JP2008308572A5 - - Google Patents
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- Publication number
- JP2008308572A5 JP2008308572A5 JP2007157107A JP2007157107A JP2008308572A5 JP 2008308572 A5 JP2008308572 A5 JP 2008308572A5 JP 2007157107 A JP2007157107 A JP 2007157107A JP 2007157107 A JP2007157107 A JP 2007157107A JP 2008308572 A5 JP2008308572 A5 JP 2008308572A5
- Authority
- JP
- Japan
- Prior art keywords
- general formula
- repeating unit
- unit represented
- mass
- curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 229920001721 Polyimide Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
Description
本発明において、（ａ）一般式（１）で表される繰り返し単位を有するポリマーは、一般式（１）で表される繰り返し単位のみからなるものであってもよいし、他の繰り返し構造との共重合体あるいは混合体であってもよい。その際、一般式（１）で表される繰り返し単位をポリイミド全体の１０質量％以上、より好ましくは５０質量％以上含有していることが好ましい。この範囲だと、キュア後の膜収縮率をより高くできる利点がある。
In the present invention, (a) the polymer having the repeating unit represented by the general formula (1) may be composed of only the repeating unit represented by the general formula (1), A copolymer or a mixture thereof may be used. In that case, it is preferable to contain 10 mass% or more of the whole polyimide, More preferably, 50 mass% or more of the repeating unit represented by General formula ( 1 ). Within this range, there is an advantage that the film shrinkage after curing can be further increased.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007157107A JP5115045B2 (en) | 2007-06-14 | 2007-06-14 | Polyimide varnish |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007157107A JP5115045B2 (en) | 2007-06-14 | 2007-06-14 | Polyimide varnish |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008308572A JP2008308572A (en) | 2008-12-25 |
| JP2008308572A5 true JP2008308572A5 (en) | 2010-07-29 |
| JP5115045B2 JP5115045B2 (en) | 2013-01-09 |
Family
ID=40236465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007157107A Expired - Fee Related JP5115045B2 (en) | 2007-06-14 | 2007-06-14 | Polyimide varnish |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5115045B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102276783B1 (en) * | 2013-06-26 | 2021-07-14 | 닛산 가가쿠 가부시키가이샤 | Resist underlayer film forming composition containing substituted crosslinkable compound |
| KR20170140186A (en) | 2015-04-24 | 2017-12-20 | 도레이 카부시키가이샤 | Resin composition, method of manufacturing semiconductor device using same, and semiconductor device |
| JP7097803B2 (en) * | 2018-12-20 | 2022-07-08 | 信越ポリマー株式会社 | Conductive polymer-containing liquid and its manufacturing method, and conductive film and its manufacturing method |
| CN115826360B (en) * | 2022-12-23 | 2023-09-12 | 江苏艾森半导体材料股份有限公司 | Photosensitive polyimide composition, method for producing pattern, cured product, and electronic component |
| CN115947648A (en) * | 2022-12-28 | 2023-04-11 | 北京彤程创展科技有限公司 | Crosslinking agent, preparation method thereof and photoresist |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003252991A (en) * | 2002-02-28 | 2003-09-10 | Dow Corning Toray Silicone Co Ltd | Acrylic or methacrylic functional silicone-modified polyimide resin, its manufacturing method and photosensitive resin composition |
| JP4374840B2 (en) * | 2002-08-30 | 2009-12-02 | 東レ株式会社 | Positive photosensitive resin composition, semiconductor element manufacturing method, and semiconductor device |
| JP4834949B2 (en) * | 2003-07-24 | 2011-12-14 | 東レ株式会社 | Thermosetting resin composition and electronic component using the same |
| JP4677887B2 (en) * | 2004-11-24 | 2011-04-27 | 東レ株式会社 | Photosensitive resin composition |
| JP4826415B2 (en) * | 2005-10-12 | 2011-11-30 | 東レ株式会社 | Photosensitive resin composition |
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2007
- 2007-06-14 JP JP2007157107A patent/JP5115045B2/en not_active Expired - Fee Related