JP4817791B2 - 加熱基板支持体及びその製造方法 - Google Patents
加熱基板支持体及びその製造方法 Download PDFInfo
- Publication number
- JP4817791B2 JP4817791B2 JP2005296615A JP2005296615A JP4817791B2 JP 4817791 B2 JP4817791 B2 JP 4817791B2 JP 2005296615 A JP2005296615 A JP 2005296615A JP 2005296615 A JP2005296615 A JP 2005296615A JP 4817791 B2 JP4817791 B2 JP 4817791B2
- Authority
- JP
- Japan
- Prior art keywords
- groove
- substrate support
- heating element
- heat sink
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Vapour Deposition (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/965,601 | 2004-10-13 | ||
| US10/965,601 US20060075970A1 (en) | 2004-10-13 | 2004-10-13 | Heated substrate support and method of fabricating same |
| US11/115,575 US7674338B2 (en) | 2004-10-13 | 2005-04-26 | Heated substrate support and method of fabricating same |
| US11/115,575 | 2005-04-26 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006111973A JP2006111973A (ja) | 2006-04-27 |
| JP2006111973A5 JP2006111973A5 (enExample) | 2011-08-04 |
| JP4817791B2 true JP4817791B2 (ja) | 2011-11-16 |
Family
ID=36380726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005296615A Expired - Fee Related JP4817791B2 (ja) | 2004-10-13 | 2005-10-11 | 加熱基板支持体及びその製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4817791B2 (enExample) |
| KR (1) | KR20060052233A (enExample) |
| TW (1) | TWI289610B (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009535801A (ja) * | 2006-04-28 | 2009-10-01 | ダンスン エレクトロン カンパニー リミテッド | サセプタの製造方法、及び、この方法によって製造されたサセプタ |
| JP7497354B2 (ja) * | 2018-12-07 | 2024-06-10 | アプライド マテリアルズ インコーポレイテッド | 部品、部品を製造する方法、及び部品を洗浄する方法 |
| JP2023166746A (ja) * | 2022-05-10 | 2023-11-22 | 東京エレクトロン株式会社 | 加熱装置及び基板処理装置 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2222192A (en) * | 1938-10-12 | 1940-11-19 | Westinghouse Electric & Mfg Co | Flatiron |
| US2389588A (en) * | 1942-10-29 | 1945-11-27 | Westinghouse Electric Corp | Heating apparatus |
| US2541118A (en) * | 1945-04-11 | 1951-02-13 | Birtman Electric Co | Resistance element for electric irons |
| US5104459A (en) * | 1989-11-28 | 1992-04-14 | Atlantic Richfield Company | Method of forming aluminum alloy sheet |
| US5844205A (en) * | 1996-04-19 | 1998-12-01 | Applied Komatsu Technology, Inc. | Heated substrate support structure |
| JP3345852B2 (ja) * | 1998-06-18 | 2002-11-18 | 古河電気工業株式会社 | 半導体製造装置の基盤ホルダー及びその製造方法 |
| US6376815B1 (en) * | 1998-01-12 | 2002-04-23 | Furukawa Electric Co., Ltd. | Highly gas tight substrate holder and method of manufacturing the same |
| JP2000243542A (ja) * | 1999-02-24 | 2000-09-08 | Nhk Spring Co Ltd | ヒータユニット及びその製造方法 |
| US6897411B2 (en) * | 2002-02-11 | 2005-05-24 | Applied Materials, Inc. | Heated substrate support |
| US7154070B2 (en) * | 2004-10-08 | 2006-12-26 | Furukawa-Sky Aluminum Corp. | Heater plate and a method for manufacturing the heater plate |
-
2005
- 2005-08-17 TW TW94128097A patent/TWI289610B/zh not_active IP Right Cessation
- 2005-10-11 JP JP2005296615A patent/JP4817791B2/ja not_active Expired - Fee Related
- 2005-10-12 KR KR1020050096102A patent/KR20060052233A/ko not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| KR20060052233A (ko) | 2006-05-19 |
| JP2006111973A (ja) | 2006-04-27 |
| TW200632124A (en) | 2006-09-16 |
| TWI289610B (en) | 2007-11-11 |
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Legal Events
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| LAPS | Cancellation because of no payment of annual fees |