * 2021-12-02 2022-03-25 中国科学院西安光学精密机械研究所 一种半球型光学窗口的万米级耐压密封舱
US11807353B2 (en) * 2022-02-01 2023-11-07 The Boeing Company Hypersonic aircraft window system
TWI860757B (zh) * 2023-06-21 2024-11-01 佳凌科技股份有限公司 除霧鏡頭鏡筒結構

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4621279A (en) * 1983-10-13 1986-11-04 Telefunken Electronic Gmbh Non-evacuated, rapidly coolable housing for an opto-electronic semiconductor component
FR2583890A1 (fr) * 1985-06-24 1986-12-26 Telecommunications Sa Hublot d'etancheite pour systeme optronique infrarouge
US4699335A (en) * 1985-10-16 1987-10-13 The United States Of America As Represented By The Secretary Of The Air Force Aircraft window clamping device
US6130448A (en) 1998-08-21 2000-10-10 Gentex Corporation Optical sensor package and method of making same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5812479A (ja) 1981-07-15 1983-01-24 Hitachi Ltd 固体撮像装置
FR2606148B1 (fr) * 1986-10-31 1989-01-06 Oreal Dispositif destine a tester a chaud la resistance mecanique de recipients pressurises
US5366178A (en) * 1993-08-23 1994-11-22 Hughes Aircraft Company Sensor window compliant mounting assembly
DE19604201A1 (de) * 1996-02-06 1997-08-07 Braun Ag Schutzkappe
US6097553A (en) * 1999-02-01 2000-08-01 Raytheon Company Window structure with non-radial mounting support having graded thermal expansion

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4621279A (en) * 1983-10-13 1986-11-04 Telefunken Electronic Gmbh Non-evacuated, rapidly coolable housing for an opto-electronic semiconductor component
FR2583890A1 (fr) * 1985-06-24 1986-12-26 Telecommunications Sa Hublot d'etancheite pour systeme optronique infrarouge
US4699335A (en) * 1985-10-16 1987-10-13 The United States Of America As Represented By The Secretary Of The Air Force Aircraft window clamping device
US6130448A (en) 1998-08-21 2000-10-10 Gentex Corporation Optical sensor package and method of making same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200448900Y1 (ko) 2009-09-15 2010-06-07 손준해 마이크로웨이브 모션센서 하우징

Also Published As

Publication number Publication date
KR20060006044A (ko) 2006-01-18
WO2004094230A2 (en) 2004-11-04
WO2004094230A3 (en) 2005-01-06
EP1616357B1 (en) 2016-01-06
JP4824548B2 (ja) 2011-11-30
JP2006524609A (ja) 2006-11-02
EP1616357A2 (en) 2006-01-18
US20040211892A1 (en) 2004-10-28
US7002139B2 (en) 2006-02-21

Similar Documents

Publication Publication Date Title
KR100733938B1 (ko) 광학 센서 커버 시스템
JP2006524609A5 (enExample)
US11606484B2 (en) Image pickup apparatus
CN111595441B (zh) 光源模块
KR102236109B1 (ko) 위성 탑재 적외선 센서 교정용 흑체 시스템
KR20220115258A (ko) 카메라 모듈
US10263609B2 (en) Oven controlled crystal oscillator device cover
CN118011581A (zh) 深低温多波段冷光学系统
US7332720B2 (en) Cold shield for cryogenic camera
US11874432B2 (en) Space optical instrument comprising an improved thermal guard
EP0252126B1 (en) Maintenance of uniform optical window properties
US20150253117A1 (en) Installation structure of seeker window and flying object with seeker window
CN114546002B (zh) 深空光学载荷主镜部件的高精度温控装置
CN218524939U (zh) 一种小型化的成像系统
US12001124B2 (en) Image pickup apparatus
CN218998164U (zh) 成像系统及摄像头
JP2625821B2 (ja) 人工衛星の熱制御装置
JPH0764320B2 (ja) 放熱板
CN120447283A (zh) 光学装置
JP2025070024A (ja) レンズユニット及びカメラモジュール
TWM657883U (zh) 具有內嵌加熱片的鏡頭結構
US9683885B2 (en) Dome coating for countermeasure anti-icing functionality
TW202532907A (zh) 加熱型光學裝置
GB2245377A (en) An optoelectronic system
JPH07137700A (ja) サーマルルーバ

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

A201 Request for examination
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

G170 Re-publication after modification of scope of protection [patent]
PG1701 Publication of correction

St.27 status event code: A-5-5-P10-P19-oth-PG1701

Patent document republication publication date: 20080425

Republication note text: Request for Correction Notice (Document Request)

Gazette number: 1007339380000

Gazette reference publication date: 20070629

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20100626

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20100626