JP4783801B2 - 非振動式接触電位差センサおよび制御された照射を利用した半導体検査システムおよび装置 - Google Patents
非振動式接触電位差センサおよび制御された照射を利用した半導体検査システムおよび装置 Download PDFInfo
- Publication number
- JP4783801B2 JP4783801B2 JP2008057715A JP2008057715A JP4783801B2 JP 4783801 B2 JP4783801 B2 JP 4783801B2 JP 2008057715 A JP2008057715 A JP 2008057715A JP 2008057715 A JP2008057715 A JP 2008057715A JP 4783801 B2 JP4783801 B2 JP 4783801B2
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- Prior art keywords
- wafer
- contamination
- potential difference
- semiconductor
- irradiation energy
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000004065 semiconductor Substances 0.000 title claims description 67
- 238000007689 inspection Methods 0.000 title description 5
- 239000000523 sample Substances 0.000 claims description 88
- 238000011109 contamination Methods 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 37
- 238000005286 illumination Methods 0.000 claims description 35
- 238000005452 bending Methods 0.000 claims description 15
- 230000008859 change Effects 0.000 claims description 14
- 230000008569 process Effects 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 2
- 239000012528 membrane Substances 0.000 claims 2
- 238000005070 sampling Methods 0.000 claims 2
- 239000000356 contaminant Substances 0.000 claims 1
- 230000003595 spectral effect Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 116
- 238000005259 measurement Methods 0.000 description 15
- 230000000694 effects Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000001514 detection method Methods 0.000 description 5
- 238000001228 spectrum Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000012512 characterization method Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004886 process control Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
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- 229910052739 hydrogen Inorganic materials 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/002—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating the work function voltage
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2648—Characterising semiconductor materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/265—Contactless testing
- G01R31/2656—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/715,149 | 2007-03-07 | ||
| US11/715,149 US7659734B2 (en) | 2007-03-07 | 2007-03-07 | Semiconductor inspection system and apparatus utilizing a non-vibrating contact potential difference sensor and controlled illumination |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008304452A JP2008304452A (ja) | 2008-12-18 |
| JP2008304452A5 JP2008304452A5 (enExample) | 2009-03-12 |
| JP4783801B2 true JP4783801B2 (ja) | 2011-09-28 |
Family
ID=39469573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008057715A Expired - Fee Related JP4783801B2 (ja) | 2007-03-07 | 2008-03-07 | 非振動式接触電位差センサおよび制御された照射を利用した半導体検査システムおよび装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7659734B2 (enExample) |
| EP (1) | EP1944614A1 (enExample) |
| JP (1) | JP4783801B2 (enExample) |
| KR (1) | KR100929768B1 (enExample) |
| CN (1) | CN101266222A (enExample) |
| TW (1) | TWI346776B (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7944550B2 (en) * | 2008-02-29 | 2011-05-17 | International Business Machines Corporation | System and method for detecting local mechanical stress in integreated devices |
| CN102292804B (zh) * | 2009-02-03 | 2014-02-12 | Q概念技术公司 | 利用非振动接触势差传感器的图案化晶片检查系统 |
| US8441268B2 (en) * | 2010-04-06 | 2013-05-14 | Lam Corporation | Non-contact detection of surface fluid droplets |
| US9304160B1 (en) | 2012-05-08 | 2016-04-05 | Kla-Tencor Corporation | Defect inspection apparatus, system, and method |
| US20170266744A1 (en) * | 2015-10-30 | 2017-09-21 | Mitsubishi Electric Corporation | Wire electric discharge machine, control method of control device of wire electric discharge machine, and positioning method |
| CN108760885A (zh) * | 2018-06-14 | 2018-11-06 | 德淮半导体有限公司 | 超声波扫描方法和超声波扫描装置 |
| US10859625B2 (en) * | 2018-08-21 | 2020-12-08 | Globalfoundries Singapore Pte. Ltd. | Wafer probe card integrated with a light source facing a device under test side and method of manufacturing |
| US11924972B2 (en) * | 2020-06-02 | 2024-03-05 | Applied Materials, Inc. | Diagnostic disc with a high vacuum and temperature tolerant power source |
| KR20250115168A (ko) | 2024-01-23 | 2025-07-30 | 에스케이하이닉스 주식회사 | 다중 전위차 센서를 이용한 반도체 표면 오염 검사장치 |
| KR20250115173A (ko) | 2024-01-23 | 2025-07-30 | 주식회사 코비스테크놀로지 | 웨이퍼 높이 변화에 따른 전위차 센서 높이 자동 조절 기능을 갖는 반도체 표면 오염 검사장치 |
| KR102873562B1 (ko) * | 2024-09-04 | 2025-10-21 | 주식회사 코비스테크놀로지 | 다중 측정 센서를 포함하는 나선형 스캔 장치 및 이를 이용한 웨이퍼 검사 방법 |
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-
2007
- 2007-03-07 US US11/715,149 patent/US7659734B2/en not_active Expired - Fee Related
-
2008
- 2008-02-28 KR KR1020080018060A patent/KR100929768B1/ko not_active Expired - Fee Related
- 2008-02-29 TW TW097107023A patent/TWI346776B/zh not_active IP Right Cessation
- 2008-03-06 EP EP08250761A patent/EP1944614A1/en not_active Ceased
- 2008-03-07 CN CNA2008100966948A patent/CN101266222A/zh active Pending
- 2008-03-07 JP JP2008057715A patent/JP4783801B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1944614A1 (en) | 2008-07-16 |
| KR20080082457A (ko) | 2008-09-11 |
| TW200846650A (en) | 2008-12-01 |
| TWI346776B (en) | 2011-08-11 |
| US7659734B2 (en) | 2010-02-09 |
| JP2008304452A (ja) | 2008-12-18 |
| KR100929768B1 (ko) | 2009-12-03 |
| CN101266222A (zh) | 2008-09-17 |
| US20080217530A1 (en) | 2008-09-11 |
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