JP4788076B2 - ディスペンサー用注射筒及びペースト状接着剤 - Google Patents

ディスペンサー用注射筒及びペースト状接着剤 Download PDF

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Publication number
JP4788076B2
JP4788076B2 JP2001201799A JP2001201799A JP4788076B2 JP 4788076 B2 JP4788076 B2 JP 4788076B2 JP 2001201799 A JP2001201799 A JP 2001201799A JP 2001201799 A JP2001201799 A JP 2001201799A JP 4788076 B2 JP4788076 B2 JP 4788076B2
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JP
Japan
Prior art keywords
cylinder
nozzle
cap
dispenser
syringe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2001201799A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003010757A5 (enExample
JP2003010757A (ja
Inventor
豊次 戸田
一平 桑山
信雄 市村
慎治 高倉
圭一 遠藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2001201799A priority Critical patent/JP4788076B2/ja
Publication of JP2003010757A publication Critical patent/JP2003010757A/ja
Publication of JP2003010757A5 publication Critical patent/JP2003010757A5/ja
Application granted granted Critical
Publication of JP4788076B2 publication Critical patent/JP4788076B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Die Bonding (AREA)
JP2001201799A 2001-07-03 2001-07-03 ディスペンサー用注射筒及びペースト状接着剤 Expired - Lifetime JP4788076B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001201799A JP4788076B2 (ja) 2001-07-03 2001-07-03 ディスペンサー用注射筒及びペースト状接着剤

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001201799A JP4788076B2 (ja) 2001-07-03 2001-07-03 ディスペンサー用注射筒及びペースト状接着剤

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2002342431A Division JP3570422B2 (ja) 2002-11-26 2002-11-26 ディスペンサー用注射筒及びペースト状接着剤

Publications (3)

Publication Number Publication Date
JP2003010757A JP2003010757A (ja) 2003-01-14
JP2003010757A5 JP2003010757A5 (enExample) 2004-09-30
JP4788076B2 true JP4788076B2 (ja) 2011-10-05

Family

ID=19038700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001201799A Expired - Lifetime JP4788076B2 (ja) 2001-07-03 2001-07-03 ディスペンサー用注射筒及びペースト状接着剤

Country Status (1)

Country Link
JP (1) JP4788076B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110494369A (zh) * 2017-03-27 2019-11-22 武藏工业株式会社 液体材料贮存容器用盖及液体材料贮存容器

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004054127B4 (de) * 2004-11-08 2008-01-03 HPT Hirsch Prüftechnik GmbH Materialprüfungsvorrichtung
JP6961113B1 (ja) * 2021-02-05 2021-11-05 田中貴金属工業株式会社 螺合接続方法及び螺合装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5028991Y1 (enExample) * 1970-07-22 1975-08-26
JPS5753239Y2 (enExample) * 1978-06-19 1982-11-18
JPS6058281U (ja) * 1983-09-26 1985-04-23 日立化成工業株式会社 デイスペンサ−用注射筒
JPS61171565A (ja) * 1985-01-25 1986-08-02 Hitachi Chem Co Ltd デイスペンサ−用注射筒
JPH0741928B2 (ja) * 1993-05-28 1995-05-10 株式会社細川洋行 吐出ガン用カートリッジおよびその製造方法
JP2001113212A (ja) * 1999-10-20 2001-04-24 Noiberuku Kk 液体吐出装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110494369A (zh) * 2017-03-27 2019-11-22 武藏工业株式会社 液体材料贮存容器用盖及液体材料贮存容器
CN110494369B (zh) * 2017-03-27 2021-07-27 武藏工业株式会社 液体材料贮存容器用盖及液体材料贮存容器
TWI785028B (zh) * 2017-03-27 2022-12-01 日商武藏工業股份有限公司 液體材料儲存容器用蓋及液體材料儲存容器

Also Published As

Publication number Publication date
JP2003010757A (ja) 2003-01-14

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