JP4794444B2 - 粒子光学システム及び装置、並びに、かかるシステム及び装置用の粒子光学部品 - Google Patents
粒子光学システム及び装置、並びに、かかるシステム及び装置用の粒子光学部品 Download PDFInfo
- Publication number
- JP4794444B2 JP4794444B2 JP2006525518A JP2006525518A JP4794444B2 JP 4794444 B2 JP4794444 B2 JP 4794444B2 JP 2006525518 A JP2006525518 A JP 2006525518A JP 2006525518 A JP2006525518 A JP 2006525518A JP 4794444 B2 JP4794444 B2 JP 4794444B2
- Authority
- JP
- Japan
- Prior art keywords
- magnetic field
- electron beam
- beam path
- field region
- primary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/09—Diaphragms; Shields associated with electron or ion-optical arrangements; Compensation of disturbing fields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/10—Lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/10—Lenses
- H01J37/14—Lenses magnetic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/153—Electron-optical or ion-optical arrangements for the correction of image defects, e.g. stigmators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/3002—Details
- H01J37/3007—Electron or ion-optical systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
- H01J37/3177—Multi-beam, e.g. fly's eye, comb probe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/04—Means for controlling the discharge
- H01J2237/043—Beam blanking
- H01J2237/0435—Multi-aperture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/04—Means for controlling the discharge
- H01J2237/045—Diaphragms
- H01J2237/0451—Diaphragms with fixed aperture
- H01J2237/0453—Diaphragms with fixed aperture multiple apertures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/04—Means for controlling the discharge
- H01J2237/047—Changing particle velocity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/04—Means for controlling the discharge
- H01J2237/047—Changing particle velocity
- H01J2237/0473—Changing particle velocity accelerating
- H01J2237/04735—Changing particle velocity accelerating with electrostatic means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/04—Means for controlling the discharge
- H01J2237/047—Changing particle velocity
- H01J2237/0475—Changing particle velocity decelerating
- H01J2237/04756—Changing particle velocity decelerating with electrostatic means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/06—Sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/10—Lenses
- H01J2237/14—Lenses magnetic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/28—Scanning microscopes
- H01J2237/2813—Scanning microscopes characterised by the application
- H01J2237/2817—Pattern inspection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/3175—Lithography
- H01J2237/31774—Multi-beam
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Electron Beam Exposure (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US50025603P | 2003-09-05 | 2003-09-05 | |
| US60/500,256 | 2003-09-05 | ||
| PCT/US2004/029079 WO2005024881A2 (en) | 2003-09-05 | 2004-09-07 | Particle-optical systems, components and arrangements |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008099010A Division JP2008218422A (ja) | 2003-09-05 | 2008-04-07 | 粒子光学装置及び荷電粒子ビーム操作方法 |
| JP2011111070A Division JP5364756B2 (ja) | 2003-09-05 | 2011-05-18 | 粒子光学装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007513460A JP2007513460A (ja) | 2007-05-24 |
| JP2007513460A5 JP2007513460A5 (https=) | 2007-10-18 |
| JP4794444B2 true JP4794444B2 (ja) | 2011-10-19 |
Family
ID=34272938
Family Applications (6)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006525518A Expired - Fee Related JP4794444B2 (ja) | 2003-09-05 | 2004-09-07 | 粒子光学システム及び装置、並びに、かかるシステム及び装置用の粒子光学部品 |
| JP2008099010A Pending JP2008218422A (ja) | 2003-09-05 | 2008-04-07 | 粒子光学装置及び荷電粒子ビーム操作方法 |
| JP2011111070A Expired - Lifetime JP5364756B2 (ja) | 2003-09-05 | 2011-05-18 | 粒子光学装置 |
| JP2012285348A Expired - Fee Related JP5756077B2 (ja) | 2003-09-05 | 2012-12-27 | 粒子光学装置及び荷電粒子ビーム操作方法 |
| JP2013153718A Expired - Fee Related JP5756150B2 (ja) | 2003-09-05 | 2013-07-24 | 粒子光学システム及び装置、並びに、かかるシステム及び装置用の粒子光学部品 |
| JP2014250291A Expired - Lifetime JP6208653B2 (ja) | 2003-09-05 | 2014-12-10 | 粒子光学装置、粒子光学部品、検査システム、検査方法、および、リソグラフィシステム |
Family Applications After (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008099010A Pending JP2008218422A (ja) | 2003-09-05 | 2008-04-07 | 粒子光学装置及び荷電粒子ビーム操作方法 |
| JP2011111070A Expired - Lifetime JP5364756B2 (ja) | 2003-09-05 | 2011-05-18 | 粒子光学装置 |
| JP2012285348A Expired - Fee Related JP5756077B2 (ja) | 2003-09-05 | 2012-12-27 | 粒子光学装置及び荷電粒子ビーム操作方法 |
| JP2013153718A Expired - Fee Related JP5756150B2 (ja) | 2003-09-05 | 2013-07-24 | 粒子光学システム及び装置、並びに、かかるシステム及び装置用の粒子光学部品 |
| JP2014250291A Expired - Lifetime JP6208653B2 (ja) | 2003-09-05 | 2014-12-10 | 粒子光学装置、粒子光学部品、検査システム、検査方法、および、リソグラフィシステム |
Country Status (6)
| Country | Link |
|---|---|
| US (7) | US7244949B2 (https=) |
| EP (10) | EP2575144B1 (https=) |
| JP (6) | JP4794444B2 (https=) |
| KR (1) | KR101051370B1 (https=) |
| CN (3) | CN101103417B (https=) |
| WO (1) | WO2005024881A2 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220079969A (ko) * | 2019-10-17 | 2022-06-14 | 아이씨티 인티그레이티드 써킷 테스팅 게젤샤프트 퓌어 할프라이터프뤼프테크닉 엠베하 | 하전 입자 빔 디바이스 및 하전 입자 빔 디바이스를 작동시키는 방법 |
Families Citing this family (241)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101103417B (zh) * | 2003-09-05 | 2012-06-27 | 卡尔蔡司Smt有限责任公司 | 粒子光学系统和排布结构,以及用于其的粒子光学组件 |
| EP1619495A1 (en) * | 2004-07-23 | 2006-01-25 | Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO | Method and Apparatus for inspecting a specimen surface and use of fluorescent materials |
| GB0425290D0 (en) * | 2004-11-17 | 2004-12-15 | Eastham Derek A | Focussing masks |
| US7468507B2 (en) | 2005-01-26 | 2008-12-23 | Applied Materials, Israel, Ltd. | Optical spot grid array scanning system |
| US7468506B2 (en) | 2005-01-26 | 2008-12-23 | Applied Materials, Israel, Ltd. | Spot grid array scanning system |
| US8304749B2 (en) | 2005-02-11 | 2012-11-06 | Ims Nanofabrication Ag | Charged-particle exposure apparatus with electrostatic zone plate |
| JP2007019192A (ja) * | 2005-07-06 | 2007-01-25 | Canon Inc | 荷電ビームレンズ、及び荷電ビーム露光装置 |
| EP1753010B1 (en) * | 2005-08-09 | 2012-12-05 | Carl Zeiss SMS GmbH | Particle-optical system |
| JP5663717B2 (ja) * | 2005-09-06 | 2015-02-04 | カール ツァイス マイクロスコピー ゲーエムベーハーCarl Zeiss Microscopy Gmbh | 荷電粒子システム |
| JP5159035B2 (ja) * | 2005-10-28 | 2013-03-06 | キヤノン株式会社 | レンズアレイ及び該レンズアレイを含む荷電粒子線露光装置 |
| EP2267753A3 (en) | 2005-11-28 | 2011-01-26 | Carl Zeiss SMT AG | Particle-optical component |
| TWI432908B (zh) * | 2006-03-10 | 2014-04-01 | 瑪波微影Ip公司 | 微影系統及投射方法 |
| EP2005460A4 (en) * | 2006-03-27 | 2010-11-24 | Multibeam Systems Inc | OPTICAL FOR GENERATING CHARGED PARTICLE DATA BEAMS HAVING HIGH CURRENT DENSITY |
| JP2007287365A (ja) * | 2006-04-13 | 2007-11-01 | Jeol Ltd | 多極子レンズ及び多極子レンズの製造方法 |
| JP4878501B2 (ja) * | 2006-05-25 | 2012-02-15 | 株式会社日立ハイテクノロジーズ | 荷電粒子線応用装置 |
| US8425741B2 (en) | 2006-07-20 | 2013-04-23 | Aviza Technology Limited | Ion deposition apparatus having rotatable carousel for supporting a plurality of targets |
| US8354652B2 (en) | 2006-07-20 | 2013-01-15 | Aviza Technology Limited | Ion source including separate support systems for accelerator grids |
| WO2008009892A1 (en) | 2006-07-20 | 2008-01-24 | Aviza Technology Limited | Plasma sources |
| EP2050118A1 (en) * | 2006-07-25 | 2009-04-22 | Mapper Lithography IP B.V. | A multiple beam charged particle optical system |
| US8134135B2 (en) | 2006-07-25 | 2012-03-13 | Mapper Lithography Ip B.V. | Multiple beam charged particle optical system |
| JP2008066359A (ja) * | 2006-09-05 | 2008-03-21 | Canon Inc | 荷電ビームレンズアレイ、露光装置及びデバイス製造方法 |
| US7763851B2 (en) * | 2006-12-22 | 2010-07-27 | Ims Nanofabrication Ag | Particle-beam apparatus with improved wien-type filter |
| JP5227512B2 (ja) * | 2006-12-27 | 2013-07-03 | 株式会社日立ハイテクノロジーズ | 電子線応用装置 |
| US8421305B2 (en) * | 2007-04-17 | 2013-04-16 | The University Of Utah Research Foundation | MEMS devices and systems actuated by an energy field |
| EP2019415B1 (en) * | 2007-07-24 | 2016-05-11 | IMS Nanofabrication AG | Multi-beam source |
| US8642959B2 (en) * | 2007-10-29 | 2014-02-04 | Micron Technology, Inc. | Method and system of performing three-dimensional imaging using an electron microscope |
| NL2003304C2 (en) * | 2008-08-07 | 2010-09-14 | Ims Nanofabrication Ag | Compensation of dose inhomogeneity and image distortion. |
| KR100946270B1 (ko) * | 2008-08-12 | 2010-03-09 | 주식회사 메가젠임플란트 | 연조직 절단 치과용 공구 |
| JP5484808B2 (ja) * | 2008-09-19 | 2014-05-07 | 株式会社ニューフレアテクノロジー | 描画装置及び描画方法 |
| TWI479530B (zh) * | 2008-10-01 | 2015-04-01 | Mapper Lithography Ip Bv | 靜電透鏡結構、靜電透鏡陣列、帶電粒子的子束微影系統以及製造絕緣結構的方法 |
| GB0912332D0 (en) * | 2009-07-16 | 2009-08-26 | Vg Systems Ltd | Magnetic lens,method for focussing charged particles and charged particle energy analyser |
| US8546767B2 (en) * | 2010-02-22 | 2013-10-01 | Ims Nanofabrication Ag | Pattern definition device with multiple multibeam array |
| EP2556527B1 (en) | 2010-04-09 | 2017-03-22 | Carl Zeiss Microscopy GmbH | Charged particle detection system and multi-beamlet inspection system |
| US8232536B2 (en) * | 2010-05-27 | 2012-07-31 | Mitsubishi Electric Corporation | Particle beam irradiation system and method for controlling the particle beam irradiation system |
| DE102010026169B4 (de) * | 2010-07-06 | 2014-09-04 | Carl Zeiss Microscopy Gmbh | Partikelstrahlsystem |
| EP2609611B1 (en) * | 2010-08-26 | 2017-12-20 | Tetra Laval Holdings & Finance S.A. | Control grid design for an electron beam generating device |
| CN103238202B (zh) * | 2010-09-28 | 2016-11-09 | 以色列实用材料有限公司 | 粒子光学系统及布置,以及用于这种系统及布置的粒子光学组件 |
| EP2625306B1 (en) * | 2010-10-05 | 2020-09-30 | Veeco Instruments Inc. | Grid providing beamlet steering |
| US8294095B2 (en) * | 2010-12-14 | 2012-10-23 | Hermes Microvision, Inc. | Apparatus of plural charged particle beams with multi-axis magnetic lens |
| US9530613B2 (en) * | 2011-02-18 | 2016-12-27 | Applied Materials Israel, Ltd. | Focusing a charged particle system |
| NL2007604C2 (en) * | 2011-10-14 | 2013-05-01 | Mapper Lithography Ip Bv | Charged particle system comprising a manipulator device for manipulation of one or more charged particle beams. |
| US9702983B2 (en) | 2011-05-03 | 2017-07-11 | Applied Materials Israel, Ltd. | Multi-spot collection optics |
| JP2012238770A (ja) * | 2011-05-12 | 2012-12-06 | Canon Inc | 静電レンズアレイ、描画装置、及びデバイスの製造方法 |
| US8933425B1 (en) * | 2011-11-02 | 2015-01-13 | Kla-Tencor Corporation | Apparatus and methods for aberration correction in electron beam based system |
| JP5886663B2 (ja) * | 2012-03-21 | 2016-03-16 | 株式会社日立ハイテクノロジーズ | 電子線応用装置およびレンズアレイ |
| RU2606234C2 (ru) | 2012-05-31 | 2017-01-10 | Сименс Акциенгезелльшафт | Отклоняющая пластина и отклоняющее устройство для отклонения заряженных частиц |
| NL2009053C2 (en) | 2012-06-22 | 2013-12-24 | Univ Delft Tech | Apparatus and method for inspecting a surface of a sample. |
| US10413755B1 (en) | 2012-08-01 | 2019-09-17 | Velayudhan Sahadevan | Device and methods for adaptive resistance inhibiting proton and carbon ion microbeams and nanobeams radiosurgery |
| US9001308B2 (en) * | 2013-02-01 | 2015-04-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Pattern generator for a lithography system |
| JP2014197652A (ja) * | 2013-03-29 | 2014-10-16 | 国立大学法人東北大学 | 回路基板、電子ビーム発生装置、電子ビーム照射装置、電子ビーム露光装置、および製造方法 |
| JP6208451B2 (ja) * | 2013-03-29 | 2017-10-04 | 国立大学法人東北大学 | 回路基板、電子ビーム発生装置、電子ビーム照射装置、電子ビーム露光装置、および製造方法 |
| WO2014156171A1 (ja) * | 2013-03-29 | 2014-10-02 | 国立大学法人東北大学 | 複数の電子ビームを制御する際に確実に動作する回路基板 |
| DE102013006535B4 (de) * | 2013-04-15 | 2025-11-06 | Carl Zeiss Microscopy Gmbh | Raster-Partikelstrahlmikroskop mit energiefilterndem Detektorsystem |
| CN104345331B (zh) * | 2013-07-24 | 2017-04-19 | 中国科学院上海微系统与信息技术研究所 | 图像型电子自旋分析器 |
| DE102013014976A1 (de) | 2013-09-09 | 2015-03-12 | Carl Zeiss Microscopy Gmbh | Teilchenoptisches System |
| DE102013016113B4 (de) | 2013-09-26 | 2018-11-29 | Carl Zeiss Microscopy Gmbh | Verfahren zum Detektieren von Elektronen, Elektronendetektor und Inspektionssystem |
| US9263233B2 (en) | 2013-09-29 | 2016-02-16 | Carl Zeiss Microscopy Gmbh | Charged particle multi-beam inspection system and method of operating the same |
| EP3454357B1 (en) | 2013-09-30 | 2020-08-12 | Carl Zeiss Microscopy GmbH | Charged particle beam system and method of operating the same |
| DE102014008105B4 (de) | 2014-05-30 | 2021-11-11 | Carl Zeiss Multisem Gmbh | Mehrstrahl-Teilchenmikroskop |
| DE102014008083B9 (de) * | 2014-05-30 | 2018-03-22 | Carl Zeiss Microscopy Gmbh | Teilchenstrahlsystem |
| DE102014008383B9 (de) | 2014-06-06 | 2018-03-22 | Carl Zeiss Microscopy Gmbh | Teilchenstrahlsystem und Verfahren zum Betreiben einer Teilchenoptik |
| NL2013411B1 (en) * | 2014-09-04 | 2016-09-27 | Univ Delft Tech | Multi electron beam inspection apparatus. |
| DE102015202172B4 (de) | 2015-02-06 | 2017-01-19 | Carl Zeiss Microscopy Gmbh | Teilchenstrahlsystem und Verfahren zur teilchenoptischen Untersuchung eines Objekts |
| WO2016145458A1 (en) * | 2015-03-10 | 2016-09-15 | Hermes Microvision Inc. | Apparatus of plural charged-particle beams |
| US9691588B2 (en) | 2015-03-10 | 2017-06-27 | Hermes Microvision, Inc. | Apparatus of plural charged-particle beams |
| US10236156B2 (en) | 2015-03-25 | 2019-03-19 | Hermes Microvision Inc. | Apparatus of plural charged-particle beams |
| US9607805B2 (en) | 2015-05-12 | 2017-03-28 | Hermes Microvision Inc. | Apparatus of plural charged-particle beams |
| KR102441581B1 (ko) | 2015-06-03 | 2022-09-07 | 삼성전자주식회사 | 표면 검사 방법 및 이를 이용한 포토 마스크의 검사 방법 |
| US9922799B2 (en) * | 2015-07-21 | 2018-03-20 | Hermes Microvision, Inc. | Apparatus of plural charged-particle beams |
| EP3809124A3 (en) | 2015-07-22 | 2022-03-16 | Hermes Microvision Inc. | Apparatus of plural charged-particle beams |
| US10192716B2 (en) | 2015-09-21 | 2019-01-29 | Kla-Tencor Corporation | Multi-beam dark field imaging |
| US10460905B2 (en) | 2015-09-23 | 2019-10-29 | Kla-Tencor Corporation | Backscattered electrons (BSE) imaging using multi-beam tools |
| JP6132448B2 (ja) * | 2015-11-26 | 2017-05-24 | 京楽産業.株式会社 | 遊技機 |
| CN114420523B (zh) | 2015-11-30 | 2025-04-15 | Asml荷兰有限公司 | 多个带电粒子束的设备 |
| JP2017134927A (ja) * | 2016-01-26 | 2017-08-03 | 株式会社荏原製作所 | 検査装置 |
| CN113192815B (zh) * | 2016-01-27 | 2024-10-29 | Asml荷兰有限公司 | 多个带电粒子束的装置 |
| US11302511B2 (en) * | 2016-02-04 | 2022-04-12 | Kla Corporation | Field curvature correction for multi-beam inspection systems |
| WO2017171796A1 (en) * | 2016-03-31 | 2017-10-05 | Intel Corporation | Aperture size modulation to enhance ebeam patterning resolution |
| US10418324B2 (en) | 2016-10-27 | 2019-09-17 | Asml Netherlands B.V. | Fabricating unique chips using a charged particle multi-beamlet lithography system |
| DE102016120902B4 (de) | 2016-11-02 | 2018-08-23 | Carl Zeiss Microscopy Gmbh | Vielstrahl-Teilchenmikroskop |
| US10453645B2 (en) * | 2016-12-01 | 2019-10-22 | Applied Materials Israel Ltd. | Method for inspecting a specimen and charged particle multi-beam device |
| US9922796B1 (en) * | 2016-12-01 | 2018-03-20 | Applied Materials Israel Ltd. | Method for inspecting a specimen and charged particle multi-beam device |
| WO2018117275A1 (en) * | 2016-12-23 | 2018-06-28 | Mapper Lithography Ip B.V. | Fabricating unique chips using a charged particle multi-beamlet lithography system |
| US10840056B2 (en) * | 2017-02-03 | 2020-11-17 | Kla Corporation | Multi-column scanning electron microscopy system |
| US10347460B2 (en) | 2017-03-01 | 2019-07-09 | Dongfang Jingyuan Electron Limited | Patterned substrate imaging using multiple electron beams |
| WO2018172186A1 (en) | 2017-03-20 | 2018-09-27 | Carl Zeiss Microscopy Gmbh | Charged particle beam system and method |
| WO2018173241A1 (ja) * | 2017-03-24 | 2018-09-27 | 株式会社 日立ハイテクノロジーズ | 荷電粒子線装置、及び荷電粒子線装置の調整方法 |
| KR102848856B1 (ko) | 2017-04-28 | 2025-08-21 | 에이에스엠엘 네델란즈 비.브이. | 다수의 하전 입자 빔들을 사용하는 장치 |
| US11532760B2 (en) | 2017-05-22 | 2022-12-20 | Howmedica Osteonics Corp. | Device for in-situ fabrication process monitoring and feedback control of an electron beam additive manufacturing process |
| KR102650124B1 (ko) | 2017-07-28 | 2024-03-22 | 에이에스엠엘 네델란즈 비.브이. | 단일-빔 또는 멀티-빔 장치에서의 빔 분리기의 분산을 보상하기 위한 시스템들 및 방법들 |
| JP6819509B2 (ja) * | 2017-08-10 | 2021-01-27 | 株式会社ニューフレアテクノロジー | マルチ荷電粒子ビーム描画装置 |
| US20190066972A1 (en) * | 2017-08-29 | 2019-02-28 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Charged particle beam device, aperture arrangement for a charged particle beam device, and method for operating a charged particle beam device |
| WO2019048293A1 (en) | 2017-09-07 | 2019-03-14 | Asml Netherlands B.V. | METHODS OF INSPECTING SAMPLES WITH MULTIPLE BEAMS OF CHARGED PARTICLES |
| KR102535162B1 (ko) | 2017-09-29 | 2023-05-26 | 에이에스엠엘 네델란즈 비.브이. | 다중 하전 입자 빔으로 샘플을 검사하는 방법 |
| WO2019063559A1 (en) | 2017-09-29 | 2019-04-04 | Asml Netherlands B.V. | DYNAMIC DETERMINATION OF A CHARGED PARTICLE BEAM INSPECTION SAMPLE INSPECTION RECIPE |
| KR20240016455A (ko) | 2017-09-29 | 2024-02-06 | 에이에스엠엘 네델란즈 비.브이. | 샘플 검사에서 이미지 콘트라스트 향상 |
| US20190104606A1 (en) * | 2017-10-02 | 2019-04-04 | Rayton Solar Inc. | Systems and processes for producing relatively uniform transverse irradiation fields of charged-particle beams |
| EP3697535B1 (en) * | 2017-10-18 | 2023-04-26 | Nuclera Nucleics Ltd | Digital microfluidic devices including dual substrates with thin-film transistors and capacitive sensing |
| KR102444288B1 (ko) | 2017-11-08 | 2022-09-16 | 삼성전자주식회사 | 메타 렌즈를 포함하는 프로젝터 |
| US11373321B2 (en) | 2017-11-08 | 2022-06-28 | Samsung Electronics Co., Ltd. | Projector including meta-lens |
| JP6966319B2 (ja) * | 2017-12-22 | 2021-11-17 | 株式会社ニューフレアテクノロジー | マルチビーム画像取得装置及びマルチビーム画像取得方法 |
| DE102018202421B3 (de) | 2018-02-16 | 2019-07-11 | Carl Zeiss Microscopy Gmbh | Vielstrahl-Teilchenstrahlsystem |
| DE102018202428B3 (de) | 2018-02-16 | 2019-05-09 | Carl Zeiss Microscopy Gmbh | Vielstrahl-Teilchenmikroskop |
| US10504683B2 (en) * | 2018-02-22 | 2019-12-10 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Device and method for forming a plurality of charged particle beamlets |
| WO2019166331A2 (en) | 2018-02-27 | 2019-09-06 | Carl Zeiss Microscopy Gmbh | Charged particle beam system and method |
| WO2019186937A1 (ja) | 2018-03-29 | 2019-10-03 | 株式会社日立ハイテクノロジーズ | 荷電粒子線装置 |
| CN112041965B (zh) | 2018-05-01 | 2025-01-14 | Asml荷兰有限公司 | 多束检查装置 |
| US10811215B2 (en) | 2018-05-21 | 2020-10-20 | Carl Zeiss Multisem Gmbh | Charged particle beam system |
| EP3576128A1 (en) * | 2018-05-28 | 2019-12-04 | ASML Netherlands B.V. | Electron beam apparatus, inspection tool and inspection method |
| US11087950B2 (en) * | 2018-05-29 | 2021-08-10 | Kla-Tencor Corporation | Charge control device for a system with multiple electron beams |
| US10770262B1 (en) * | 2018-05-30 | 2020-09-08 | National Technology & Engineering Solutions Of Sandia, Llc | Apparatus, method and system for imaging and utilization of SEM charged particles |
| DE102018115012A1 (de) | 2018-06-21 | 2019-12-24 | Carl Zeiss Microscopy Gmbh | Teilchenstrahlsystem |
| EP3597333A1 (en) | 2018-07-19 | 2020-01-22 | Howmedica Osteonics Corporation | System and process for in-process electron beam profile and location analyses |
| WO2020030483A1 (en) | 2018-08-09 | 2020-02-13 | Asml Netherlands B.V. | An apparatus for multiple charged-particle beams |
| EP3624167A1 (en) * | 2018-09-14 | 2020-03-18 | FEI Company | Multi-electron-beam imaging appartus with improved perormance |
| DE102018007455B4 (de) | 2018-09-21 | 2020-07-09 | Carl Zeiss Multisem Gmbh | Verfahren zum Detektorabgleich bei der Abbildung von Objekten mittels eines Mehrstrahl-Teilchenmikroskops, System sowie Computerprogrammprodukt |
| DE102018007652B4 (de) | 2018-09-27 | 2021-03-25 | Carl Zeiss Multisem Gmbh | Teilchenstrahl-System sowie Verfahren zur Stromregulierung von Einzel-Teilchenstrahlen |
| DE102018124044B3 (de) | 2018-09-28 | 2020-02-06 | Carl Zeiss Microscopy Gmbh | Verfahren zum Betreiben eines Vielstrahl-Teilchenstrahlmikroskops und Vielstrahl-Teilchenstrahlsystem |
| DE102018124219A1 (de) | 2018-10-01 | 2020-04-02 | Carl Zeiss Microscopy Gmbh | Vielstrahl-Teilchenstrahlsystem und Verfahren zum Betreiben eines solchen |
| DE102018124401A1 (de) | 2018-10-02 | 2020-04-02 | Carl Zeiss Smt Gmbh | Verfahren zum Aufnehmen eines Bildes mit einem Teilchenmikroskop |
| US10784070B2 (en) * | 2018-10-19 | 2020-09-22 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Charged particle beam device, field curvature corrector, and methods of operating a charged particle beam device |
| US11145485B2 (en) * | 2018-12-26 | 2021-10-12 | Nuflare Technology, Inc. | Multiple electron beams irradiation apparatus |
| DE102018133703B4 (de) | 2018-12-29 | 2020-08-06 | Carl Zeiss Multisem Gmbh | Vorrichtung zur Erzeugung einer Vielzahl von Teilchenstrahlen und Vielstrahl-Teilchenstrahlsysteme |
| CN111477530B (zh) | 2019-01-24 | 2023-05-05 | 卡尔蔡司MultiSEM有限责任公司 | 利用多束粒子显微镜对3d样本成像的方法 |
| TWI743626B (zh) | 2019-01-24 | 2021-10-21 | 德商卡爾蔡司多重掃描電子顯微鏡有限公司 | 包含多束粒子顯微鏡的系統、對3d樣本逐層成像之方法及電腦程式產品 |
| US10741355B1 (en) | 2019-02-04 | 2020-08-11 | Carl Zeiss Multisem Gmbh | Multi-beam charged particle system |
| EP3703100A1 (en) * | 2019-02-27 | 2020-09-02 | FEI Company | Charged particle beam device for inspection of a specimen with a plurality of charged particle beamlets |
| JP7175798B2 (ja) * | 2019-03-01 | 2022-11-21 | 株式会社荏原製作所 | 荷電粒子マルチビーム装置 |
| TWI737117B (zh) | 2019-03-05 | 2021-08-21 | 日商紐富來科技股份有限公司 | 多電子束照射裝置 |
| JP7241570B2 (ja) * | 2019-03-06 | 2023-03-17 | 株式会社ニューフレアテクノロジー | マルチ電子ビーム検査装置及びマルチ電子ビーム検査方法 |
| KR102662658B1 (ko) * | 2019-03-27 | 2024-05-03 | 에이에스엠엘 네델란즈 비.브이. | 멀티빔 검사 장치에서 2차 빔의 정렬을 위한 시스템 및 방법 |
| EP3953959A1 (en) | 2019-04-06 | 2022-02-16 | ASML Netherlands B.V. | Mems image forming element with built-in voltage generator |
| EP3977501A1 (en) * | 2019-05-28 | 2022-04-06 | ASML Netherlands B.V. | Multiple charged-particle beam apparatus |
| SG11202112463SA (en) * | 2019-05-31 | 2021-12-30 | Asml Netherlands Bv | Multiple charged-particle beam apparatus and methods of operating the same |
| DE102019004124B4 (de) * | 2019-06-13 | 2024-03-21 | Carl Zeiss Multisem Gmbh | Teilchenstrahl-System zur azimutalen Ablenkung von Einzel-Teilchenstrahlen sowie seine Verwendung und Verfahren zur Azimut-Korrektur bei einem Teilchenstrahl-System |
| JP7316106B2 (ja) * | 2019-06-14 | 2023-07-27 | 株式会社ニューフレアテクノロジー | 収差補正器及びマルチ電子ビーム照射装置 |
| JP7234052B2 (ja) | 2019-06-28 | 2023-03-07 | 株式会社ニューフレアテクノロジー | マルチ電子ビーム画像取得装置及びマルチ電子ビーム画像取得方法 |
| DE102019005362A1 (de) | 2019-07-31 | 2021-02-04 | Carl Zeiss Multisem Gmbh | Verfahren zum Betreiben eines Vielzahl-Teilchenstrahlsystems unter Veränderung der numerischen Apertur, zugehöriges Computerprogrammprodukt und Vielzahl-Teilchenstrahlsystem |
| DE102019005364B3 (de) | 2019-07-31 | 2020-10-08 | Carl Zeiss Multisem Gmbh | System-Kombination eines Teilchenstrahlsystem und eines lichtoptischen Systems mit kollinearer Strahlführung sowie Verwendung der System-Kombination |
| JP7008671B2 (ja) * | 2019-09-13 | 2022-01-25 | 日本電子株式会社 | 荷電粒子線装置および分析方法 |
| JP7360871B2 (ja) * | 2019-09-24 | 2023-10-13 | 株式会社日立ハイテクサイエンス | 荷電粒子ビーム照射装置、及び制御方法 |
| TW202115761A (zh) * | 2019-10-08 | 2021-04-16 | 代爾夫特理工大學 | 用於產生複數帶電粒子子束之裝置及使用其之檢查、成像或處理設備和方法 |
| NL2024065B1 (en) * | 2019-10-21 | 2021-06-22 | Univ Delft Tech | Multi-beam charged particle source with alignment means |
| DE102019008249B3 (de) | 2019-11-27 | 2020-11-19 | Carl Zeiss Multisem Gmbh | Teilchenstrahl-System mit einer Multistrahl-Ablenkeinrichtung und einem Strahlfänger, Verfahren zum Betreiben des Teilchenstrahl-Systems und zugehöriges Computerprogrammprodukt |
| DE102019218315B3 (de) | 2019-11-27 | 2020-10-01 | Carl Zeiss Microscopy Gmbh | Verfahren zur Spannungskontrastbildgebung mit einem Korpuskularvielstrahlmikroskop, Korpuskularvielstrahlmikroskop für Spannungskontrastbildgebung und Halbleiterstrukturen zur Spannungskontrastbildgebung mit einem Korpuskularvielstrahlmikroskop |
| TWI773030B (zh) * | 2019-12-20 | 2022-08-01 | 荷蘭商Asml荷蘭公司 | 用於多射束檢測系統之多模操作 |
| EP4088301A1 (en) | 2020-01-06 | 2022-11-16 | ASML Netherlands B.V. | Charged particle assessment tool, inspection method |
| KR102799604B1 (ko) | 2020-02-04 | 2025-04-23 | 칼 짜이스 멀티셈 게엠베하 | 다중 빔 디지털 스캐닝 및 이미지 획득 |
| EP3869533A1 (en) | 2020-02-21 | 2021-08-25 | ASML Netherlands B.V. | Charged particle assessment tool, inspection method |
| WO2021165135A1 (en) | 2020-02-21 | 2021-08-26 | Asml Netherlands B.V. | Inspection apparatus |
| EP3869536A1 (en) | 2020-02-21 | 2021-08-25 | ASML Netherlands B.V. | Inspection apparatus |
| JP7689139B2 (ja) | 2020-03-12 | 2025-06-05 | カール ツァイス マルティセム ゲゼルシヤフト ミット ベシュレンクテル ハフツング | マルチビーム発生ユニットおよびマルチビーム偏向ユニットの特定の改善 |
| JP7359050B2 (ja) * | 2020-03-18 | 2023-10-11 | 株式会社ニューフレアテクノロジー | マルチビーム用のブランキング装置及びマルチ荷電粒子ビーム描画装置 |
| DE102020107738B3 (de) * | 2020-03-20 | 2021-01-14 | Carl Zeiss Multisem Gmbh | Teilchenstrahl-System mit einer Multipol-Linsen-Sequenz zur unabhängigen Fokussierung einer Vielzahl von Einzel-Teilchenstrahlen, seine Verwendung und zugehöriges Verfahren |
| KR102823383B1 (ko) * | 2020-04-03 | 2025-06-20 | 에이에스엠엘 네델란즈 비.브이. | 하전 입자 빔 검사 시 전하 축적 감소에 기초한 이미지 향상 |
| EP3893263A1 (en) * | 2020-04-06 | 2021-10-13 | ASML Netherlands B.V. | Aperture assembly, beam manipulator unit, method of manipulating charged particle beams, and charged particle projection apparatus |
| JP7428578B2 (ja) * | 2020-04-22 | 2024-02-06 | 株式会社ホロン | マルチビーム画像生成装置およびマルチビーム画像生成方法 |
| US12525426B2 (en) | 2020-05-01 | 2026-01-13 | Asml Netherlands B.V. | Enhanced architecture for high-performance detection device |
| TWI787794B (zh) | 2020-05-28 | 2022-12-21 | 德商卡爾蔡司多重掃描電子顯微鏡有限公司 | 多重射束帶電粒子顯微鏡或系統與其操作方法 |
| WO2021239754A1 (en) | 2020-05-28 | 2021-12-02 | Asml Netherlands B.V. | Enhanced architecture for high-performance detection device technical field |
| DE102020115183B4 (de) | 2020-06-08 | 2026-01-29 | Carl Zeiss Multisem Gmbh | Teilchenstrahlsystem mit Multiquellensystem sowie Mehrstrahl-Teilchenmikroskop |
| EP3937205A1 (en) | 2020-07-06 | 2022-01-12 | ASML Netherlands B.V. | Charged-particle multi-beam column, charged-particle multi-beam column array, inspection method |
| DE102020121132B3 (de) | 2020-08-11 | 2021-09-23 | Carl Zeiss Multisem Gmbh | Verfahren zum Betreiben eines Vielzahl-Teilchenstrahlsystems mit einem Spiegel-Betriebsmodus und zugehöriges Computerprogrammprodukt |
| DE102020123567B4 (de) | 2020-09-09 | 2025-02-13 | Carl Zeiss Multisem Gmbh | Vielzahl-Teilchenstrahl-System mit Kontrast-Korrektur-Linsen-System |
| TW202220012A (zh) | 2020-09-30 | 2022-05-16 | 德商卡爾蔡司多重掃描電子顯微鏡有限公司 | 在可調工作距離附近具快速自動對焦之多重粒子束顯微鏡及相關方法 |
| DE102021105201B4 (de) | 2021-03-04 | 2024-10-02 | Carl Zeiss Multisem Gmbh | Vielzahl-Teilchenstrahlmikroskop und zugehöriges Verfahren mit schnellem Autofokus mit speziellen Ausführungen |
| DE102020125534B3 (de) | 2020-09-30 | 2021-12-02 | Carl Zeiss Multisem Gmbh | Vielzahl-Teilchenstrahlmikroskop und zugehöriges Verfahren mit schnellem Autofokus um einen einstellbaren Arbeitsabstand |
| CA3198634A1 (en) * | 2020-11-12 | 2022-05-19 | Asml Netherlands B.V. | Objective lens array assembly, electron-optical system, electron-optical system array, method of focusing |
| EP4002421A1 (en) * | 2020-11-12 | 2022-05-25 | ASML Netherlands B.V. | Objective lens array assembly, electron-optical system, electron-optical system array, method of focusing |
| KR20230122666A (ko) | 2020-12-23 | 2023-08-22 | 에이에스엠엘 네델란즈 비.브이. | 하전 입자 광학 디바이스 |
| DE102021200799B3 (de) | 2021-01-29 | 2022-03-31 | Carl Zeiss Multisem Gmbh | Verfahren mit verbesserter Fokuseinstellung unter Berücksichtigung eines Bildebenenkipps in einem Vielzahl-Teilchenstrahlmikroskop |
| WO2022227024A1 (zh) * | 2021-04-30 | 2022-11-03 | 华为技术有限公司 | 神经网络模型的运算方法、训练方法及装置 |
| WO2022238137A1 (en) * | 2021-05-12 | 2022-11-17 | Asml Netherlands B.V. | Assessment system, method of assessing |
| EP4095881A1 (en) * | 2021-05-25 | 2022-11-30 | ASML Netherlands B.V. | Charged particle device |
| DE102021205394B4 (de) | 2021-05-27 | 2022-12-08 | Carl Zeiss Multisem Gmbh | Verfahren zum Betrieb eines Vielstrahlmikroskops mit an eine Inspektionsstelle angepassten Einstellungen |
| TW202312205A (zh) | 2021-05-27 | 2023-03-16 | 德商卡爾蔡司多重掃描電子顯微鏡有限公司 | 多重射束帶電粒子系統與在多重射束帶電粒子系統中控制工作距離的方法 |
| WO2022258271A1 (en) | 2021-06-08 | 2022-12-15 | Asml Netherlands B.V. | Charged particle apparatus and method |
| EP4102535A1 (en) | 2021-06-08 | 2022-12-14 | ASML Netherlands B.V. | Charged particle apparatus and method |
| CN117501399A (zh) | 2021-06-16 | 2024-02-02 | 卡尔蔡司MultiSEM有限责任公司 | 失真优化的多射束扫描系统 |
| DE102021116969B3 (de) | 2021-07-01 | 2022-09-22 | Carl Zeiss Multisem Gmbh | Verfahren zur bereichsweisen Probeninspektion mittels eines Vielstrahl-Teilchenmikroskopes, Computerprogrammprodukt und Vielstrahl-Teilchenmikroskop zur Halbleiterprobeninspektion |
| DE102021118561B4 (de) | 2021-07-19 | 2023-03-30 | Carl Zeiss Multisem Gmbh | Verfahren zum Betreiben eines Vielstrahl-Teilchenmikroskopes mit schneller Strahlstromregelung, Computerprogrammprodukt und Vielstrahl-Teilchenmikroskop |
| DE102021118684B4 (de) | 2021-07-20 | 2024-11-28 | Carl Zeiss Multisem Gmbh | Verfahren zur Analyse von Störeinflüssen bei einem Vielstrahl-Teilchenmikroskop, zugehöriges Computerprogrammprodukt und Vielstrahl-Teilchenmikroskop |
| DE102021119008A1 (de) | 2021-07-30 | 2023-02-02 | Carl Zeiss Multisem Gmbh | Verfahren zur Defekterkennung in einer Halbleiterprobe bei Probenbildern mit Verzeichnung |
| EP4385053A1 (en) | 2021-08-10 | 2024-06-19 | Carl Zeiss MultiSEM GmbH | Multi-beam generating unit with increased focusing power |
| DE102021124099B4 (de) | 2021-09-17 | 2023-09-28 | Carl Zeiss Multisem Gmbh | Verfahren zum Betreiben eines Vielstrahl-Teilchenmikroskops in einem Kontrast-Betriebsmodus mit defokussierter Strahlführung, Computerprogramprodukt und Vielstrahlteilchenmikroskop |
| US11651934B2 (en) | 2021-09-30 | 2023-05-16 | Kla Corporation | Systems and methods of creating multiple electron beams |
| KR102922046B1 (ko) | 2021-10-25 | 2026-02-04 | 칼 짜이스 멀티셈 게엠베하 | 멀티빔 시스템에서 이미징 해상도의 전역적 및 국부적 최적화 방법 |
| IL313332A (en) * | 2021-12-23 | 2024-08-01 | Asml Netherlands Bv | Electro-optical device, a method to compensate for changes in the property of sub-beams |
| KR102952206B1 (ko) | 2022-01-25 | 2026-04-14 | 칼 짜이스 멀티셈 게엠베하 | 미러 작동 모드를 갖는 다중 하전 입자 빔 시스템, 미러 작동 모드를 갖는 다중-빔 하전 입자 현미경 시스템을 작동시키기 위한 방법 및 관련 컴퓨터 프로그램 제품 |
| TWI853422B (zh) * | 2022-01-31 | 2024-08-21 | 德商卡爾蔡司多重掃描電子顯微鏡有限公司 | 多束系統以及具有降低對漂移與損壞的敏感度的多束產生單元與其操作方法 |
| KR20240135684A (ko) | 2022-02-03 | 2024-09-11 | 칼 짜이스 멀티셈 게엠베하 | 멀티-빔 대전 입자 현미경으로 이미징된 이미지에서 특성의 왜곡-정정된 포지션을 결정하기 위한 방법, 대응 컴퓨터 프로그램 제품 및 멀티-빔 대전 입자 현미경 |
| US12423772B2 (en) * | 2022-02-17 | 2025-09-23 | Fei Company | Systems and methods for hybrid enhancement of scanning electron microscope images |
| DE102022104535B4 (de) | 2022-02-25 | 2024-03-21 | Carl Zeiss Multisem Gmbh | Vielstrahl-Teilchenmikroskop zur Reduktion von Teilchenstrahl-induzierten Spuren auf einer Probe |
| CN119013754B (zh) * | 2022-04-12 | 2026-04-24 | 华为技术有限公司 | 用于减小散焦距离的静电透镜 |
| DE102022114098A1 (de) | 2022-06-03 | 2023-12-14 | Carl Zeiss Multisem Gmbh | Vielstrahl-Teilchenmikroskop mit verbesserter Justage und Verfahren zum Justieren des Vielstrahl-Teilchenmikroskops sowie Computerprogrammprodukt |
| WO2023237225A1 (en) | 2022-06-10 | 2023-12-14 | Carl Zeiss Multisem Gmbh | Multi-beam charged particle imaging system with improved imaging of secondary electron beamlets on a detector |
| DE102022114923B4 (de) | 2022-06-14 | 2024-10-17 | Carl Zeiss Multisem Gmbh | Verfahren zum Betreiben eines Vielstrahl-Teilchenmikroskops, Computerprogrammprodukt und Vielstrahl-Teilchenmikroskop |
| CN119404277A (zh) | 2022-06-23 | 2025-02-07 | 卡尔蔡司MultiSEM有限责任公司 | 多束系统与具有减小的对二次辐射的敏感度的多束形成单元 |
| WO2024008329A1 (en) | 2022-07-07 | 2024-01-11 | Carl Zeiss Multisem Gmbh | Multi-beam charged particle microscope design with mirror for field curvature correction |
| DE102022120496B4 (de) * | 2022-08-12 | 2025-05-28 | Carl Zeiss Multisem Gmbh | Teilchenoptische Anordnung, insbesondere Vielstrahl-Teilchenmikroskop, mit einer Magnetanordnung zum Separieren eines primären und eines sekundären teilchenoptischen Strahlenganges |
| DE102022124933A1 (de) | 2022-09-28 | 2024-03-28 | Carl Zeiss Multisem Gmbh | Vielstrahl-Teilchenmikroskop mit verbessertem Strahlrohr |
| US20240128051A1 (en) | 2022-10-14 | 2024-04-18 | Carl Zeiss Multisem Gmbh | Multi-beam charged particle beam system with anisotropic filtering for improved image contrast |
| KR20250103759A (ko) | 2022-11-10 | 2025-07-07 | 칼 짜이스 멀티셈 게엠베하 | 감소한 대전 효과를 갖는 멀티-빔 대전 입자 이미징 시스템 |
| DE102022131862A1 (de) | 2022-12-01 | 2024-06-06 | Carl Zeiss Multisem Gmbh | Vielstrahl-Teilchenmikroskop umfassend eine Aberrationskorrektureinheit mit Geometrie-basierten Korrekturelektroden und Verfahren zum Einstellen der Aberrationskorrektur sowie Computerprogrammprodukt |
| WO2024125816A1 (en) | 2022-12-16 | 2024-06-20 | Carl Zeiss Multisem Gmbh | Multi-beam charged particle microscope design with detection system for fast charge compensation |
| TWI903291B (zh) | 2023-01-19 | 2025-11-01 | 德商卡爾蔡司多重掃描電子顯微鏡有限公司 | 多束帶電粒子系統的快速閉迴路控制以及操作多數帶電粒子成像裝置的電腦實施方法 |
| EP4655814A1 (en) | 2023-01-25 | 2025-12-03 | Carl Zeiss MultiSEM GmbH | Multi-beam particle microscope with improved multi-beam generator for field curvature correction and multi-beam generator |
| DE102023101774B4 (de) | 2023-01-25 | 2025-05-15 | Carl Zeiss Multisem Gmbh | Verfahren zum Auslegen eines Vielstrahl-Teilchenstrahlsystems mit monolithischen Bahnverlaufskorrekturplatten, Computerprogrammprodukt und Vielstrahl-Teilchenstrahlsystem |
| KR20250139878A (ko) | 2023-02-06 | 2025-09-23 | 칼 짜이스 멀티셈 게엠베하 | 대전 효과의 고속 보상을 위한 검출 유닛을 갖는 다중 빔 하전 입자 현미경 |
| CN120752724A (zh) | 2023-03-07 | 2025-10-03 | 卡尔蔡司Smt有限责任公司 | 带电粒子束成像的样品制备 |
| WO2024188982A1 (en) | 2023-03-14 | 2024-09-19 | Carl Zeiss Multisem Gmbh | Monitoring of imaging parameters of scanning electron microscopy |
| DE102023202582A1 (de) | 2023-03-22 | 2024-09-26 | Carl Zeiss Multisem Gmbh | Verbesserte Vielstrahl-Erzeugungseinrichtung und Methode zum Betrieb einer Vielstrahl-Erzeugungseinrichtung |
| DE102023107961B3 (de) | 2023-03-29 | 2024-09-26 | Carl Zeiss Multisem Gmbh | Vielstrahl-Teilchenmikroskop mit schnell austauschbarer Teilchenquelle und Verfahren zum schnellen Austauschen einer Teilchenquelle in dem Vielstrahl-Teilchenmikroskop |
| WO2024227537A1 (en) | 2023-05-02 | 2024-11-07 | Carl Zeiss Multisem Gmbh | Multi-beam charged particle microscope for inspection with improved image contrast |
| KR20260012284A (ko) | 2023-05-22 | 2026-01-26 | 칼 짜이스 멀티셈 게엠베하 | 증가된 처리량을 갖는 검사를 위한 다중 빔 대전 입자 현미경 |
| DE102023116627B4 (de) | 2023-06-23 | 2025-07-31 | Carl Zeiss Multisem Gmbh | Vielzahl-Teilchenstrahlsystem, insbesondere Vielstrahl-Teilchenmikroskop, mit einer schnellen Magnetlinse und seine Verwendung |
| DE102023119451B4 (de) | 2023-07-24 | 2025-02-13 | Carl Zeiss Multisem Gmbh | Vielstrahl-Teilchenstrahlsystem mit elektrostatischer Boosterlinse, Verfahren zum Betreiben eines Vielstrahl-Teilchenstrahlsystems und zugehöriges Computerprogrammprodukt |
| DE102023120127B4 (de) | 2023-07-28 | 2025-03-27 | Carl Zeiss Multisem Gmbh | Teilchenoptische Anordnung, insbesondere Vielstrahl-Teilchenmikroskop, mit einer Magnetanordnung zum Separieren eines primären und eines sekundären teilchenoptischen Strahlenganges mit verbesserter Performance |
| TW202529141A (zh) | 2023-09-26 | 2025-07-16 | 德商卡爾蔡司多重掃描電子顯微鏡有限公司 | 具有增強聚焦功率的多束生成單元 |
| DE102023126251B4 (de) | 2023-09-27 | 2025-04-10 | Carl Zeiss Multisem Gmbh | Verfahren zum Betreiben eines Vielzahl-Teilchenstrahlsystems, Computerprogrammprodukt und Vielzahl-Teilchenstrahlsystem mit gesteigerter Performance |
| DE102023126510B3 (de) | 2023-09-28 | 2025-02-13 | Carl Zeiss Multisem Gmbh | Monolithische Multi-Aperturplatte für ein Vielstrahl-Elektronenstrahlsystem, Verfahren zur Herstellung einer monolithischen Multi-Aperturplatte, und Vielstrahl-Elektronenstrahlsystem mit einer monolithischen Multi-Aperturplatte |
| WO2025098639A1 (en) | 2023-11-07 | 2025-05-15 | Carl Zeiss Multisem Gmbh | Multi-beam charged particle microscope for inspection with reduced charging effects |
| WO2025108569A1 (en) | 2023-11-23 | 2025-05-30 | Carl Zeiss Multisem Gmbh | Multi-beam charged particle microscope design with improved detection system for secondary electron imaging over a large range of landing energies of primary electrons |
| DE102023133567A1 (de) | 2023-11-30 | 2025-06-05 | Carl Zeiss Multisem Gmbh | Verfahren zum Herstellen einer Mikrooptik für ein Vielzahl-Teilchenstrahlsystem, Mikrooptik und Vielzahl-Teilchenstrahlsystem |
| WO2025131323A1 (en) | 2023-12-19 | 2025-06-26 | Carl Zeiss Multisem Gmbh | Multi-beam charged particle microscope for inspection with reduced charging effects |
| WO2025131496A1 (en) | 2023-12-20 | 2025-06-26 | Carl Zeiss Multisem Gmbh | Frame aggregation for multi-beam raster scanning microscopes |
| DE102024105793B3 (de) | 2024-02-29 | 2025-07-31 | Carl Zeiss Multisem Gmbh | Fertigungsverfahren für eine monolithische Multi-Aperturplatte und monolithische Multi-Aperturplatte für ein Vielstrahl-Elektronenstrahlsystem |
| TW202541082A (zh) | 2024-03-21 | 2025-10-16 | 德商卡爾蔡司多重掃描電子顯微鏡有限公司 | 具有範圍廣的著陸能量的多束粒子顯微鏡 |
| WO2025202056A1 (en) | 2024-03-25 | 2025-10-02 | Carl Zeiss Multisem Gmbh | Multi electron-beam system for inspection with backscattered electrons |
| US20250316437A1 (en) * | 2024-04-05 | 2025-10-09 | Kla Corporation | Ultra-high sensitivity hybrid inspection with full wafer coverage capability |
| WO2025224235A2 (en) | 2024-04-25 | 2025-10-30 | Carl Zeiss Multisem Gmbh | Improved beam control for a multi-beam scanning particle imaging system |
| TW202548823A (zh) | 2024-05-10 | 2025-12-16 | 德商卡爾蔡司多重掃描電子顯微鏡有限公司 | 基於二次帶電粒子束測量的多束掃描帶電粒子顯微鏡的一次帶電粒子束像差 |
| EP4672299A3 (en) | 2024-06-03 | 2026-03-25 | Carl Zeiss MultiSEM GmbH | Multi-beam charged particle microscope design with adaptive detection system |
| DE102024118384B4 (de) | 2024-06-28 | 2026-02-05 | Carl Zeiss Multisem Gmbh | Verfahren zum Betreiben eines Vielzahl-Teilchenstrahlsystems sowie Vielzahl-Teilchenstrahlsystem mit elektrostatischen Fangelektroden |
| DE102024119459B3 (de) | 2024-07-09 | 2026-01-15 | Carl Zeiss Multisem Gmbh | Strahlerzeugungsvorrichtung für ein Vielzahl-Teilchenstrahlsystem und Vielzahl-Teilchenstrahlsystem |
| WO2026037730A2 (en) | 2024-08-12 | 2026-02-19 | Carl Zeiss Multisem Gmbh | Photoemission of charged-particle beams in multi-beam charged-particle microscopes |
| DE102024127358A1 (de) | 2024-09-23 | 2026-03-26 | Carl Zeiss Multisem Gmbh | Verfahren zum Betreiben eines Vielzahl-Teilchenstrahlsystems mit Detektion eines Ring-Kollaps-Prozesses und Triggern eines Materialaufbauprozesses, zugehöriges Computerprogrammprodukt sowie Vielzahl-Teilchenstrahlsystem und Vielstrahl-Teilchenmikroskop |
| WO2026068185A2 (en) | 2024-09-26 | 2026-04-02 | Carl Zeiss Multisem Gmbh | High-throughput multi-beam scanning microscope with hexagonal raster of beamlets |
| DE102024128162B3 (de) | 2024-09-27 | 2026-03-19 | Carl Zeiss Multisem Gmbh | Verfahren zum Einstellen einer Vielkanal-Detektionseinheit eines Vielstrahl-Teilchenmikroskops bei einer Inspektion aufladbarer Proben, zugehöriges Computerprogrammprodukt und Vielstrahl-Teilchenmikroskop |
| DE102024128159B3 (de) | 2024-09-27 | 2026-03-12 | Carl Zeiss Multisem Gmbh | Multiapertur-Array zum Manipulieren einer Vielzahl von geladenen ersten Einzelteilchenstrahlen sowie Vielzahl-Teilchenstrahlsystem mit dem Multiapertur-Array |
| DE102024128202A1 (de) | 2024-09-30 | 2026-04-02 | Carl Zeiss Multisem Gmbh | Verfahren zur passiven Justage einer teilchenoptischen Komponente für eine Funktionseinheit eines Teilchenstrahlsystems, insbesondere eines Polschuhs für eine Magnetlinse, Verfahren zum Ausrüsten eines Teilchenstrahlsystems mit der Funktionseinheit, insbesondere einer Magnetlinse, sowie Teilchenstrahlsystem |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61277145A (ja) * | 1984-12-28 | 1986-12-08 | オフイス ナシオナル デチユ−ド エ ドウ ルシエルシエ アエロスパシヤル | 微量分析装置 |
| JPS6319746A (ja) * | 1986-07-12 | 1988-01-27 | Nissin Electric Co Ltd | 表面解析装置 |
| JPH06223767A (ja) * | 1993-01-29 | 1994-08-12 | Jeol Ltd | 直接写像型反射電子顕微鏡 |
| JP2002532844A (ja) * | 1998-12-17 | 2002-10-02 | フィリップス エレクトロン オプティクス ビー ヴィ | オージェ電子の検出を含む粒子光学装置 |
| JP2003083917A (ja) * | 2001-09-13 | 2003-03-19 | Hitachi Ltd | 電子線を用いた外観検査装置 |
| JP2004134386A (ja) * | 2002-08-06 | 2004-04-30 | Leo Elektronenmikroskopie Gmbh | 粒子光学配置および粒子光学システム |
Family Cites Families (101)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2877369A (en) * | 1955-06-02 | 1959-03-10 | Rca Corp | Electron beam tube |
| JPS57118357A (en) | 1981-01-14 | 1982-07-23 | Jeol Ltd | Objective lens for scan type electron microscope |
| US4914282A (en) * | 1984-07-06 | 1990-04-03 | Canon Kabushiki Kaisha | Focus detection system employing multiple area light distribution sensors |
| JPS6161414A (ja) * | 1984-09-03 | 1986-03-29 | Nippon Telegr & Teleph Corp <Ntt> | マルチ荷電ビ−ム露光装置 |
| JPS61259440A (ja) * | 1985-05-10 | 1986-11-17 | Nec Corp | インライン型電子銃電極構体 |
| JPS62229643A (ja) * | 1986-03-28 | 1987-10-08 | Jeol Ltd | 電子線発生装置 |
| JPS63129752A (ja) | 1986-11-19 | 1988-06-02 | Nec Corp | 遅延検波器 |
| US4737682A (en) * | 1987-07-20 | 1988-04-12 | Rca Corporation | Color picture tube having an inline electron gun with an einzel lens |
| JPH01195581A (ja) | 1988-01-30 | 1989-08-07 | Pfu Ltd | イメージ・データ処理システム |
| US5012105A (en) * | 1989-02-02 | 1991-04-30 | Nippon Seiko Kabushiki Kaisha | Multiple-imaging charged particle-beam exposure system |
| US4990822A (en) * | 1989-12-29 | 1991-02-05 | Zenith Electronics Corporation | Focusing electrode assembly for a color cathode ray tube electron gun |
| US5485209A (en) * | 1992-04-03 | 1996-01-16 | Canon Kabushiki Kaisha | Pupil divisional type focusing position detection apparatus for electronic cameras |
| KR100221109B1 (ko) * | 1992-11-06 | 1999-09-15 | 다니구찌 이찌로오 | 이미지 디스플레이 장치 |
| JP3325982B2 (ja) | 1993-12-27 | 2002-09-17 | 株式会社東芝 | 磁界界浸型電子銃 |
| EP0708975B1 (en) | 1994-04-12 | 1997-12-03 | Koninklijke Philips Electronics N.V. | Particle-optical apparatus comprising a detector for secondary electrons |
| TW378334B (en) * | 1994-10-14 | 2000-01-01 | Thomson Consumer Electronics | Method of forming an enhanced resolution shadow mask |
| US5483074A (en) * | 1995-01-11 | 1996-01-09 | Litton Systems, Inc. | Flood beam electron gun |
| JP2914264B2 (ja) * | 1996-01-16 | 1999-06-28 | 日本電気株式会社 | 電子ビーム描画方法 |
| US5825038A (en) * | 1996-11-26 | 1998-10-20 | Eaton Corporation | Large area uniform ion beam formation |
| JP3647128B2 (ja) * | 1996-03-04 | 2005-05-11 | キヤノン株式会社 | 電子ビーム露光装置とその露光方法 |
| JP3647136B2 (ja) * | 1996-04-23 | 2005-05-11 | キヤノン株式会社 | 電子ビーム露光装置 |
| EP1369897A3 (en) * | 1996-03-04 | 2005-01-19 | Canon Kabushiki Kaisha | Electron beam exposure apparatus and method, and device manufacturing method |
| JPH09275068A (ja) * | 1996-04-04 | 1997-10-21 | Nikon Corp | 電子線露光装置 |
| US5892224A (en) | 1996-05-13 | 1999-04-06 | Nikon Corporation | Apparatus and methods for inspecting wafers and masks using multiple charged-particle beams |
| JPH09311112A (ja) * | 1996-05-22 | 1997-12-02 | Nikon Corp | 欠陥検査装置 |
| US5981954A (en) * | 1997-01-16 | 1999-11-09 | Canon Kabushiki Kaisha | Electron beam exposure apparatus |
| DE19738070A1 (de) | 1997-09-01 | 1999-03-04 | Leo Elektronenmikroskopie Gmbh | Energiefilter, insbesondere für ein Elektronenmikroskop |
| JP3441955B2 (ja) | 1998-02-23 | 2003-09-02 | 株式会社日立製作所 | 投射方式の荷電粒子顕微鏡および基板検査システム |
| US6014200A (en) * | 1998-02-24 | 2000-01-11 | Nikon Corporation | High throughput electron beam lithography system |
| US6486480B1 (en) * | 1998-04-10 | 2002-11-26 | The Regents Of The University Of California | Plasma formed ion beam projection lithography system |
| US6153970A (en) * | 1998-04-20 | 2000-11-28 | Chunghwa Picture Tubes, Ltd. | Color CRT electron gun with asymmetric auxiliary beam passing aperture |
| US6157039A (en) * | 1998-05-07 | 2000-12-05 | Etec Systems, Inc. | Charged particle beam illumination of blanking aperture array |
| JP2000064100A (ja) * | 1998-08-24 | 2000-02-29 | Hitachi Ltd | 鋼帯の脱スケ−ル装置及び鋼帯の製造装置 |
| JP2000090866A (ja) * | 1998-09-17 | 2000-03-31 | Toshiba Corp | 電子銃、電子銃による電子ビーム発生方法及び電子銃を用いた露光装置 |
| US6252412B1 (en) | 1999-01-08 | 2001-06-26 | Schlumberger Technologies, Inc. | Method of detecting defects in patterned substrates |
| JP4410871B2 (ja) * | 1999-03-25 | 2010-02-03 | キヤノン株式会社 | 荷電粒子線露光装置及び該装置を用いたデバイス製造方法 |
| JP3658235B2 (ja) | 1999-03-30 | 2005-06-08 | キヤノン株式会社 | 電子銃および電子銃を用いた描画装置および電子線応用装置 |
| JP2001052998A (ja) * | 1999-06-03 | 2001-02-23 | Advantest Corp | 荷電粒子ビーム結像方法、荷電粒子ビーム結像装置及び荷電粒子ビーム露光装置 |
| JP2001133234A (ja) * | 1999-11-05 | 2001-05-18 | Nikon Corp | 欠陥検査方法、欠陥検査装置及びそれらを用いた半導体デバイスの製造方法 |
| US6465783B1 (en) * | 1999-06-24 | 2002-10-15 | Nikon Corporation | High-throughput specimen-inspection apparatus and methods utilizing multiple parallel charged particle beams and an array of multiple secondary-electron-detectors |
| US6868175B1 (en) | 1999-08-26 | 2005-03-15 | Nanogeometry Research | Pattern inspection apparatus, pattern inspection method, and recording medium |
| US7796801B2 (en) | 1999-08-26 | 2010-09-14 | Nanogeometry Research Inc. | Pattern inspection apparatus and method |
| US7817844B2 (en) | 1999-08-26 | 2010-10-19 | Nanogeometry Research Inc. | Pattern inspection apparatus and method |
| JP3763446B2 (ja) * | 1999-10-18 | 2006-04-05 | キヤノン株式会社 | 静電レンズ、電子ビーム描画装置、荷電ビーム応用装置、および、デバイス製造方法 |
| EP1120809B1 (en) * | 2000-01-27 | 2012-02-22 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Objective lens for a charged particle beam device |
| US6559586B1 (en) * | 2000-02-08 | 2003-05-06 | Sarnoff Corporation | Color picture tube including an electron gun in a coated tube neck |
| WO2001059805A1 (en) * | 2000-02-09 | 2001-08-16 | Fei Company | Multi-column fib for nanofabrication applications |
| US6566664B2 (en) * | 2000-03-17 | 2003-05-20 | Canon Kabushiki Kaisha | Charged-particle beam exposure apparatus and device manufacturing method |
| JP4947842B2 (ja) * | 2000-03-31 | 2012-06-06 | キヤノン株式会社 | 荷電粒子線露光装置 |
| JP4947841B2 (ja) * | 2000-03-31 | 2012-06-06 | キヤノン株式会社 | 荷電粒子線露光装置 |
| JP2001283756A (ja) * | 2000-03-31 | 2001-10-12 | Canon Inc | 電子光学系アレイ、これを用いた荷電粒子線露光装置ならびにデバイス製造方法 |
| JP2001284230A (ja) * | 2000-03-31 | 2001-10-12 | Canon Inc | 電子光学系アレイ、これを用いた荷電粒子線露光装置ならびにデバイス製造方法 |
| JP4585661B2 (ja) * | 2000-03-31 | 2010-11-24 | キヤノン株式会社 | 電子光学系アレイ、荷電粒子線露光装置およびデバイス製造方法 |
| KR100465117B1 (ko) * | 2000-04-04 | 2005-01-05 | 주식회사 아도반테스토 | 다축전자렌즈를 이용한 멀티빔 노광장치, 복수의 전자빔을집속하는 다축전자렌즈, 반도체소자 제조방법 |
| US6744041B2 (en) * | 2000-06-09 | 2004-06-01 | Edward W Sheehan | Apparatus and method for focusing ions and charged particles at atmospheric pressure |
| US7241993B2 (en) | 2000-06-27 | 2007-07-10 | Ebara Corporation | Inspection system by charged particle beam and method of manufacturing devices using the system |
| EP1296351A4 (en) * | 2000-06-27 | 2009-09-23 | Ebara Corp | INVESTIGATION DEVICE FOR LOADED PARTICLE RAYS AND METHOD FOR PRODUCING A COMPONENT ELEVATED WITH THIS INSPECTION DEVICE |
| JP2002031525A (ja) | 2000-07-14 | 2002-01-31 | Seiko Instruments Inc | 半導体ウエハのパターン形状評価方法及び装置 |
| WO2002013227A1 (en) * | 2000-07-27 | 2002-02-14 | Ebara Corporation | Sheet beam test apparatus |
| JP2002050697A (ja) * | 2000-08-07 | 2002-02-15 | Mitsubishi Electric Corp | 半導体装置の製造方法、及び半導体装置 |
| JP4601146B2 (ja) | 2000-10-03 | 2010-12-22 | 株式会社アドバンテスト | 電子ビーム露光装置 |
| WO2002037526A1 (en) | 2000-11-02 | 2002-05-10 | Ebara Corporation | Electron beam apparatus and method for manufacturing semiconductor device comprising the apparatus |
| EP1271606A1 (en) | 2000-11-02 | 2003-01-02 | Ebara Corporation | Electron beam apparatus and device production method using the apparatus |
| WO2002040980A1 (en) * | 2000-11-17 | 2002-05-23 | Ebara Corporation | Wafer inspecting method, wafer inspecting instrument, and electron beam apparatus |
| EP1339100A1 (en) * | 2000-12-01 | 2003-08-27 | Ebara Corporation | Inspection method and apparatus using electron beam, and device production method using it |
| JP2002184338A (ja) * | 2000-12-12 | 2002-06-28 | Nikon Corp | 電子線装置及びその電子線装置を用いたデバイス製造方法 |
| WO2002049065A1 (en) | 2000-12-12 | 2002-06-20 | Ebara Corporation | Electron beam device and semiconductor device production method using the device |
| JP3914386B2 (ja) * | 2000-12-28 | 2007-05-16 | 株式会社ルネサステクノロジ | フォトマスク、その製造方法、パターン形成方法および半導体装置の製造方法 |
| JP4246401B2 (ja) * | 2001-01-18 | 2009-04-02 | 株式会社アドバンテスト | 電子ビーム露光装置及び電子ビーム偏向装置 |
| US7022987B2 (en) * | 2001-02-20 | 2006-04-04 | Carl Zeiss Nis Gmbh | Particle-optical arrangements and particle-optical systems |
| DE10107910A1 (de) * | 2001-02-20 | 2002-08-22 | Leo Elektronenmikroskopie Gmbh | Teilchenstrahlsystem mit einem Spiegelkorrektor |
| JP4647820B2 (ja) * | 2001-04-23 | 2011-03-09 | キヤノン株式会社 | 荷電粒子線描画装置、および、デバイスの製造方法 |
| US6764743B2 (en) | 2001-05-01 | 2004-07-20 | Ngk Insulators, Ltd. | Porous honeycomb structure and process for production thereof |
| JP4041742B2 (ja) * | 2001-05-01 | 2008-01-30 | 株式会社荏原製作所 | 電子線装置及び該電子線装置を用いたデバイス製造方法 |
| JP4756776B2 (ja) * | 2001-05-25 | 2011-08-24 | キヤノン株式会社 | 荷電粒子線露光装置、荷電粒子線露光方法およびデバイス製造方法 |
| US6750455B2 (en) * | 2001-07-02 | 2004-06-15 | Applied Materials, Inc. | Method and apparatus for multiple charged particle beams |
| TW579536B (en) | 2001-07-02 | 2004-03-11 | Zeiss Carl Semiconductor Mfg | Examining system for the particle-optical imaging of an object, deflector for charged particles as well as method for the operation of the same |
| JP2003031171A (ja) * | 2001-07-18 | 2003-01-31 | Nikon Corp | 電子線装置及び該電子線装置を用いたデバイス製造方法 |
| JP2003045789A (ja) * | 2001-08-02 | 2003-02-14 | Canon Inc | 描画装置及び描画方法 |
| JP2003100246A (ja) * | 2001-09-25 | 2003-04-04 | Toshiba Corp | 荷電ビーム装置並びにパターン測定方法およびパターン描画方法 |
| JP2003203836A (ja) * | 2001-12-28 | 2003-07-18 | Canon Inc | 露光装置及びその制御方法並びにデバイス製造方法 |
| US6853143B2 (en) * | 2002-01-09 | 2005-02-08 | Ebara Corporation | Electron beam system and method of manufacturing devices using the system |
| US6768125B2 (en) * | 2002-01-17 | 2004-07-27 | Ims Nanofabrication, Gmbh | Maskless particle-beam system for exposing a pattern on a substrate |
| JP3940310B2 (ja) * | 2002-04-04 | 2007-07-04 | 株式会社日立ハイテクノロジーズ | 電子ビーム描画方法及び描画装置、並びにこれを用いた半導体製造方法 |
| DE10230929A1 (de) * | 2002-07-09 | 2004-01-29 | Leo Elektronenmikroskopie Gmbh | Verfahren zum elektronenmikroskopischen Beobachten einer Halbleiteranordnung und Vorrichtung hierfür |
| DE10235456B4 (de) | 2002-08-02 | 2008-07-10 | Leo Elektronenmikroskopie Gmbh | Elektronenmikroskopiesystem |
| DE10237135A1 (de) * | 2002-08-13 | 2004-02-26 | Leo Elektronenmikroskopie Gmbh | Teilchenoptische Vorrichtung und Verfahren zum Betrieb derselben |
| JP4167050B2 (ja) | 2002-12-13 | 2008-10-15 | キヤノン株式会社 | 荷電粒子線露光装置及びその制御方法、並びにデバイス製造方法 |
| KR101068607B1 (ko) * | 2003-03-10 | 2011-09-30 | 마퍼 리쏘그라피 아이피 비.브이. | 복수 개의 빔렛 발생 장치 |
| DE60332808D1 (de) * | 2003-03-24 | 2010-07-15 | Integrated Circuit Testing | Ladungsträgerstrahlvorrichtung |
| JP4459568B2 (ja) * | 2003-08-06 | 2010-04-28 | キヤノン株式会社 | マルチ荷電ビームレンズおよびそれを用いた荷電ビーム露光装置 |
| CN101103417B (zh) | 2003-09-05 | 2012-06-27 | 卡尔蔡司Smt有限责任公司 | 粒子光学系统和排布结构,以及用于其的粒子光学组件 |
| GB2413694A (en) * | 2004-04-30 | 2005-11-02 | Ims Nanofabrication Gmbh | Particle-beam exposure apparatus |
| EP1657736B1 (en) * | 2004-11-15 | 2016-12-14 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | High current density particle beam system |
| EP1703538B1 (en) * | 2005-03-17 | 2008-11-12 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Charged particle beam device for high spatial resolution and multiple perspective imaging |
| JP5663717B2 (ja) * | 2005-09-06 | 2015-02-04 | カール ツァイス マイクロスコピー ゲーエムベーハーCarl Zeiss Microscopy Gmbh | 荷電粒子システム |
| US8026495B2 (en) * | 2005-10-28 | 2011-09-27 | Carl Zeiss Sms Gmbh | Charged particle beam exposure system |
| KR101364672B1 (ko) * | 2006-09-12 | 2014-02-19 | 가부시키가이샤 에바라 세이사꾸쇼 | 하전입자선장치, 그 장치를 이용한 비점수차 조정방법 및그 장치를 이용한 디바이스제조방법 |
| US7825386B2 (en) * | 2006-10-25 | 2010-11-02 | Hermes-Microvision, Inc. | System and method for a charged particle beam |
| JP2009011478A (ja) * | 2007-07-03 | 2009-01-22 | Brother Ind Ltd | ミシン及びミシンモータ制御プログラム |
| JP5886663B2 (ja) * | 2012-03-21 | 2016-03-16 | 株式会社日立ハイテクノロジーズ | 電子線応用装置およびレンズアレイ |
-
2004
- 2004-09-07 CN CN2004800255289A patent/CN101103417B/zh not_active Expired - Fee Related
- 2004-09-07 CN CN201510512550.6A patent/CN105161393B/zh not_active Expired - Fee Related
- 2004-09-07 WO PCT/US2004/029079 patent/WO2005024881A2/en not_active Ceased
- 2004-09-07 EP EP12190690.3A patent/EP2575144B1/en not_active Expired - Lifetime
- 2004-09-07 EP EP12190693.7A patent/EP2579270B8/en not_active Expired - Lifetime
- 2004-09-07 JP JP2006525518A patent/JP4794444B2/ja not_active Expired - Fee Related
- 2004-09-07 EP EP12190695.2A patent/EP2579272A1/en not_active Withdrawn
- 2004-09-07 EP EP12190692.9A patent/EP2579269B8/en not_active Expired - Lifetime
- 2004-09-07 KR KR1020067004511A patent/KR101051370B1/ko not_active Expired - Fee Related
- 2004-09-07 EP EP12190691.1A patent/EP2579268A1/en not_active Withdrawn
- 2004-09-07 EP EP12190689.5A patent/EP2575143B8/en not_active Expired - Lifetime
- 2004-09-07 EP EP12190694.5A patent/EP2579271B8/en not_active Expired - Lifetime
- 2004-09-07 EP EP04783363A patent/EP1668662B1/en not_active Expired - Lifetime
- 2004-09-07 EP EP12190696.0A patent/EP2579273B8/en not_active Expired - Lifetime
- 2004-09-07 CN CN201210111707.0A patent/CN102709143B/zh not_active Expired - Lifetime
- 2004-09-07 EP EP12190697.8A patent/EP2579274A1/en not_active Withdrawn
-
2006
- 2006-03-03 US US11/366,533 patent/US7244949B2/en not_active Expired - Lifetime
-
2007
- 2007-06-13 US US11/808,845 patent/US7554094B2/en not_active Expired - Lifetime
-
2008
- 2008-04-07 JP JP2008099010A patent/JP2008218422A/ja active Pending
-
2009
- 2009-06-25 US US12/459,078 patent/US8097847B2/en not_active Expired - Lifetime
-
2011
- 2011-05-18 JP JP2011111070A patent/JP5364756B2/ja not_active Expired - Lifetime
- 2011-12-31 US US13/342,017 patent/US8637834B2/en not_active Expired - Fee Related
-
2012
- 2012-12-27 JP JP2012285348A patent/JP5756077B2/ja not_active Expired - Fee Related
-
2013
- 2013-07-24 JP JP2013153718A patent/JP5756150B2/ja not_active Expired - Fee Related
-
2014
- 2014-01-27 US US14/165,573 patent/US9224576B2/en not_active Expired - Lifetime
- 2014-12-10 JP JP2014250291A patent/JP6208653B2/ja not_active Expired - Lifetime
-
2015
- 2015-12-18 US US14/975,314 patent/US9673024B2/en not_active Expired - Fee Related
-
2017
- 2017-05-30 US US15/608,229 patent/US10504681B2/en not_active Expired - Lifetime
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61277145A (ja) * | 1984-12-28 | 1986-12-08 | オフイス ナシオナル デチユ−ド エ ドウ ルシエルシエ アエロスパシヤル | 微量分析装置 |
| JPS6319746A (ja) * | 1986-07-12 | 1988-01-27 | Nissin Electric Co Ltd | 表面解析装置 |
| JPH06223767A (ja) * | 1993-01-29 | 1994-08-12 | Jeol Ltd | 直接写像型反射電子顕微鏡 |
| JP2002532844A (ja) * | 1998-12-17 | 2002-10-02 | フィリップス エレクトロン オプティクス ビー ヴィ | オージェ電子の検出を含む粒子光学装置 |
| JP2003083917A (ja) * | 2001-09-13 | 2003-03-19 | Hitachi Ltd | 電子線を用いた外観検査装置 |
| JP2004134386A (ja) * | 2002-08-06 | 2004-04-30 | Leo Elektronenmikroskopie Gmbh | 粒子光学配置および粒子光学システム |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220079969A (ko) * | 2019-10-17 | 2022-06-14 | 아이씨티 인티그레이티드 써킷 테스팅 게젤샤프트 퓌어 할프라이터프뤼프테크닉 엠베하 | 하전 입자 빔 디바이스 및 하전 입자 빔 디바이스를 작동시키는 방법 |
| KR102793655B1 (ko) | 2019-10-17 | 2025-04-10 | 아이씨티 인티그레이티드 써킷 테스팅 게젤샤프트 퓌어 할프라이터프뤼프테크닉 엠베하 | 하전 입자 빔 디바이스 및 하전 입자 빔 디바이스를 작동시키는 방법 |
Also Published As
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4794444B2 (ja) | 粒子光学システム及び装置、並びに、かかるシステム及び装置用の粒子光学部品 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070903 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070903 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070903 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20101116 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20101118 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20110209 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20110217 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20110318 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20110328 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20110415 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20110422 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110518 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110707 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110726 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 4794444 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140805 Year of fee payment: 3 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
| S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| R360 | Written notification for declining of transfer of rights |
Free format text: JAPANESE INTERMEDIATE CODE: R360 |
|
| R360 | Written notification for declining of transfer of rights |
Free format text: JAPANESE INTERMEDIATE CODE: R360 |
|
| R371 | Transfer withdrawn |
Free format text: JAPANESE INTERMEDIATE CODE: R371 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313117 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |