JP4805304B2 - キャリヤー付き金属箔及び多層コアレス回路基板の製造方法 - Google Patents

キャリヤー付き金属箔及び多層コアレス回路基板の製造方法 Download PDF

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JP4805304B2
JP4805304B2 JP2008124381A JP2008124381A JP4805304B2 JP 4805304 B2 JP4805304 B2 JP 4805304B2 JP 2008124381 A JP2008124381 A JP 2008124381A JP 2008124381 A JP2008124381 A JP 2008124381A JP 4805304 B2 JP4805304 B2 JP 4805304B2
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metal foil
carrier
foil
plate
prepreg
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JP2009272589A5 (OSRAM
JP2009272589A (ja
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雅之 高森
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JX Nippon Mining and Metals Corp
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JX Nippon Mining and Metals Corp
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Priority to JP2008124381A priority Critical patent/JP4805304B2/ja
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  • Parts Printed On Printed Circuit Boards (AREA)
JP2008124381A 2008-05-12 2008-05-12 キャリヤー付き金属箔及び多層コアレス回路基板の製造方法 Active JP4805304B2 (ja)

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JP2008124381A JP4805304B2 (ja) 2008-05-12 2008-05-12 キャリヤー付き金属箔及び多層コアレス回路基板の製造方法

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JP2008124381A JP4805304B2 (ja) 2008-05-12 2008-05-12 キャリヤー付き金属箔及び多層コアレス回路基板の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011159555A Division JP5427847B2 (ja) 2011-07-21 2011-07-21 キャリヤー付金属箔

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JP2009272589A JP2009272589A (ja) 2009-11-19
JP2009272589A5 JP2009272589A5 (OSRAM) 2010-12-16
JP4805304B2 true JP4805304B2 (ja) 2011-11-02

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013229640A (ja) * 2013-08-16 2013-11-07 Jx Nippon Mining & Metals Corp キャリヤー付金属箔
JP2014049645A (ja) * 2012-08-31 2014-03-17 Panasonic Corp 剥離可能銅箔付き基板及び回路基板の製造方法

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013140856A (ja) * 2011-12-28 2013-07-18 Jx Nippon Mining & Metals Corp キャリア付金属箔
JP5190553B1 (ja) * 2012-03-06 2013-04-24 フリージア・マクロス株式会社 キャリア付き金属箔
WO2013183606A1 (ja) * 2012-06-04 2013-12-12 Jx日鉱日石金属株式会社 キャリア付金属箔
CN104335688B (zh) * 2012-06-04 2018-02-09 Jx日矿日石金属株式会社 多层印刷配线板的制造方法
KR20150024354A (ko) * 2012-06-04 2015-03-06 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 캐리어 부착 금속박
WO2013183607A1 (ja) * 2012-06-04 2013-12-12 Jx日鉱日石金属株式会社 キャリア付金属箔
TWI615271B (zh) * 2012-09-20 2018-02-21 Ｊｘ日鑛日石金屬股份有限公司 附載體金屬箔
WO2014046259A1 (ja) * 2012-09-20 2014-03-27 Jx日鉱日石金属株式会社 キャリア付金属箔
JP6096787B2 (ja) * 2012-09-24 2017-03-15 Ｊｘ金属株式会社 キャリア付金属箔、樹脂製の板状キャリアと金属箔とからなる積層体、ならびにそれらの用途
WO2014051122A1 (ja) * 2012-09-28 2014-04-03 Jx日鉱日石金属株式会社 キャリア付金属箔
WO2014054803A1 (ja) * 2012-10-04 2014-04-10 Jx日鉱日石金属株式会社 多層プリント配線基板の製造方法及びベース基材
JP6373189B2 (ja) * 2012-10-04 2018-08-15 Ｊｘ金属株式会社 キャリア付金属箔
TWI571193B (zh) * 2012-10-04 2017-02-11 Ｊｘ日鑛日石金屬股份有限公司 Method for manufacturing multilayer printed wiring board and base substrate
KR101664993B1 (ko) * 2013-02-26 2016-10-11 후루카와 덴키 고교 가부시키가이샤 캐리어 부착 극박 동박, 동 클래드 적층판 및 코어레스 기판
JP6327840B2 (ja) * 2013-12-04 2018-05-23 Ｊｘ金属株式会社 熱硬化性樹脂と離型剤とを含む樹脂組成物
KR102198541B1 (ko) * 2014-03-17 2021-01-06 삼성전기주식회사 캐리어 부재
US10863621B2 (en) 2014-06-03 2020-12-08 Mitsui Mining & Smelting Co., Ltd. Metal foil with releasing resin layer, and printed wiring board
CN104540326A (zh) * 2014-12-31 2015-04-22 广州兴森快捷电路科技有限公司 无芯板制造构件以及无芯板制作方法
CN104582256B (zh) * 2014-12-31 2018-04-20 广州兴森快捷电路科技有限公司 无芯板构件
JP7259302B2 (ja) * 2018-12-07 2023-04-18 住友ベークライト株式会社 コアレス基板の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3631184B2 (ja) * 2001-09-17 2005-03-23 日本アビオニクス株式会社 プリント配線板の製造方法
JP4493923B2 (ja) * 2003-02-26 2010-06-30 イビデン株式会社 プリント配線板
JP5002943B2 (ja) * 2004-11-10 2012-08-15 日立化成工業株式会社 接着補助剤付金属箔及びそれを用いたプリント配線板
TW200804626A (en) * 2006-05-19 2008-01-16 Mitsui Mining & Smelting Co Copper foil provided with carrier sheet, method for fabricating copper foil provided with carrier sheet, surface-treated copper foil provided with carrier sheet, and copper-clad laminate using the surface-treated copper foil provided with carrier she
JP5109400B2 (ja) * 2006-09-08 2012-12-26 日立化成工業株式会社 銅表面処理液セット、これを用いた銅の表面処理方法、銅、配線基板および半導体パッケージ
JP2008105409A (ja) * 2006-09-26 2008-05-08 Mitsui Mining & Smelting Co Ltd フィラー粒子含有樹脂層付銅箔及びそのフィラー粒子含有樹脂層付銅箔を用いた銅張積層板
US8318292B2 (en) * 2008-03-26 2012-11-27 Sumitomo Bakelite Co., Ltd. Resin sheet with copper foil, multilayer printed wiring board, method for manufacturing multilayer printed wiring board and semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014049645A (ja) * 2012-08-31 2014-03-17 Panasonic Corp 剥離可能銅箔付き基板及び回路基板の製造方法
JP2013229640A (ja) * 2013-08-16 2013-11-07 Jx Nippon Mining & Metals Corp キャリヤー付金属箔

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