JP4824299B2 - 集積回路構造のプロファイルを決定する方法及びシステム又はコンピュータ読取可能な記録媒体 - Google Patents

集積回路構造のプロファイルを決定する方法及びシステム又はコンピュータ読取可能な記録媒体 Download PDF

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JP4824299B2
JP4824299B2 JP2004356910A JP2004356910A JP4824299B2 JP 4824299 B2 JP4824299 B2 JP 4824299B2 JP 2004356910 A JP2004356910 A JP 2004356910A JP 2004356910 A JP2004356910 A JP 2004356910A JP 4824299 B2 JP4824299 B2 JP 4824299B2
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profile
measurement signal
parameter
simulated measurement
parameters
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JP2005172830A (ja
JP2005172830A5 (https=
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パオ ジュンウェイ
ブオング ビ
マドリアガ マニュエル
プラガー ダニエル
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ティンバー テクノロジーズ，インコーポレイティド
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/303—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces using photoelectric detection means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
JP2004356910A 2003-12-12 2004-12-09 集積回路構造のプロファイルを決定する方法及びシステム又はコンピュータ読取可能な記録媒体 Expired - Fee Related JP4824299B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/735,212 US7126700B2 (en) 2003-12-12 2003-12-12 Parametric optimization of optical metrology model
US10/735212 2003-12-12

Publications (3)

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JP2005172830A JP2005172830A (ja) 2005-06-30
JP2005172830A5 JP2005172830A5 (https=) 2008-01-17
JP4824299B2 true JP4824299B2 (ja) 2011-11-30

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US (1) US7126700B2 (https=)
EP (1) EP1541960A3 (https=)
JP (1) JP4824299B2 (https=)

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KR102468971B1 (ko) 2015-03-24 2022-11-18 케이엘에이 코포레이션 모델 기반 단일 파라미터 측정

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US20050128489A1 (en) 2005-06-16
US7126700B2 (en) 2006-10-24
JP2005172830A (ja) 2005-06-30
EP1541960A2 (en) 2005-06-15
EP1541960A3 (en) 2009-01-07

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