JP4805569B2 - 半導体素子製造装備の洗浄方法 - Google Patents
半導体素子製造装備の洗浄方法 Download PDFInfo
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- JP4805569B2 JP4805569B2 JP2004356844A JP2004356844A JP4805569B2 JP 4805569 B2 JP4805569 B2 JP 4805569B2 JP 2004356844 A JP2004356844 A JP 2004356844A JP 2004356844 A JP2004356844 A JP 2004356844A JP 4805569 B2 JP4805569 B2 JP 4805569B2
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- 239000004065 semiconductor Substances 0.000 title claims description 224
- 238000004519 manufacturing process Methods 0.000 title claims description 103
- 238000000034 method Methods 0.000 title claims description 59
- 238000004140 cleaning Methods 0.000 title claims description 50
- 239000000758 substrate Substances 0.000 claims description 101
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 80
- 239000006227 byproduct Substances 0.000 claims description 78
- 238000010438 heat treatment Methods 0.000 claims description 69
- 239000007789 gas Substances 0.000 claims description 65
- 229910044991 metal oxide Inorganic materials 0.000 claims description 49
- 150000004706 metal oxides Chemical class 0.000 claims description 49
- 239000002994 raw material Substances 0.000 claims description 10
- 230000008016 vaporization Effects 0.000 claims description 6
- 239000000047 product Substances 0.000 claims description 3
- 150000004767 nitrides Chemical class 0.000 claims 4
- 239000003989 dielectric material Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 4
- 229910007926 ZrCl Inorganic materials 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 2
- BGGIUGXMWNKMCP-UHFFFAOYSA-N 2-methylpropan-2-olate;zirconium(4+) Chemical compound CC(C)(C)O[Zr](OC(C)(C)C)(OC(C)(C)C)OC(C)(C)C BGGIUGXMWNKMCP-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- -1 As shown in FIG. 1B Substances 0.000 description 1
- SEQDDYPDSLOBDC-UHFFFAOYSA-N Temazepam Chemical compound N=1C(O)C(=O)N(C)C2=CC=C(Cl)C=C2C=1C1=CC=CC=C1 SEQDDYPDSLOBDC-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- UCRXQUVKDMVBBM-UHFFFAOYSA-N benzyl 2-amino-3-(4-phenylmethoxyphenyl)propanoate Chemical compound C=1C=CC=CC=1COC(=O)C(N)CC(C=C1)=CC=C1OCC1=CC=CC=C1 UCRXQUVKDMVBBM-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/905—Cleaning of reaction chamber
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- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Semiconductor Memories (AREA)
Description
図2及び図3A〜図3Fを参照して、本発明の第1の実施形態による半導体素子製造装備の洗浄方法について詳細に説明する。図2は、本発明の第1の実施形態による半導体素子製造装備の洗浄方法を示すフローチャートであり、図3A〜図3Fは、本発明の第1の実施形態による半導体素子製造装備の洗浄方法を示す断面図である。
半導体素子製造装備内でNH3ガスとTiCl4ガスとを原料ガスとして用いてHf酸化物を含む金属酸化膜が形成されている半導体基板にTiN膜質を形成した。そして半導体基板を半導体素子製造装備の外部に搬出して、半導体基板がない状態で半導体素子製造装備の加熱部上に残留する副産物と半導体素子製造装備の原料ガス提供部の表面に残留する副産物の成分を分析した。
本発明の第2の実施形態による半導体素子製造装備の洗浄方法を遂行した後に半導体素子製造装備の加熱部上に残留する副産物と半導体素子製造装備の原料ガス提供部の表面に残留する副産物の成分を分析した。
(産業上の利用可能性)
Claims (17)
- 半導体素子製造装備内でTiCl 4 とNH 3 の原料ガスを用いて、Hf酸化物又はZr酸化物からなる金属酸化膜が形成されている半導体基板にTiN膜質を形成する段階と、
前記半導体基板を前記半導体素子製造装備内部の加熱部上から外部に搬出させ、前記半導体基板がない状態で前記原料ガスと前記金属酸化膜とが反応して前記加熱部の表面に生成される副産物を除去する段階と、を含むことを特徴とする半導体素子製造装備の洗浄方法。 - 前記副産物を除去する段階は、前記TiN膜質を形成する段階が遂行される毎に実施することを特徴とする請求項1に記載の半導体素子製造装備の洗浄方法。
- 前記副産物は、Hf酸化物、Hf窒化物、Zr酸化物、又はZr窒化物であることを特徴とする請求項1に記載の半導体素子製造装備の洗浄方法。
- 前記副産物を除去する段階では、前記副産物をTiCl4 ガスを用いて気化させることを特徴とする請求項1に記載の半導体素子製造装備の洗浄方法。
- 前記半導体基板に前記TiN膜質を形成する段階以前に、前記半導体基板がない状態で前記加熱部の表面にTiCl 4 とNH 3 の原料ガスを用いてTiN膜質を形成する段階をさらに含むことを特徴とする請求項1に記載の半導体素子製造装備の洗浄方法。
- 前記加熱部の表面に前記TiN膜質を形成する段階では、
前記加熱部の表面の前記半導体基板が置かれる領域を除外して前記TiN膜質が形成されることを特徴とする請求項5に記載の半導体素子製造装備の洗浄方法。 - 前記加熱部の表面に生成される前記副産物を気化させた後に、前記加熱部の全面にTiCl 4 とNH 3 の原料ガスを用いてTiN膜質を形成する段階を含むことを特徴とする請求項4に記載の半導体素子製造装備の洗浄方法。
- 前記加熱部の全面に前記TiN膜質を形成する段階では、前記半導体基板が置かれる領域における前記加熱部上に形成されるTiN膜質の厚さは、5Å〜20Åであることを特徴とする請求項7に記載の半導体素子製造装備の洗浄方法。
- 前記半導体基板に前記TiN膜質を形成する段階及び前記加熱部の全面に前記TiN膜質を形成する段階を反復して遂行した後、前記加熱部上に蓄積している前記TiN膜質を除去する段階をさらに含むことを特徴とする請求項7に記載の半導体素子製造装備の洗浄方法。
- 前記TiN膜質を除去する段階では、
前記半導体基板が置かれる領域の前記加熱部上に蓄積している前記TiN膜質の厚さが7000Å以上である場合に除去することを特徴とする請求項9に記載の半導体素子製造装備の洗浄方法。 - 前記TiN膜質を除去する段階では、
前記加熱部上に蓄積されている前記TiN膜質は、ClF3ガスを用いて除去することを特徴とする請求項9に記載の半導体素子製造装備の洗浄方法。 - Hf酸化物又はZr酸化物からなる金属酸化膜を含む半導体基板を準備する段階と、
半導体素子製造装備の内部に前記半導体基板を搬入し、前記半導体素子製造装備内部の加熱部の所定の位置に前記半導体基板を位置させる段階と、
TiCl4とNH3の原料ガスを前記半導体素子製造装備に注入して前記金属酸化膜の上部にTiN膜質を形成する段階と、
前記半導体基板を前記半導体素子製造装備の外部に搬出させる段階と、
前記原料ガスと前記金属酸化膜とが反応して生成される副産物をTiCl4 ガスを用いて気化させる段階と、
を含むことを特徴とする半導体素子製造装備の洗浄方法。 - 前記原料ガスは、前記半導体基板が前記半導体素子製造装備に搬入される前に前記半導体素子製造装備に注入されることを特徴とする請求項12に記載の半導体素子製造装備の洗浄方法。
- 前記加熱部の上部の前記半導体基板が置かれる領域にダミー半導体基板を位置させた状態で前記半導体素子製造装備に前記原料ガスを注入させる段階をさらに含み、
前記加熱部の上部の前記半導体基板が置かれる領域を除外しTiN膜質が形成されることを特徴とする請求項13に記載の半導体素子製造装備の洗浄方法。 - 前記副産物をTiCl4 ガスを用いて気化させる段階後に、前記半導体基板が置かれる領域の前記加熱部上に前記半導体基板がない状態で前記半導体素子製造装備にTiCl4とNH3 の原料ガスを供給する段階をさらに含み、
前記半導体基板が置かれる領域の前記加熱部上には、TiN膜質が形成されることを特徴とする請求項12に記載の半導体素子製造装備の洗浄方法。 - 前記半導体基板が置かれる領域の前記加熱部上に蓄積される前記TiN膜質の厚さが7000Å以上である場合に前記TiN膜質を除去する段階をさらに含むことを特徴とする請求項15に記載の半導体素子製造装備の洗浄方法。
- 前記副産物は、Hf酸化物、Hf窒化物、Zr酸化物、又はZr窒化物であることを特徴とする請求項12に記載の半導体素子製造装備の洗浄方法。
Applications Claiming Priority (2)
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KR1020030090202A KR100568256B1 (ko) | 2003-12-11 | 2003-12-11 | 반도체 소자 제조 장비의 세정 방법 |
KR2003-090202 | 2003-12-11 |
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JP2005171386A JP2005171386A (ja) | 2005-06-30 |
JP4805569B2 true JP4805569B2 (ja) | 2011-11-02 |
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US (2) | US7141512B2 (ja) |
JP (1) | JP4805569B2 (ja) |
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KR100568256B1 (ko) * | 2003-12-11 | 2006-04-07 | 삼성전자주식회사 | 반도체 소자 제조 장비의 세정 방법 |
KR101234690B1 (ko) * | 2006-07-31 | 2013-02-19 | 삼성전자주식회사 | 유전막을 갖는 반도체 소자 및 그 형성방법 |
KR101603737B1 (ko) * | 2010-05-11 | 2016-03-16 | 삼성전자주식회사 | 기상 세정을 이용한 금속 잔류물 제거 방법, 도전막 패턴의 형성 방법, 반도체 소자의 제조 방법 및 관련 설비 |
US20120171797A1 (en) * | 2010-12-08 | 2012-07-05 | Applied Materials, Inc. | Seasoning of deposition chamber for dopant profile control in led film stacks |
CN105551954A (zh) * | 2016-01-27 | 2016-05-04 | 武汉新芯集成电路制造有限公司 | 一种沉积氮化钛薄膜的方法 |
JP6600588B2 (ja) | 2016-03-17 | 2019-10-30 | 東京エレクトロン株式会社 | 基板搬送機構の洗浄方法及び基板処理システム |
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US5685963A (en) * | 1994-10-31 | 1997-11-11 | Saes Pure Gas, Inc. | In situ getter pump system and method |
US6699530B2 (en) * | 1995-07-06 | 2004-03-02 | Applied Materials, Inc. | Method for constructing a film on a semiconductor wafer |
US5610106A (en) * | 1995-03-10 | 1997-03-11 | Sony Corporation | Plasma enhanced chemical vapor deposition of titanium nitride using ammonia |
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JP3624628B2 (ja) * | 1997-05-20 | 2005-03-02 | 東京エレクトロン株式会社 | 成膜方法及び成膜装置 |
JPH1116858A (ja) * | 1997-06-21 | 1999-01-22 | Tokyo Electron Ltd | 成膜装置のクリーニング方法及び処理方法 |
IT1297013B1 (it) * | 1997-12-23 | 1999-08-03 | Getters Spa | Sistema getter per la purificazione dell'atmosfera di lavoro nei processi di deposizione fisica da vapore |
KR20010062209A (ko) * | 1999-12-10 | 2001-07-07 | 히가시 데쓰로 | 고내식성 막이 내부에 형성된 챔버를 구비하는 처리 장치 |
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JP2003221671A (ja) * | 2002-01-30 | 2003-08-08 | Tokyo Electron Ltd | ガス処理方法 |
US6617209B1 (en) * | 2002-02-22 | 2003-09-09 | Intel Corporation | Method for making a semiconductor device having a high-k gate dielectric |
US6787481B2 (en) | 2002-02-28 | 2004-09-07 | Hitachi Kokusai Electric Inc. | Method for manufacturing semiconductor device |
US20050169766A1 (en) * | 2002-09-13 | 2005-08-04 | Saes Getters S.P.A. | Getter compositions reactivatable at low temperature after exposure to reactive gases at higher temperature |
KR100568256B1 (ko) * | 2003-12-11 | 2006-04-07 | 삼성전자주식회사 | 반도체 소자 제조 장비의 세정 방법 |
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DE102004059616B4 (de) | 2007-08-16 |
US20070037407A1 (en) | 2007-02-15 |
US7141512B2 (en) | 2006-11-28 |
DE102004059616A1 (de) | 2005-07-14 |
US20050126586A1 (en) | 2005-06-16 |
US7538046B2 (en) | 2009-05-26 |
KR100568256B1 (ko) | 2006-04-07 |
JP2005171386A (ja) | 2005-06-30 |
KR20050057967A (ko) | 2005-06-16 |
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