JP4733149B2 - 構成要素支持体上への構成要素の装着のための方法 - Google Patents
構成要素支持体上への構成要素の装着のための方法 Download PDFInfo
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- JP4733149B2 JP4733149B2 JP2007549842A JP2007549842A JP4733149B2 JP 4733149 B2 JP4733149 B2 JP 4733149B2 JP 2007549842 A JP2007549842 A JP 2007549842A JP 2007549842 A JP2007549842 A JP 2007549842A JP 4733149 B2 JP4733149 B2 JP 4733149B2
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- 238000000034 method Methods 0.000 title claims description 40
- 238000005259 measurement Methods 0.000 claims description 14
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- 230000009467 reduction Effects 0.000 description 2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Manipulator (AREA)
- Wire Bonding (AREA)
Description
図1は、構成要素支持体上への構成要素の公知技術(Stand der Technik)に基づく装着過程を示す図であり、
図2は、構成要素支持体上への構成要素の本発明の実施例に基づくいわば接触なしの装着過程を示す図であり、
図3は、保持装置の速度特性線図であり、この場合に速度特性線に構成要素の公知技術に基づく装着時点と構成要素の本発明の実施例に基づく放出時点とをプロットしてあり、
図4は、装着すべき構成要素支持体の表面形状の測定状態を示す図である。
Claims (6)
- 構成要素支持体に構成要素を装着するための方法において、
装着すべき構成要素(260)は装着ヘッド(400)の保持装置(210,410)によって、該保持装置(210,410)から前記構成要素(260)へ生ぜしめられる保持力に基づき受容され、
受容された前記構成要素(260)は、前記装着ヘッド(400)によって、構成要素支持体(270,470)に設けられた構成要素組み付け箇所の上の放出位置へ移送され、この場合に前記放出位置は、前記構成要素支持体(270,470)の表面に対して所定の距離を有しており、しかも、前記保持装置(210,410)により受容された前記構成要素(260)の、前記構成要素支持体の表面に対する所定の距離内での停止を、前記装着ヘッド(400)に取り付けられた距離センサー(420)によりトリガし、
次いで保持力は遮断され、これによって前記構成要素(260)は前記保持装置(210,410)から分離されて、前記構成要素支持体(270,470)に転移されることを特徴とする、構成要素支持体上への構成要素の装着のための方法。 - 前記構成要素(260)の分離は、該構成要素(260)が放出位置に達した際に前記保持装置(210,410)の速度の急速な変化によって助成される請求項1に記載の方法。
- 前記保持装置として吸着ピペット(210,410)を用い、該吸着ピペットは保持力を負圧によって生ぜしめ、前記構成要素(260)の分離は負圧の迅速な遮断及び過剰圧力の形成によって助成される請求項1又は2に記載の方法。
- 装着の前に前記構成要素支持体(270,470)の表面形状は前記距離センサーを用いて正確に測定される請求項1から3のいずれか1項に記載の方法。
- 前記構成要素支持体の表面形状は、非連続の表面形状測定値から補間法によって決定される請求項4に記載の方法。
- 前記構成要素(260)の放出位置は、該構成要素(260)が放出位置に達した際に、距離スイッチ(420)として形成された共焦点式の距離センサーによって検出される請求項1から3のいずれか1項に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005000742.2 | 2005-01-04 | ||
DE102005000742A DE102005000742A1 (de) | 2005-01-04 | 2005-01-04 | Verfahren zum Bestücken eines Bauelementeträgers |
PCT/EP2005/056669 WO2006072532A1 (de) | 2005-01-04 | 2005-12-12 | Verfahren zum bestücken eines bauelementeträgers |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008527699A JP2008527699A (ja) | 2008-07-24 |
JP4733149B2 true JP4733149B2 (ja) | 2011-07-27 |
Family
ID=36061738
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007549842A Active JP4733149B2 (ja) | 2005-01-04 | 2005-12-12 | 構成要素支持体上への構成要素の装着のための方法 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1834516B1 (ja) |
JP (1) | JP4733149B2 (ja) |
CN (1) | CN101095387B (ja) |
DE (1) | DE102005000742A1 (ja) |
WO (1) | WO2006072532A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008059490B3 (de) * | 2008-11-28 | 2010-09-02 | Siemens Electronics Assembly Systems Gmbh & Co. Kg | Bestückkopf und Bestückautomat |
TWI804790B (zh) * | 2020-12-25 | 2023-06-11 | 萬潤科技股份有限公司 | 壓合設備及其上模控制方法、上模裝置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01198046A (ja) * | 1988-02-03 | 1989-08-09 | Nec Yamagata Ltd | 半導体チップ搬送装置 |
JPH05326638A (ja) * | 1992-05-15 | 1993-12-10 | Sumitomo Electric Ind Ltd | 半導体チップ実装方法および実装装置 |
JP2001246588A (ja) * | 2000-02-29 | 2001-09-11 | Ando Electric Co Ltd | 電子部品搬送装置及び電子部品搬送方法 |
JP2002076044A (ja) * | 2000-08-29 | 2002-03-15 | Matsushita Electric Ind Co Ltd | 導電性ボールの搭載装置および搭載方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW278212B (ja) * | 1992-05-06 | 1996-06-11 | Sumitomo Electric Industries | |
DE4228012C2 (de) * | 1992-08-24 | 1996-08-22 | Siemens Ag | Verfahren zum Beabstanden zweier Bauteile |
JPH09293995A (ja) * | 1996-02-26 | 1997-11-11 | Matsushita Electric Ind Co Ltd | 部品吸着方法 |
JP3574666B2 (ja) * | 1996-11-19 | 2004-10-06 | 松下電器産業株式会社 | 電子部品実装装置及び方法 |
KR100604706B1 (ko) * | 1998-04-09 | 2006-07-28 | 지멘스 악티엔게젤샤프트 | 컴포넌트 지지체에 컴포넌트를 장착하기 위한 장치 |
JP2002158495A (ja) * | 2000-11-22 | 2002-05-31 | Matsushita Electric Ind Co Ltd | 電子部品実装方法 |
DE10061756A1 (de) * | 2000-12-12 | 2002-07-04 | Siemens Production & Logistics | Verfahren und Vorrichtung zum Entnehmen von Bestückelementen |
DE50104430D1 (de) * | 2001-12-05 | 2004-12-09 | Esec Trading Sa | Einrichtung für die Montage von Halbleiterchips |
US7154258B2 (en) * | 2002-12-25 | 2006-12-26 | Ricoh Company, Ltd. | IC transfer device |
-
2005
- 2005-01-04 DE DE102005000742A patent/DE102005000742A1/de not_active Withdrawn
- 2005-12-12 CN CN2005800458803A patent/CN101095387B/zh active Active
- 2005-12-12 EP EP05825272A patent/EP1834516B1/de active Active
- 2005-12-12 JP JP2007549842A patent/JP4733149B2/ja active Active
- 2005-12-12 WO PCT/EP2005/056669 patent/WO2006072532A1/de active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01198046A (ja) * | 1988-02-03 | 1989-08-09 | Nec Yamagata Ltd | 半導体チップ搬送装置 |
JPH05326638A (ja) * | 1992-05-15 | 1993-12-10 | Sumitomo Electric Ind Ltd | 半導体チップ実装方法および実装装置 |
JP2001246588A (ja) * | 2000-02-29 | 2001-09-11 | Ando Electric Co Ltd | 電子部品搬送装置及び電子部品搬送方法 |
JP2002076044A (ja) * | 2000-08-29 | 2002-03-15 | Matsushita Electric Ind Co Ltd | 導電性ボールの搭載装置および搭載方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2006072532A1 (de) | 2006-07-13 |
DE102005000742A1 (de) | 2006-07-20 |
EP1834516A1 (de) | 2007-09-19 |
CN101095387A (zh) | 2007-12-26 |
CN101095387B (zh) | 2011-07-06 |
JP2008527699A (ja) | 2008-07-24 |
EP1834516B1 (de) | 2013-02-27 |
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