JP2006328214A5 - - Google Patents
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- Publication number
- JP2006328214A5 JP2006328214A5 JP2005153585A JP2005153585A JP2006328214A5 JP 2006328214 A5 JP2006328214 A5 JP 2006328214A5 JP 2005153585 A JP2005153585 A JP 2005153585A JP 2005153585 A JP2005153585 A JP 2005153585A JP 2006328214 A5 JP2006328214 A5 JP 2006328214A5
- Authority
- JP
- Japan
- Prior art keywords
- bis
- aminophenoxy
- phenyl
- group
- aromatic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 150000004982 aromatic amines Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- YPACMOORZSDQDQ-UHFFFAOYSA-N 3-(4-aminobenzoyl)oxypropyl 4-aminobenzoate Chemical compound C1=CC(N)=CC=C1C(=O)OCCCOC(=O)C1=CC=C(N)C=C1 YPACMOORZSDQDQ-UHFFFAOYSA-N 0.000 description 1
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4,4'-Oxydianiline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- QYIMZXITLDTULQ-UHFFFAOYSA-N 4-(4-amino-2-methylphenyl)-3-methylaniline Chemical group CC1=CC(N)=CC=C1C1=CC=C(N)C=C1C QYIMZXITLDTULQ-UHFFFAOYSA-N 0.000 description 1
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 description 1
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 description 1
- HHLMWQDRYZAENA-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)(C(F)(F)F)C(F)(F)F)C=C1 HHLMWQDRYZAENA-UHFFFAOYSA-N 0.000 description 1
- KMKWGXGSGPYISJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 KMKWGXGSGPYISJ-UHFFFAOYSA-N 0.000 description 1
- HYDATEKARGDBKU-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]phenoxy]aniline Chemical group C1=CC(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 HYDATEKARGDBKU-UHFFFAOYSA-N 0.000 description 1
- UTDAGHZGKXPRQI-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 UTDAGHZGKXPRQI-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Di(p-aminophenyl)sulphone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- NUIURNJTPRWVAP-UHFFFAOYSA-N Tolidine Chemical group C1=C(N)C(C)=CC(C=2C=C(C)C(N)=CC=2)=C1 NUIURNJTPRWVAP-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
Description
（(b)芳香族アミン系硬化剤）
(b)芳香族アミン系硬化剤は、芳香族基とアミノ基とを有し、エポキシ樹脂を熱硬化時に硬化促進する作用があれば、特に限定されない。芳香族基としては、フェニル基、ビフェニル基、フルオレニル基などを例示できる。具体的には、4,4’-ジアミノジフェニルスルフォン、4,4’-ビス(4-アミノフェノキシ)ビフェニル、2,2-ビス[4-(4-アミノフェノキシ)フェニル]プロパン、ビス[4-(4-アミノフェノキシ)フェニル]スルフォン、1,3-ビス(4-アミノフェノキシ)ベンゼン、1,4-ビス(4-アミノフェノキシ)ベンゼン、トリメチレンビス(4-アミノベンゾエート)、3,3’-ジメチル-4,4’-ジアミノビフェニル、2,2’-ジメチル-4,4’-ジアミノビフェニル、4,4’-ジアミノジフェニルエーテル、3,4’-ジアミノジフェニルエーテル、ビス[4-(3-アミノフェノキシ)フェニル]スルフォン、9,9’-ビス(4-アミノフェニル)フルオレン、2,2-ビス[4-(4-アミノフェノキシ)フェニル]ヘキサフルオロプロパン等を例示でき、単独、又は2種以上組み合わせて用いることができる。
((B) Aromatic amine curing agent)
The (b) aromatic amine curing agent is not particularly limited as long as it has an aromatic group and an amino group and has an effect of accelerating the curing of the epoxy resin during thermal curing . Examples of the aromatic group include a phenyl group, a biphenyl group, and a fluorenyl group. Specifically, 4,4′-diaminodiphenylsulfone, 4,4′-bis (4-aminophenoxy) biphenyl, 2,2-bis [4- (4-aminophenoxy) phenyl] propane, bis [4- (4-Aminophenoxy) phenyl] sulfone, 1,3-bis (4-aminophenoxy) benzene, 1,4-bis (4-aminophenoxy) benzene, trimethylenebis (4-aminobenzoate), 3,3 ′ -Dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 4,4'-diaminodiphenyl ether, 3,4'-diaminodiphenyl ether, bis [4- (3-amino Examples thereof include phenoxy) phenyl] sulfone, 9,9′-bis (4-aminophenyl) fluorene, 2,2-bis [4- (4-aminophenoxy) phenyl] hexafluoropropane, and the like, alone or in combination of two or more They can be used in combination.
こうした化合物は、特に好ましくは下記一般式（１式）の構造式（繰り返し単位）を有するものである。
Such a compound particularly preferably has a structural formula (repeating unit) of the following general formula ( formula 1 ).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005153585A JP4732001B2 (en) | 2005-05-26 | 2005-05-26 | Thermosetting resin composition for buildup substrate interlayer insulation material, resin film, product with film, and interlayer insulation material for buildup substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005153585A JP4732001B2 (en) | 2005-05-26 | 2005-05-26 | Thermosetting resin composition for buildup substrate interlayer insulation material, resin film, product with film, and interlayer insulation material for buildup substrate |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006328214A JP2006328214A (en) | 2006-12-07 |
| JP2006328214A5 true JP2006328214A5 (en) | 2008-03-06 |
| JP4732001B2 JP4732001B2 (en) | 2011-07-27 |
Family
ID=37550246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005153585A Active JP4732001B2 (en) | 2005-05-26 | 2005-05-26 | Thermosetting resin composition for buildup substrate interlayer insulation material, resin film, product with film, and interlayer insulation material for buildup substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4732001B2 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101249479B1 (en) * | 2007-06-25 | 2013-03-29 | 미쓰이 긴조꾸 고교 가부시키가이샤 | Resin composition and copper foil with resin obtained by using the resin composition |
| JP5398087B2 (en) * | 2011-08-03 | 2014-01-29 | 株式会社タムラ製作所 | Adhesive for heat dissipation substrate and heat dissipation substrate |
| US20130152809A1 (en) * | 2011-12-15 | 2013-06-20 | Fujifilm Corporation | Resin composition for laser engraving, flexographic printing plate precursor and process for producing same, and flexographic printing plate and process for making same |
| JP6081751B2 (en) * | 2012-09-13 | 2017-02-15 | 三菱化学株式会社 | High thermal conductive resin composition |
| CN103819870B (en) * | 2012-11-16 | 2016-06-15 | 株式会社田村制作所 | Resin molding, metal forming, copper-clad plate and the multilayer laminated boards substrate on compositions of thermosetting resin, B rank |
| JP6328414B2 (en) * | 2013-12-04 | 2018-05-23 | 株式会社タムラ製作所 | Flame retardant resin composition, B-staged resin film, metal foil with resin, and coverlay film |
| JP6431425B2 (en) * | 2015-03-31 | 2018-11-28 | 積水化学工業株式会社 | Manufacturing method of laminated structure and laminated structure |
| MY180785A (en) | 2015-07-23 | 2020-12-09 | Mitsui Mining & Smelting Co Ltd | Resin-clad copper foil, copper-clad laminated plate, and printed wiring board |
| JP7176551B2 (en) * | 2020-07-28 | 2022-11-22 | 味の素株式会社 | Resin composition, adhesive film, prepreg, printed wiring board and semiconductor device |
| JP2023000498A (en) | 2021-06-18 | 2023-01-04 | 合肥漢之和新材料科技有限公司 | Adhesive, adhesive sheet, and flexible copper-clad laminate |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3363507D1 (en) * | 1982-07-14 | 1986-06-19 | Ciba Geigy Ag | Epoxy resin systems modified with thermoplastic resins |
| US4593056A (en) * | 1985-06-21 | 1986-06-03 | Union Carbide Corporation | Epoxy/aromatic amine resin systems containing aromatic trihydroxy compounds as cure accelerators |
| US4686250A (en) * | 1985-12-27 | 1987-08-11 | Amoco Corporation | Moisture resistant, wet winding epoxy resin system containing aromatic diamines |
| JP2003238772A (en) * | 2002-02-22 | 2003-08-27 | Mitsubishi Gas Chem Co Inc | Curable resin composition and sheet of b-stage resin composition |
| JP2003249751A (en) * | 2002-02-22 | 2003-09-05 | Mitsubishi Gas Chem Co Inc | Method for producing multilayer printed wiring board using additive method |
| JP4013118B2 (en) * | 2002-02-27 | 2007-11-28 | 荒川化学工業株式会社 | Epoxy resin composition, resin composition for electronic material, resin for electronic material, coating agent, and method for producing coating agent cured film |
| JP2003283141A (en) * | 2002-03-26 | 2003-10-03 | Mitsubishi Gas Chem Co Inc | B-stage resin composition sheet with metal foil for additive |
-
2005
- 2005-05-26 JP JP2005153585A patent/JP4732001B2/en active Active
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