JP4765673B2 - 電子デバイスの製造方法および電子デバイス - Google Patents

電子デバイスの製造方法および電子デバイス Download PDF

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Publication number
JP4765673B2
JP4765673B2 JP2006056341A JP2006056341A JP4765673B2 JP 4765673 B2 JP4765673 B2 JP 4765673B2 JP 2006056341 A JP2006056341 A JP 2006056341A JP 2006056341 A JP2006056341 A JP 2006056341A JP 4765673 B2 JP4765673 B2 JP 4765673B2
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Prior art keywords
base
electronic component
side pad
component
wire
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Expired - Fee Related
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JP2006056341A
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Japanese (ja)
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JP2007234960A5 (enrdf_load_stackoverflow
JP2007234960A (ja
Inventor
和彦 下平
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Miyazaki Epson Corp
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Epson Toyocom Corp
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Priority to JP2006056341A priority Critical patent/JP4765673B2/ja
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Publication of JP2007234960A5 publication Critical patent/JP2007234960A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2224/4805—Shape
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    • H01L2224/4848—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball outside the semiconductor or solid-state body
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/48476—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area
    • H01L2224/48477—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding)
    • H01L2224/48484—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) being a plurality of pre-balls disposed side-to-side
    • H01L2224/48485—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) being a plurality of pre-balls disposed side-to-side the connecting portion being a wedge bond, i.e. wedge on pre-ball
    • H01L2224/48487—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) being a plurality of pre-balls disposed side-to-side the connecting portion being a wedge bond, i.e. wedge on pre-ball outside the semiconductor or solid-state body
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/485—Material
    • H01L2224/48505—Material at the bonding interface
    • H01L2224/48599—Principal constituent of the connecting portion of the wire connector being Gold (Au)
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    • H01L2224/85009—Pre-treatment of the connector or the bonding area
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    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Wire Bonding (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
JP2006056341A 2006-03-02 2006-03-02 電子デバイスの製造方法および電子デバイス Expired - Fee Related JP4765673B2 (ja)

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JP2006056341A JP4765673B2 (ja) 2006-03-02 2006-03-02 電子デバイスの製造方法および電子デバイス

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JP2006056341A JP4765673B2 (ja) 2006-03-02 2006-03-02 電子デバイスの製造方法および電子デバイス

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JP2007234960A JP2007234960A (ja) 2007-09-13
JP2007234960A5 JP2007234960A5 (enrdf_load_stackoverflow) 2009-04-02
JP4765673B2 true JP4765673B2 (ja) 2011-09-07

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JP2010283650A (ja) * 2009-06-05 2010-12-16 Daishinku Corp 圧電発振器
JP7458825B2 (ja) 2020-02-28 2024-04-01 キヤノン株式会社 パッケージおよび半導体装置

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JPH03183139A (ja) * 1989-12-12 1991-08-09 Nippon Steel Corp ワイヤボンディング方法
JP3154640B2 (ja) * 1995-04-21 2001-04-09 三菱電機株式会社 表面弾性波装置のパッケージ
JPH1022772A (ja) * 1996-06-28 1998-01-23 Kyocera Corp 発振部品
JPH10229100A (ja) * 1997-02-17 1998-08-25 Tokai Rika Co Ltd ワイヤボンディング方法及びプラスティックパッケージの製造方法
JP3972518B2 (ja) * 1999-06-14 2007-09-05 株式会社デンソー ボールボンディング方法および電子部品の接続方法
JP3620451B2 (ja) * 2001-02-06 2005-02-16 セイコーエプソン株式会社 圧電デバイスのパッケージ構造
JP3833136B2 (ja) * 2002-04-10 2006-10-11 株式会社カイジョー 半導体構造およびボンディング方法

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