JP4793128B2 - Semiconductor device manufacturing apparatus and semiconductor device manufacturing method - Google Patents

Description

  The present invention relates to a semiconductor device manufacturing apparatus and a semiconductor device manufacturing method for manufacturing a large number of semiconductor chips by cleaving a semiconductor substrate by so-called laser dicing.

  An example of a technique for laser dicing a semiconductor substrate (wafer) is described in Patent Document 1. In the configuration of Patent Document 1, after a semiconductor substrate is attached to a dicing tape (dicing sheet), the surface of the semiconductor substrate is irradiated with laser to form a modified layer for cleaving, and the dicing tape is pushed up from the back side. In this way, the semiconductor substrate is cleaved to produce a large number of semiconductor chips.

In laser dicing with such a configuration, when the semiconductor substrate is cleaved, crushed fine particles (particles) are generated from the fractured surface and scattered on the upper surface of the semiconductor chip, which decreases the yield and quality of the semiconductor chip. There was a problem. On the other hand, in the structure of the said patent document 1, the suction device which attracts | sucks the crushing fine particle is provided, and it is going to eliminate the said problem.
JP 2003-10986 A

  However, in the configuration of the above-mentioned Patent Document 1, since the crushed fine particles are sucked from the upper surface side of the semiconductor substrate by the suction device, it is difficult to suck all the crushed fine particles generated by cleaving and could not be sucked. The crushed fine particles may fly above the semiconductor substrate. Then, the crushed fine particles that have fluttered in this way are scattered on the upper surface of the semiconductor substrate, resulting in a problem that the yield and quality of the semiconductor chip are lowered.

  Accordingly, an object of the present invention is to provide a semiconductor device manufacturing apparatus and a semiconductor device manufacturing method capable of removing the crushed fine particles generated by cleaving and preventing the crushed fine particles from being scattered on the upper surface of the semiconductor substrate. It is in.

According to the first aspect of the present invention , after the semiconductor substrate is attached to the dicing tape, the semiconductor substrate is irradiated with a laser to form a modified layer for cleaving, and the dicing tape is expanded to cleave the semiconductor substrate. In the manufacturing of a large number of semiconductor chips, when the dicing tape is expanded, the expansion device includes an expanding device that sets and expands the semiconductor substrate with respect to the dicing tape , and the expanding device includes: A push-up jig that is provided so as to be movable up and down and pushes up and expands an annular portion of the dicing tape outside the semiconductor substrate; the push-up jig is formed of a cylindrical member; Flows downward from the vicinity of the surface where the semiconductor substrate is attached An air flow generation device that generates an air flow is provided, and the air flow generation device is an upper end portion of a push-up jig constituted by the cylindrical member, and is positioned above the lower surface of the semiconductor substrate when pushed up. It is characterized by having a plurality of grooves or holes .

  According to the above configuration, since the expand device is configured to expand by setting the semiconductor substrate to face downward with respect to the dicing tape, the crushed fine particles generated by cleaving naturally fall downward, The crushed fine particles can be removed, and the crushed fine particles can be prevented from being scattered on the upper surface of the semiconductor substrate.

According to the invention of claim 2, after the semiconductor substrate is bonded to the dicing tape, the semiconductor substrate is irradiated with laser to form a modified layer for cleaving, and the dicing tape is expanded to expand the semiconductor substrate. In an apparatus for manufacturing a semiconductor device that cuts and manufactures a large number of semiconductor chips, an expansion device that expands the dicing tape by setting the semiconductor substrate to face downward when the dicing tape is expanded is provided. The expanding device is provided so as to be movable up and down, and has a push-up jig that pushes up and expands an annular portion of the dicing tape outside the semiconductor substrate, and the push-up jig is a cylindrical member. It is configured and a recess is formed at the upper end to surround the semiconductor substrate. And an air flow generating device that generates an air flow that flows downward from the vicinity of the surface of the dicing tape to which the semiconductor substrate is attached, the air flow generating device comprising the cylindrical push-up jig A plurality of grooves or holes positioned above the lower surface of the semiconductor substrate when pushed up, and an air vent hole provided at the bottom of the recess. Therefore, substantially the same effect as the invention of claim 1 can be obtained .

In the case of each of the above configurations, as in the invention of claim 3, the air flow generating device includes the dicing tape formed of a tape having a large number of fine holes or a tape made of a porous material. It is preferable .

According to the invention of claim 4, after the semiconductor substrate is attached to the dicing tape, the semiconductor substrate is irradiated with laser to form a modified layer for cleaving, and the dicing tape is expanded to expand the semiconductor substrate. In a manufacturing method of a semiconductor device that cuts and manufactures a large number of semiconductor chips, an expansion device that expands by setting the semiconductor substrate to face downward with respect to the dicing tape when the dicing tape is expanded is provided. The expanding device is provided so as to be movable up and down, and has a push-up jig that pushes up and expands an annular portion outside the semiconductor substrate in the dicing tape, and the push-up jig is formed of a cylindrical member. In the vicinity of the surface of the dicing tape to which the semiconductor substrate is attached An air flow generation device that generates a flow of air flowing downward from the top, and the air flow generation device is an upper end portion of a push-up jig formed of the cylindrical member, and is A plurality of grooves or holes positioned above the lower surface, and when expanding the semiconductor substrate with the dicing tape so that the semiconductor substrate faces downward, The air is introduced into the lifting jig through the hole, and the introduced air flows downward from the vicinity of the surface of the dicing tape to which the semiconductor substrate is attached. An effect is obtained .

According to the invention of claim 5, after the semiconductor substrate is attached to the dicing tape, the semiconductor substrate is irradiated with laser to form a modified layer for cleaving, and the dicing tape is expanded to expand the semiconductor substrate. In a manufacturing method of a semiconductor device that cuts and manufactures a large number of semiconductor chips, an expansion device that expands by setting the semiconductor substrate to face downward with respect to the dicing tape when the dicing tape is expanded is provided. The expanding device is provided so as to be movable up and down, and has a push-up jig that pushes up and expands an annular portion outside the semiconductor substrate in the dicing tape, and the push-up jig is formed of a cylindrical member. And a recess is formed at the upper end of the semiconductor substrate. Is, an air flow generating device for generating a flow of air flowing from the vicinity of the surface on which the semiconductor substrate is stuck in the dicing tape downward,
The air flow generation device is provided at an upper end portion of a push-up jig constituted by the cylindrical member, at a plurality of grooves or holes located above the lower surface of the semiconductor substrate at the time of push-up, and a bottom portion of the recess. And when the expansion is performed with the semiconductor substrate facing downward with respect to the dicing tape, the push-up jig passes through a plurality of grooves or holes of the push-up jig. Since the air introduced therein flows downward from the vicinity of the surface of the dicing tape to which the semiconductor substrate is attached, substantially the same effect as that of the invention of claim 4 can be obtained .

In the case of each of the above configurations, it is preferable to provide the dicing tape formed of a tape having a large number of fine holes or a tape made of a porous material, as in the invention of claim 6 .

  The first embodiment of the present invention will be described below with reference to FIGS. First, FIG.1 and FIG.2 is the longitudinal cross-sectional view and exploded perspective view which show schematically the whole structure of the expand apparatus 1 of a present Example.

  The expanding device 1 includes a cylindrical flat ring fixing base 2, an annular flat ring fixing jig 3, a cylindrical pushing jig 4, and air suction for sucking air inside the pushing jig 4 downward. And a device (not shown). A plurality of grooves 2 a are provided in the upper end surface portion of the flat ring fixing base 2 so as to communicate between the inside and the outside.

  A flat ring 6 affixed to the outer peripheral edge of a circular dicing tape (dicing sheet) 5 is placed on the flat ring fixing base 2, and a flat ring fixing jig 3 is placed and fixed thereon. Thus, the dicing tape 5 and the flat ring 6 can be sandwiched and fixed between the flat ring fixing base 2 and the flat ring fixing jig 3. A semiconductor substrate (wafer) 7 having a semiconductor element formed on the surface is attached to the lower surface of the dicing tape 5.

  The push-up jig 4 is provided so as to be movable up and down, and has a function of cleaving the semiconductor substrate 7 by pushing up and expanding (expanding) an annular portion outside the semiconductor substrate 7 on the lower surface of the dicing tape 5. Have. A plurality of holes 4a are formed in the upper end portion of the push-up jig 4 so as to penetrate the peripheral wall portion (internal and external communication).

  Next, the process of cleaving the semiconductor substrate 7 according to this embodiment will be described with reference to FIG. First, as shown in FIG. 3A, the semiconductor substrate 7 is attached to substantially the center of the upper surface of the dicing tape 5 attached to the lower surface of the flat ring 6. In this case, a semiconductor element is formed on the front surface (upper surface) of the semiconductor substrate 7, and the back surface (lower surface) of the semiconductor substrate 7 is attached to the dicing tape 5.

  An adhesive for attaching the semiconductor substrate 7 and the like is applied to the upper surface of the dicing tape 5 in FIG. However, an annular portion outside the semiconductor substrate 7 on the upper surface of the dicing tape 5 (around the portion where the upper end portion of the push-up jig 4 abuts) is subjected to a process for reducing the adhesive strength of the applied adhesive. Yes. As a result, the dicing tape 5 is prevented from sticking to the upper end portion of the push-up jig 4, and the expansion by the push-up jig 4 is not hindered.

  When performing the treatment for reducing the adhesive strength of the adhesive, for example, an ultraviolet irradiation peeling type dicing tape is used as the dicing tape 5 so that only the portion where the adhesive strength is to be reduced is irradiated with ultraviolet rays. good. Further, such a process for reducing the adhesive force may be performed at any time before the expansion is executed.

  Next, as shown in FIG. 3B, the surface of the semiconductor substrate 7 is irradiated with a laser 9 to form the required number of modified layers for cutting (modified layers necessary for expanding cleaving) inside the semiconductor substrate 7. To do. A broken line drawn on the semiconductor substrate 7 indicates a position (line) to be cleaved.

  Thereafter, as shown in FIG. 3C, the dicing tape 5 and the flat ring 6 are expanded so that the surface of the semiconductor substrate 7 (the surface opposite to the surface bonded to the dicing tape 5) faces downward. Set to 1. Specifically, the flat ring 6 and the outer peripheral edge of the dicing tape 5 are connected to the flat ring fixing base 2 and the flat ring so that the surface of the dicing tape 5 on which the semiconductor substrate 7 is attached becomes the lower surface. It fixes by pinching | interposing between the fixing jigs 3. Further, the upper end portion of the lifting jig 4 is brought into contact with the annular portion outside the semiconductor substrate 7 on the lower surface of the dicing tape 5.

  And the air inside the raising jig | tool 4 is attracted | sucked downward by driving an air suction device. As a result, as indicated by solid arrows in FIG. 3C, external air passes through the groove 2 a on the upper end surface portion of the flat ring fixing base 2 and further passes through the hole 4 a on the upper end portion of the push-up jig 4. Then, it enters the push-up jig 4 and flows downward from the vicinity of the surface of the semiconductor substrate 7. That is, an air flow that flows downward from the vicinity of the surface of the semiconductor substrate 7 is generated. In this case, the air flow generating device is constituted by the groove 2a of the flat ring fixing base 2, the hole 4a of the lifting jig 4, the air suction device, and the like.

  Next, as shown in FIG. 3 (d), the push-up jig 4 is raised, and the annular portion outside the semiconductor substrate 7 on the lower surface of the dicing tape 5 is pushed up by its upper end. As a result, the dicing tape 5 is expanded, so that the semiconductor substrate 7 is cleaved and a large number of semiconductor chips 7a are manufactured.

  In this case, when the semiconductor substrate 7 is cleaved, crushed fine particles are generated from the fractured surface, but the surface of the semiconductor substrate 7 (the surface opposite to the surface bonded to the dicing tape 5) faces downward. The generated crushed fine particles naturally fall downward and do not adhere to the surface of the semiconductor substrate 7. In particular, in this embodiment, by driving the air suction device, the air inside the lifting jig 4 is sucked downward, and the surface of the semiconductor substrate 7 opposite to the surface bonded to the dicing tape 5 is removed. Since a flow of air flowing downward from the vicinity is generated, the generated crushed fine particles are carried downward by the air flow and discharged. Therefore, the crushed fine particles do not adhere to the surface of the semiconductor substrate 7.

  Thereafter, in order to maintain the state of the cleaved semiconductor chip, as shown in FIG. 4, an annular second flat ring 8 having an outer diameter dimension substantially equal to the outer diameter dimension of the push-up jig 4 is provided. Adhering to the upper surface of the dicing tape 5. Then, the outside of the second flat ring 8 in the dicing tape 5 is cut off.

  Thereby, as shown in FIG. 5, a configuration in which the semiconductor chip 7 a is cleaved, that is, a configuration in which the cleaved semiconductor chip 7 a and the dicing tape 5 are fixed by the second flat ring 8 is obtained. Then, the configuration in the state shown in FIG. 5 is sent to the post-process.

  In this embodiment having such a configuration, after the semiconductor substrate 7 is attached to the dicing tape 5, the semiconductor substrate 7 is irradiated with laser to form a modified layer for cleaving, and the dicing tape 5 is expanded. When the semiconductor substrate 7 is cut and a large number of semiconductor chips 7a are manufactured, when the dicing tape 5 is expanded, the semiconductor substrate 7 is set to expand downward with respect to the dicing tape 5. .

  According to the above configuration, the crushed fine particles generated by cleaving naturally fall downward, so that the crushed fine particles can be removed, and the crushed fine particles can be prevented from being scattered and attached to the upper surface of the semiconductor substrate 7. For this reason, the problem that the yield and quality of a semiconductor chip fall can be solved.

  Moreover, in the said Example, since it comprised so that the flow of the air which flowed below may be produced | generated from the vicinity of the surface opposite to the surface adhere | attached on the dicing tape 5 in the semiconductor substrate 7 at the time of the cutting of the semiconductor substrate 7. The crushed fine particles generated by cleaving are forcibly conveyed downward by the air flow and discharged. Therefore, it is possible to reliably prevent the crushed fine particles from adhering to the surface of the semiconductor substrate 7.

  Further, in the expanding apparatus 1 of the above-described embodiment, a push-up jig 4 that pushes up and expands an annular portion of the dicing tape 5 outside the semiconductor substrate 7 is provided so as to be movable up and down. Since it is configured with a cylindrical member, a configuration that generates a flow of air that flows downward from the vicinity of the surface of the semiconductor substrate 7 opposite to the surface that is bonded to the dicing tape 5 can be easily realized with a simple configuration. can do.

  And in the case of the said Example, since the several hole 4a was provided in the upper end part of the cylindrical raising jig | tool 4, it is easy to introduce the air outside the raising jig | tool 4 into the inside of the raising jig | tool 4. As shown in FIG. Instead of providing the plurality of holes 4a at the upper end of the push-up jig 4, a plurality of grooves may be provided.

  In the above embodiment, since the plurality of grooves 2 a are provided at the upper end portion of the flat ring fixing base 2, it becomes easy to introduce air outside the flat ring fixing base 2 into the flat ring fixing base 2.

  FIG. 6 shows a second embodiment of the present invention. The same components as those in the first embodiment are denoted by the same reference numerals. In the second embodiment, the push-up jig 9 is formed of a cylindrical member, and a recess 10 is formed at the upper end portion thereof, and the recess 10 can surround the entire semiconductor substrate 7. Yes. A plurality of holes 11 a are formed in the peripheral wall portion 11 of the recess 10 so as to penetrate the peripheral wall portion 11 (internal and external communication). An air vent hole 12 is formed along the axial center of the lifting jig 9 at the center of the bottom of the recess 10.

  In the case of the above configuration, when the air suction device is driven, the air outside the push-up jig 9 passes through the hole 11a at the upper end of the push-up jig 9 as shown by the solid line arrow in FIG. 9 enters the recess 10 and flows downward from the vicinity of the surface of the semiconductor substrate 7 through the air vent hole 12 at the center of the bottom surface of the recess 10.

  The configuration of the second embodiment other than that described above is the same as that of the first embodiment. Therefore, in the second embodiment, substantially the same operational effects as in the first embodiment can be obtained.

  7, 8 and 9 show a third embodiment of the present invention. The same components as those in the first embodiment are denoted by the same reference numerals. In the third embodiment, the cleaved state of the semiconductor chip 7a is fixed by an annular double frame 13. The double frame 13 includes an inner ring 14 and an outer ring 15.

  In the case of the above configuration, the inner ring 14 of the double frame 13 is detachably attached to the upper end portion of the push-up jig 4 before executing the expansion. Then, as shown in FIG. 7, the push-up jig 4 is raised to push up and expand the annular portion of the dicing tape 5 outside the semiconductor substrate 7 to cleave the semiconductor substrate 7. Thereafter, as shown in FIG. 8, the outer ring 15 is fitted to the inner ring 14 from above to fix the dicing tape 5 between the rings 14 and 15.

  Then, the outside of the outer ring 15 of the dicing tape 5 is cut off, and the inner ring 14 is removed from the pushing jig 4. As a result, as shown in FIG. 9, a configuration in which the semiconductor chip 7 a is cleaved, that is, a configuration in which the cleaved semiconductor chip and the dicing tape 5 are fixed by the double frame 13 is obtained.

  The configuration of the third embodiment other than that described above is the same as that of the first embodiment. Accordingly, in the third embodiment, substantially the same operational effects as in the first embodiment can be obtained.

  Moreover, in each said Example, although the groove | channels 2a and 4a were formed in the upper end surface part of the flat ring fixing stand 2, and the upper end surface part of the raising jig | tool 4, these groove | channels 2a and 4a must be formed absolutely. However, it may be provided as needed.

  For example, if the dicing tape 5 is configured to use a dicing tape in which many fine holes are formed on the entire surface of the tape or a dicing tape made of a porous material, the grooves 2a and 4a are omitted. May be.

1 is a longitudinal sectional view of an expanding apparatus showing a first embodiment of the present invention. Exploded perspective view of expanding device The figure explaining the cleaving process of a semiconductor substrate The figure which shows the process of adhere | attaching a 2nd flat ring on a dicing tape after cleaving. The figure which shows the cleaved semiconductor chip, the dicing tape, and the 2nd flat ring FIG. 1 equivalent view showing a second embodiment of the present invention. FIG. 3 (d) equivalent diagram showing the third embodiment of the present invention. 4 equivalent diagram Figure equivalent to FIG.

Explanation of symbols

  In the drawings, 1 is an expanding device, 2 is a flat ring fixing base, 2a is a groove, 3 is a flat ring fixing jig, 4 is a lifting jig, 4a is a hole, 5 is a dicing tape, 6 is a flat ring, and 7 is a semiconductor. Substrate, 8 is a second flat ring, 9 is a lifting jig, 10 is a recess, 11 is a peripheral wall portion, 12 is an air vent hole, 13 is a double frame, 14 is an inner ring, and 15 is an outer ring.

Claims (6)

After attaching the semiconductor substrate to the dicing tape, the semiconductor substrate is irradiated with laser to form a modified layer for cleaving, and the dicing tape is expanded to cleave the semiconductor substrate to produce a large number of semiconductor chips. In a semiconductor device manufacturing apparatus,
When expanding the dicing tape, comprising an expand device that expands by setting the semiconductor substrate to face downward with respect to the dicing tape ,
The expanding device is provided so as to be movable up and down, and has a push-up jig that pushes and expands an annular portion outside the semiconductor substrate in the dicing tape,
The lifting jig is composed of a cylindrical member,
An air flow generating device that generates a flow of air that flows downward from the vicinity of the surface of the dicing tape to which the semiconductor substrate is attached;
The air flow generation device includes a plurality of grooves or holes which are upper ends of a lifting jig configured by the cylindrical member and are located above the lower surface of the semiconductor substrate when being pushed up. Semiconductor device manufacturing equipment. After attaching the semiconductor substrate to the dicing tape, the semiconductor substrate is irradiated with laser to form a modified layer for cleaving, and the dicing tape is expanded to cleave the semiconductor substrate to produce a large number of semiconductor chips. In a semiconductor device manufacturing apparatus,
When expanding the dicing tape, comprising an expand device that expands by setting the semiconductor substrate to face downward with respect to the dicing tape,
The expanding device is provided so as to be movable up and down, and has a push-up jig that pushes up and expands an annular portion outside the semiconductor substrate of the dicing tape,
The push-up jig is composed of a cylindrical member, and a recess is formed at the upper end of the jig so as to surround the semiconductor substrate.
An air flow generating device that generates a flow of air that flows downward from the vicinity of the surface of the dicing tape to which the semiconductor substrate is attached;
The air flow generating device is an upper end portion of an annular peripheral wall portion of a concave portion of the cylindrical push-up jig, and a plurality of grooves or holes positioned above the lower surface of the semiconductor substrate when pushed up, apparatus for manufacturing a semi-conductor device you characterized in that it comprises a vent hole provided in the bottom. 3. The semiconductor device manufacturing method according to claim 1, wherein the air flow generating device includes the dicing tape formed of a tape having a large number of fine holes or a tape made of a porous material. apparatus. After attaching the semiconductor substrate to the dicing tape, the semiconductor substrate is irradiated with laser to form a modified layer for cleaving, and the dicing tape is expanded to cleave the semiconductor substrate to produce a large number of semiconductor chips. In a method for manufacturing a semiconductor device,
When expanding the dicing tape, comprising an expand device that expands by setting the semiconductor substrate to face downward with respect to the dicing tape,
The expanding device is provided so as to be movable up and down, and has a push-up jig that pushes and expands an annular portion outside the semiconductor substrate in the dicing tape,
The lifting jig is composed of a cylindrical member,
An air flow generating device that generates a flow of air that flows downward from the vicinity of the surface of the dicing tape to which the semiconductor substrate is attached;
The airflow generation device is an upper end portion of a lifting jig configured by the cylindrical member, and includes a plurality of grooves or holes positioned above the lower surface of the semiconductor substrate when being pushed up,
When expanding the semiconductor substrate with the dicing tape so that the semiconductor substrate faces downward, external air is introduced into the push-up jig through a plurality of grooves or holes of the push-up jig, and the introduced air method of manufacturing but you characterized in that to flow downward from the vicinity of the surface on which the semiconductor substrate is stuck in the dicing tape semiconductors devices. After attaching the semiconductor substrate to the dicing tape, the semiconductor substrate is irradiated with laser to form a modified layer for cleaving, and the dicing tape is expanded to cleave the semiconductor substrate to produce a large number of semiconductor chips. In a method for manufacturing a semiconductor device,
When expanding the dicing tape, comprising an expand device that expands by setting the semiconductor substrate to face downward with respect to the dicing tape,
The expanding device is provided so as to be movable up and down, and has a push-up jig that pushes and expands an annular portion outside the semiconductor substrate in the dicing tape,
The push-up jig is formed of a cylindrical member, and a recess is formed at the upper end of the jig so as to surround the semiconductor substrate.
An air flow generating device that generates a flow of air that flows downward from the vicinity of the surface of the dicing tape to which the semiconductor substrate is attached;
The air flow generation device is provided at an upper end portion of a push-up jig constituted by the cylindrical member, at a plurality of grooves or holes located above the lower surface of the semiconductor substrate at the time of push-up, and a bottom portion of the recess. Air vent holes,
When expanding the semiconductor substrate with the dicing tape so that the semiconductor substrate faces downward, external air is introduced into the push-up jig through a plurality of grooves or holes of the push-up jig, and the introduced air method of manufacturing but you characterized in that to flow downward from the vicinity of the surface on which the semiconductor substrate is stuck in the dicing tape semiconductors devices. 6. The method of manufacturing a semiconductor device according to claim 4 , further comprising the dicing tape made of a tape having a large number of fine holes or a tape made of a porous material .

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