JP4732001B2 - ビルドアップ基板層間絶縁材料用熱硬化性樹脂組成物、樹脂フィルム、フィルム付き製品およびビルドアップ基板の層間絶縁材料 - Google Patents

ビルドアップ基板層間絶縁材料用熱硬化性樹脂組成物、樹脂フィルム、フィルム付き製品およびビルドアップ基板の層間絶縁材料 Download PDF

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JP4732001B2
JP4732001B2 JP2005153585A JP2005153585A JP4732001B2 JP 4732001 B2 JP4732001 B2 JP 4732001B2 JP 2005153585 A JP2005153585 A JP 2005153585A JP 2005153585 A JP2005153585 A JP 2005153585A JP 4732001 B2 JP4732001 B2 JP 4732001B2
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film
weight
resin
parts
solvent
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JP2006328214A (ja
JP2006328214A5 (enExample
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鉄秋 鈴木
直也 柿内
祐介 棚橋
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Tamura Corp
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Tamura Corp
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  • Epoxy Resins (AREA)
JP2005153585A 2005-05-26 2005-05-26 ビルドアップ基板層間絶縁材料用熱硬化性樹脂組成物、樹脂フィルム、フィルム付き製品およびビルドアップ基板の層間絶縁材料 Expired - Lifetime JP4732001B2 (ja)

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JP2005153585A JP4732001B2 (ja) 2005-05-26 2005-05-26 ビルドアップ基板層間絶縁材料用熱硬化性樹脂組成物、樹脂フィルム、フィルム付き製品およびビルドアップ基板の層間絶縁材料

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JP2005153585A JP4732001B2 (ja) 2005-05-26 2005-05-26 ビルドアップ基板層間絶縁材料用熱硬化性樹脂組成物、樹脂フィルム、フィルム付き製品およびビルドアップ基板の層間絶縁材料

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JP2006328214A JP2006328214A (ja) 2006-12-07
JP2006328214A5 JP2006328214A5 (enExample) 2008-03-06
JP4732001B2 true JP4732001B2 (ja) 2011-07-27

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Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200916525A (en) * 2007-06-25 2009-04-16 Mitsui Mining & Amp Smelting Co Ltd Resin composition and copper foil with resin obtained by using the resin composition
JP5398087B2 (ja) * 2011-08-03 2014-01-29 株式会社タムラ製作所 放熱基板用接着剤および放熱基板
US20130152809A1 (en) * 2011-12-15 2013-06-20 Fujifilm Corporation Resin composition for laser engraving, flexographic printing plate precursor and process for producing same, and flexographic printing plate and process for making same
JP6081751B2 (ja) * 2012-09-13 2017-02-15 三菱化学株式会社 高熱伝導性樹脂組成物
CN103819870B (zh) * 2012-11-16 2016-06-15 株式会社田村制作所 热固性树脂组合物、b阶化的树脂膜、金属箔、覆铜板及多层积层基板
JP6328414B2 (ja) * 2013-12-04 2018-05-23 株式会社タムラ製作所 難燃性樹脂組成物、ｂステージ化した樹脂フィルム、樹脂付き金属箔およびカバーレイフィルム
JP6431425B2 (ja) * 2015-03-31 2018-11-28 積水化学工業株式会社 積層構造体の製造方法及び積層構造体
WO2017014079A1 (ja) * 2015-07-23 2017-01-26 三井金属鉱業株式会社 樹脂付銅箔、銅張積層板及びプリント配線板
JP7255081B2 (ja) * 2017-04-24 2023-04-11 味の素株式会社 樹脂組成物
JP7176551B2 (ja) * 2020-07-28 2022-11-22 味の素株式会社 樹脂組成物、接着フィルム、プリプレグ、プリント配線板及び半導体装置
JP2023000498A (ja) 2021-06-18 2023-01-04 合肥漢之和新材料科技有限公司 接着剤、接着シート及びフレキシブル銅張積層板
JP2025154132A (ja) * 2024-03-29 2025-10-10 株式会社タムラ製作所 樹脂フィルム、樹脂付き銅箔、多層配線基板、コイル構造体、および磁気デバイス

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0099338B1 (de) * 1982-07-14 1986-05-14 Ciba-Geigy Ag Mit Thermoplasten modifizierte Epoxyharzsysteme
US4686250A (en) * 1985-12-27 1987-08-11 Amoco Corporation Moisture resistant, wet winding epoxy resin system containing aromatic diamines
JP2003238772A (ja) * 2002-02-22 2003-08-27 Mitsubishi Gas Chem Co Inc 硬化性樹脂組成物及びｂステージ樹脂組成物シート。
JP2003249751A (ja) * 2002-02-22 2003-09-05 Mitsubishi Gas Chem Co Inc アディティブ法多層プリント配線板の製造方法
JP4013118B2 (ja) * 2002-02-27 2007-11-28 荒川化学工業株式会社 エポキシ樹脂組成物、電子材料用樹脂組成物、電子材料用樹脂、コーティング剤およびコーティング剤硬化膜の製造方法
JP2003283141A (ja) * 2002-03-26 2003-10-03 Mitsubishi Gas Chem Co Inc アディティブ用金属箔付きｂステージ樹脂組成物シート。

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