JP4751528B2 - ダイボンディング装置 - Google Patents

ダイボンディング装置 Download PDF

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Publication number
JP4751528B2
JP4751528B2 JP2001145397A JP2001145397A JP4751528B2 JP 4751528 B2 JP4751528 B2 JP 4751528B2 JP 2001145397 A JP2001145397 A JP 2001145397A JP 2001145397 A JP2001145397 A JP 2001145397A JP 4751528 B2 JP4751528 B2 JP 4751528B2
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Japan
Prior art keywords
die
bonding
take
slide table
out position
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Expired - Lifetime
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JP2001145397A
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English (en)
Japanese (ja)
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JP2002343815A5 (https=
JP2002343815A (ja
Inventor
誠 有江
泰雄 岩城
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to JP2001145397A priority Critical patent/JP4751528B2/ja
Publication of JP2002343815A publication Critical patent/JP2002343815A/ja
Publication of JP2002343815A5 publication Critical patent/JP2002343815A5/ja
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Publication of JP4751528B2 publication Critical patent/JP4751528B2/ja
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Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor

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  • Die Bonding (AREA)
JP2001145397A 2001-05-15 2001-05-15 ダイボンディング装置 Expired - Lifetime JP4751528B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001145397A JP4751528B2 (ja) 2001-05-15 2001-05-15 ダイボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001145397A JP4751528B2 (ja) 2001-05-15 2001-05-15 ダイボンディング装置

Publications (3)

Publication Number Publication Date
JP2002343815A JP2002343815A (ja) 2002-11-29
JP2002343815A5 JP2002343815A5 (https=) 2008-07-24
JP4751528B2 true JP4751528B2 (ja) 2011-08-17

Family

ID=18991216

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001145397A Expired - Lifetime JP4751528B2 (ja) 2001-05-15 2001-05-15 ダイボンディング装置

Country Status (1)

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JP (1) JP4751528B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE50304286D1 (de) * 2003-05-21 2006-08-31 Unaxis Int Trading Ltd Halbleiter-Montageeinrichtung
JP2014060234A (ja) * 2012-09-18 2014-04-03 Hitachi High-Tech Instruments Co Ltd ダイボンダ及びボンディング方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2823329B2 (ja) * 1990-07-02 1998-11-11 ローム株式会社 半導体チップの組立装置
JP3149782B2 (ja) * 1996-05-07 2001-03-26 松下電器産業株式会社 ダイボンディング装置およびダイボンディング方法
JPH11346093A (ja) * 1998-06-02 1999-12-14 Matsushita Electric Ind Co Ltd 部品実装機
JP4267749B2 (ja) * 1999-04-13 2009-05-27 パナソニック株式会社 部品実装方法
JP3792996B2 (ja) * 2000-06-08 2006-07-05 株式会社新川 ダイ及び小物部品の移送装置

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Publication number Publication date
JP2002343815A (ja) 2002-11-29

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