JP2006328214A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2006328214A5 JP2006328214A5 JP2005153585A JP2005153585A JP2006328214A5 JP 2006328214 A5 JP2006328214 A5 JP 2006328214A5 JP 2005153585 A JP2005153585 A JP 2005153585A JP 2005153585 A JP2005153585 A JP 2005153585A JP 2006328214 A5 JP2006328214 A5 JP 2006328214A5
- Authority
- JP
- Japan
- Prior art keywords
- bis
- aminophenoxy
- phenyl
- group
- aromatic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001723 curing Methods 0.000 description 3
- 150000004982 aromatic amines Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- LPVHVQFTYXQKAP-YFKPBYRVSA-N (4r)-3-formyl-2,2-dimethyl-1,3-thiazolidine-4-carboxylic acid Chemical compound CC1(C)SC[C@@H](C(O)=O)N1C=O LPVHVQFTYXQKAP-YFKPBYRVSA-N 0.000 description 1
- NUIURNJTPRWVAP-UHFFFAOYSA-N 3,3'-Dimethylbenzidine Chemical group C1=C(N)C(C)=CC(C=2C=C(C)C(N)=CC=2)=C1 NUIURNJTPRWVAP-UHFFFAOYSA-N 0.000 description 1
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 description 1
- QYIMZXITLDTULQ-UHFFFAOYSA-N 4-(4-amino-2-methylphenyl)-3-methylaniline Chemical group CC1=CC(N)=CC=C1C1=CC=C(N)C=C1C QYIMZXITLDTULQ-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 description 1
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 description 1
- HHLMWQDRYZAENA-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)(C(F)(F)F)C(F)(F)F)C=C1 HHLMWQDRYZAENA-UHFFFAOYSA-N 0.000 description 1
- KMKWGXGSGPYISJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 KMKWGXGSGPYISJ-UHFFFAOYSA-N 0.000 description 1
- HYDATEKARGDBKU-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]phenoxy]aniline Chemical group C1=CC(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 HYDATEKARGDBKU-UHFFFAOYSA-N 0.000 description 1
- UTDAGHZGKXPRQI-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 UTDAGHZGKXPRQI-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005153585A JP4732001B2 (ja) | 2005-05-26 | 2005-05-26 | ビルドアップ基板層間絶縁材料用熱硬化性樹脂組成物、樹脂フィルム、フィルム付き製品およびビルドアップ基板の層間絶縁材料 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005153585A JP4732001B2 (ja) | 2005-05-26 | 2005-05-26 | ビルドアップ基板層間絶縁材料用熱硬化性樹脂組成物、樹脂フィルム、フィルム付き製品およびビルドアップ基板の層間絶縁材料 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006328214A JP2006328214A (ja) | 2006-12-07 |
| JP2006328214A5 true JP2006328214A5 (enExample) | 2008-03-06 |
| JP4732001B2 JP4732001B2 (ja) | 2011-07-27 |
Family
ID=37550246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005153585A Expired - Lifetime JP4732001B2 (ja) | 2005-05-26 | 2005-05-26 | ビルドアップ基板層間絶縁材料用熱硬化性樹脂組成物、樹脂フィルム、フィルム付き製品およびビルドアップ基板の層間絶縁材料 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4732001B2 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101249479B1 (ko) * | 2007-06-25 | 2013-03-29 | 미쓰이 긴조꾸 고교 가부시키가이샤 | 수지 조성물 및 그 수지 조성물을 이용하여 얻어진 수지부착 동박 |
| JP5398087B2 (ja) * | 2011-08-03 | 2014-01-29 | 株式会社タムラ製作所 | 放熱基板用接着剤および放熱基板 |
| US20130152809A1 (en) * | 2011-12-15 | 2013-06-20 | Fujifilm Corporation | Resin composition for laser engraving, flexographic printing plate precursor and process for producing same, and flexographic printing plate and process for making same |
| JP6081751B2 (ja) * | 2012-09-13 | 2017-02-15 | 三菱化学株式会社 | 高熱伝導性樹脂組成物 |
| CN103819870B (zh) * | 2012-11-16 | 2016-06-15 | 株式会社田村制作所 | 热固性树脂组合物、b阶化的树脂膜、金属箔、覆铜板及多层积层基板 |
| JP6328414B2 (ja) * | 2013-12-04 | 2018-05-23 | 株式会社タムラ製作所 | 難燃性樹脂組成物、ｂステージ化した樹脂フィルム、樹脂付き金属箔およびカバーレイフィルム |
| JP6431425B2 (ja) * | 2015-03-31 | 2018-11-28 | 積水化学工業株式会社 | 積層構造体の製造方法及び積層構造体 |
| WO2017014079A1 (ja) * | 2015-07-23 | 2017-01-26 | 三井金属鉱業株式会社 | 樹脂付銅箔、銅張積層板及びプリント配線板 |
| JP7255081B2 (ja) * | 2017-04-24 | 2023-04-11 | 味の素株式会社 | 樹脂組成物 |
| JP7176551B2 (ja) * | 2020-07-28 | 2022-11-22 | 味の素株式会社 | 樹脂組成物、接着フィルム、プリプレグ、プリント配線板及び半導体装置 |
| JP2023000498A (ja) | 2021-06-18 | 2023-01-04 | 合肥漢之和新材料科技有限公司 | 接着剤、接着シート及びフレキシブル銅張積層板 |
| JP2025154132A (ja) * | 2024-03-29 | 2025-10-10 | 株式会社タムラ製作所 | 樹脂フィルム、樹脂付き銅箔、多層配線基板、コイル構造体、および磁気デバイス |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3363507D1 (en) * | 1982-07-14 | 1986-06-19 | Ciba Geigy Ag | Epoxy resin systems modified with thermoplastic resins |
| US4686250A (en) * | 1985-12-27 | 1987-08-11 | Amoco Corporation | Moisture resistant, wet winding epoxy resin system containing aromatic diamines |
| JP2003249751A (ja) * | 2002-02-22 | 2003-09-05 | Mitsubishi Gas Chem Co Inc | アディティブ法多層プリント配線板の製造方法 |
| JP2003238772A (ja) * | 2002-02-22 | 2003-08-27 | Mitsubishi Gas Chem Co Inc | 硬化性樹脂組成物及びｂステージ樹脂組成物シート。 |
| JP4013118B2 (ja) * | 2002-02-27 | 2007-11-28 | 荒川化学工業株式会社 | エポキシ樹脂組成物、電子材料用樹脂組成物、電子材料用樹脂、コーティング剤およびコーティング剤硬化膜の製造方法 |
| JP2003283141A (ja) * | 2002-03-26 | 2003-10-03 | Mitsubishi Gas Chem Co Inc | アディティブ用金属箔付きｂステージ樹脂組成物シート。 |
-
2005
- 2005-05-26 JP JP2005153585A patent/JP4732001B2/ja not_active Expired - Lifetime
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2006328214A5 (enExample) | ||
| JP2013511412A5 (enExample) | ||
| WO2009025283A1 (ja) | 新規なポリイミド樹脂及び感光性ポリイミド樹脂組成物 | |
| WO2003027178A3 (en) | Polyimide copolymer and methods for preparing the same | |
| TW201041853A (en) | Base generator, photosensitive resin composition, pattern-forming material made of the photosensitive resin composition, method of forming pattern using the photosensitive resin composition, and article | |
| TWI546196B (zh) | 多層成型體及其製造方法、以及電磁波遮蔽構件及放熱性構件 | |
| JP2005266766A5 (enExample) | ||
| JP2005533886A5 (enExample) | ||
| WO2008103776A3 (en) | Thermally cured underlayer for lithographic application | |
| WO2007016516A3 (en) | Heteropolymeric polyimide polymer compositions | |
| TW426722B (en) | Adhesive tape for electronic parts | |
| TW200728909A (en) | Positive type photosensitive resin composition | |
| AU2003230823A1 (en) | Polyimides from 2,3,3',4'-biphenyltetracarboxylic dianhydride and aromatic diamines | |
| JP2004035650A5 (enExample) | ||
| KR101109846B1 (ko) | 기판 처리 장치의 클리닝 기판 및 그에 사용하기에 적합한 내열성 수지 | |
| JP2005163019A5 (enExample) | ||
| JP2023067841A5 (enExample) | ||
| JP2011506689A5 (enExample) | ||
| BR0209757A (pt) | Placas bipolares de montagem | |
| JP2004094118A5 (enExample) | ||
| TWI243186B (en) | Polyimide film, manufacturing method of same, and usage of same | |
| CA2634249A1 (en) | Two-stage cure polyimide oligomers | |
| JP2002363253A5 (enExample) | ||
| JP2011153325A (ja) | 除塵用基板に好適な耐熱性樹脂 | |
| JP2011509325A5 (enExample) |