CN101266222A - 半导体检查系统和设备 - Google Patents

半导体检查系统和设备 Download PDF

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Publication number
CN101266222A
CN101266222A CNA2008100966948A CN200810096694A CN101266222A CN 101266222 A CN101266222 A CN 101266222A CN A2008100966948 A CNA2008100966948 A CN A2008100966948A CN 200810096694 A CN200810096694 A CN 200810096694A CN 101266222 A CN101266222 A CN 101266222A
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CN
China
Prior art keywords
wafer
contact potential
semiconductor
sensor
unevenness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2008100966948A
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English (en)
Chinese (zh)
Inventor
J·A·豪索尔尼
M·布兰登·斯蒂勒
杨业元
M·舒尔泽
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Qcept Technologies Inc
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Qcept Technologies Inc
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Application filed by Qcept Technologies Inc filed Critical Qcept Technologies Inc
Publication of CN101266222A publication Critical patent/CN101266222A/zh
Pending legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/002Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating the work function voltage
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2648Characterising semiconductor materials
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/265Contactless testing
    • G01R31/2656Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
CNA2008100966948A 2007-03-07 2008-03-07 半导体检查系统和设备 Pending CN101266222A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/715,149 US7659734B2 (en) 2007-03-07 2007-03-07 Semiconductor inspection system and apparatus utilizing a non-vibrating contact potential difference sensor and controlled illumination
US11/715,149 2007-03-07

Publications (1)

Publication Number Publication Date
CN101266222A true CN101266222A (zh) 2008-09-17

Family

ID=39469573

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2008100966948A Pending CN101266222A (zh) 2007-03-07 2008-03-07 半导体检查系统和设备

Country Status (6)

Country Link
US (1) US7659734B2 (enExample)
EP (1) EP1944614A1 (enExample)
JP (1) JP4783801B2 (enExample)
KR (1) KR100929768B1 (enExample)
CN (1) CN101266222A (enExample)
TW (1) TWI346776B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110888031A (zh) * 2018-08-21 2020-03-17 新加坡商格罗方德半导体私人有限公司 与面向受测装置侧的光源整合的晶片探针卡及制造方法

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110888031A (zh) * 2018-08-21 2020-03-17 新加坡商格罗方德半导体私人有限公司 与面向受测装置侧的光源整合的晶片探针卡及制造方法

Also Published As

Publication number Publication date
KR100929768B1 (ko) 2009-12-03
KR20080082457A (ko) 2008-09-11
JP4783801B2 (ja) 2011-09-28
US7659734B2 (en) 2010-02-09
US20080217530A1 (en) 2008-09-11
TW200846650A (en) 2008-12-01
EP1944614A1 (en) 2008-07-16
JP2008304452A (ja) 2008-12-18
TWI346776B (en) 2011-08-11

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Open date: 20080917