JP4816034B2 - 処理方法及び処理装置 - Google Patents
処理方法及び処理装置 Download PDFInfo
- Publication number
- JP4816034B2 JP4816034B2 JP2005347614A JP2005347614A JP4816034B2 JP 4816034 B2 JP4816034 B2 JP 4816034B2 JP 2005347614 A JP2005347614 A JP 2005347614A JP 2005347614 A JP2005347614 A JP 2005347614A JP 4816034 B2 JP4816034 B2 JP 4816034B2
- Authority
- JP
- Japan
- Prior art keywords
- vapor deposition
- gas
- nozzle
- jet port
- port
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005347614A JP4816034B2 (ja) | 2005-12-01 | 2005-12-01 | 処理方法及び処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005347614A JP4816034B2 (ja) | 2005-12-01 | 2005-12-01 | 処理方法及び処理装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007154225A JP2007154225A (ja) | 2007-06-21 |
| JP2007154225A5 JP2007154225A5 (enExample) | 2008-07-10 |
| JP4816034B2 true JP4816034B2 (ja) | 2011-11-16 |
Family
ID=38238966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005347614A Expired - Fee Related JP4816034B2 (ja) | 2005-12-01 | 2005-12-01 | 処理方法及び処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4816034B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110014653A (ko) * | 2008-05-19 | 2011-02-11 | 이 아이 듀폰 디 네모아 앤드 캄파니 | 전자 소자에서 증기 코팅 장치 및 방법 |
| KR101441737B1 (ko) | 2009-05-01 | 2014-09-17 | 카티바, 인크. | 유기 증기 인쇄용 장치 및 방법 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3345079B2 (ja) * | 1993-02-26 | 2002-11-18 | 株式会社半導体エネルギー研究所 | 大気圧放電装置 |
| JPH07258828A (ja) * | 1994-03-24 | 1995-10-09 | Matsushita Electric Works Ltd | 膜形成方法 |
-
2005
- 2005-12-01 JP JP2005347614A patent/JP4816034B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007154225A (ja) | 2007-06-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI660420B (zh) | 使用遠端電漿源之加強式蝕刻製程 | |
| US6670766B2 (en) | Plasma treatment apparatus and plasma treatment method | |
| TWI381414B (zh) | 圖案之製造方法及液滴吐出裝置 | |
| AU2014349815B2 (en) | Method for generating an atmospheric plasma jet and atmospheric plasma minitorch device | |
| JP7224096B2 (ja) | プラズマ処理装置用部品の溶射方法及びプラズマ処理装置用部品 | |
| US20210183617A1 (en) | Plasma source and method for removing materials from substrates utilizing pressure waves | |
| JP6048794B2 (ja) | ノズルプレート、ノズルプレートの製造方法、インクジェットヘッド及びインクジェット印刷装置 | |
| WO2004070809A1 (ja) | 表示装置の作製方法 | |
| JP2010103455A (ja) | プラズマ処理装置 | |
| JP2004160388A (ja) | 薄膜の作成方法と作成装置 | |
| JP2009054763A (ja) | 金属酸化物半導体の製造方法及びこれを用い作製された酸化物半導体薄膜を用いた薄膜トランジスタ | |
| TWI233325B (en) | Forming method of pattern, manufacturing method of apparatus, optoelectronic device and electronic machine | |
| JP2007043148A (ja) | プラズマエッチング装置 | |
| JP4816034B2 (ja) | 処理方法及び処理装置 | |
| JP2002151480A (ja) | 半導体素子の処理方法及びその装置 | |
| JP2003317998A (ja) | 放電プラズマ処理方法及びその装置 | |
| JP2010209281A (ja) | 基材の被膜形成方法および装置 | |
| JP2008231471A (ja) | 進行プラズマ成膜方法、プラズマ焼成基材及びプラズマ成膜装置 | |
| US6350961B1 (en) | Method and device for improving surfaces | |
| CN2659541Y (zh) | 用于衬底处理室的气体喷嘴 | |
| JP4395931B2 (ja) | インク噴射装置のノズルプレートの製造方法 | |
| JP2024029764A (ja) | プラズマ発生装置、プラズマ発生方法及びエッチング方法 | |
| JP7110018B2 (ja) | プラズマ処理インクジェット印刷装置 | |
| JP2004211161A (ja) | プラズマ発生装置 | |
| JP3984514B2 (ja) | プラズマ処理装置およびプラズマ処理方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080526 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080526 |
|
| RD01 | Notification of change of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7421 Effective date: 20091127 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20100602 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110621 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110630 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110802 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110815 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140909 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140909 Year of fee payment: 3 |
|
| LAPS | Cancellation because of no payment of annual fees |