JP4817791B2 - 加熱基板支持体及びその製造方法 - Google Patents

加熱基板支持体及びその製造方法 Download PDF

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Publication number
JP4817791B2
JP4817791B2 JP2005296615A JP2005296615A JP4817791B2 JP 4817791 B2 JP4817791 B2 JP 4817791B2 JP 2005296615 A JP2005296615 A JP 2005296615A JP 2005296615 A JP2005296615 A JP 2005296615A JP 4817791 B2 JP4817791 B2 JP 4817791B2
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Japan
Prior art keywords
groove
substrate support
heating element
heat sink
substrate
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Expired - Fee Related
Application number
JP2005296615A
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English (en)
Japanese (ja)
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JP2006111973A5 (enExample
JP2006111973A (ja
Inventor
エー. グエンザー ロルフ
ビー. ハミル カーチス
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Applied Materials Inc
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Applied Materials Inc
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Publication date
Priority claimed from US10/965,601 external-priority patent/US20060075970A1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2006111973A publication Critical patent/JP2006111973A/ja
Publication of JP2006111973A5 publication Critical patent/JP2006111973A5/ja
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Publication of JP4817791B2 publication Critical patent/JP4817791B2/ja
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Expired - Fee Related legal-status Critical Current

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Vapour Deposition (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
JP2005296615A 2004-10-13 2005-10-11 加熱基板支持体及びその製造方法 Expired - Fee Related JP4817791B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US10/965,601 2004-10-13
US10/965,601 US20060075970A1 (en) 2004-10-13 2004-10-13 Heated substrate support and method of fabricating same
US11/115,575 US7674338B2 (en) 2004-10-13 2005-04-26 Heated substrate support and method of fabricating same
US11/115,575 2005-04-26

Publications (3)

Publication Number Publication Date
JP2006111973A JP2006111973A (ja) 2006-04-27
JP2006111973A5 JP2006111973A5 (enExample) 2011-08-04
JP4817791B2 true JP4817791B2 (ja) 2011-11-16

Family

ID=36380726

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005296615A Expired - Fee Related JP4817791B2 (ja) 2004-10-13 2005-10-11 加熱基板支持体及びその製造方法

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JP (1) JP4817791B2 (enExample)
KR (1) KR20060052233A (enExample)
TW (1) TWI289610B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009535801A (ja) * 2006-04-28 2009-10-01 ダンスン エレクトロン カンパニー リミテッド サセプタの製造方法、及び、この方法によって製造されたサセプタ
JP7497354B2 (ja) * 2018-12-07 2024-06-10 アプライド マテリアルズ インコーポレイテッド 部品、部品を製造する方法、及び部品を洗浄する方法
JP2023166746A (ja) * 2022-05-10 2023-11-22 東京エレクトロン株式会社 加熱装置及び基板処理装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2222192A (en) * 1938-10-12 1940-11-19 Westinghouse Electric & Mfg Co Flatiron
US2389588A (en) * 1942-10-29 1945-11-27 Westinghouse Electric Corp Heating apparatus
US2541118A (en) * 1945-04-11 1951-02-13 Birtman Electric Co Resistance element for electric irons
US5104459A (en) * 1989-11-28 1992-04-14 Atlantic Richfield Company Method of forming aluminum alloy sheet
US5844205A (en) * 1996-04-19 1998-12-01 Applied Komatsu Technology, Inc. Heated substrate support structure
JP3345852B2 (ja) * 1998-06-18 2002-11-18 古河電気工業株式会社 半導体製造装置の基盤ホルダー及びその製造方法
US6376815B1 (en) * 1998-01-12 2002-04-23 Furukawa Electric Co., Ltd. Highly gas tight substrate holder and method of manufacturing the same
JP2000243542A (ja) * 1999-02-24 2000-09-08 Nhk Spring Co Ltd ヒータユニット及びその製造方法
US6897411B2 (en) * 2002-02-11 2005-05-24 Applied Materials, Inc. Heated substrate support
US7154070B2 (en) * 2004-10-08 2006-12-26 Furukawa-Sky Aluminum Corp. Heater plate and a method for manufacturing the heater plate

Also Published As

Publication number Publication date
KR20060052233A (ko) 2006-05-19
JP2006111973A (ja) 2006-04-27
TW200632124A (en) 2006-09-16
TWI289610B (en) 2007-11-11

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