JP4731107B2 - フレキシブル金属箔積層体 - Google Patents
フレキシブル金属箔積層体 Download PDFInfo
- Publication number
- JP4731107B2 JP4731107B2 JP2003357738A JP2003357738A JP4731107B2 JP 4731107 B2 JP4731107 B2 JP 4731107B2 JP 2003357738 A JP2003357738 A JP 2003357738A JP 2003357738 A JP2003357738 A JP 2003357738A JP 4731107 B2 JP4731107 B2 JP 4731107B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- glass transition
- heat treatment
- metal foil
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011888 foil Substances 0.000 title claims description 38
- 229910052751 metal Inorganic materials 0.000 title claims description 36
- 239000002184 metal Substances 0.000 title claims description 36
- 238000010438 heat treatment Methods 0.000 claims description 64
- 239000011347 resin Substances 0.000 claims description 55
- 229920005989 resin Polymers 0.000 claims description 55
- 230000009477 glass transition Effects 0.000 claims description 50
- 239000009719 polyimide resin Substances 0.000 claims description 38
- 229920001721 polyimide Polymers 0.000 claims description 37
- 239000011261 inert gas Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 5
- 238000004455 differential thermal analysis Methods 0.000 claims description 3
- 230000007704 transition Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 description 26
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 19
- 230000000694 effects Effects 0.000 description 16
- 238000005259 measurement Methods 0.000 description 11
- 230000006641 stabilisation Effects 0.000 description 11
- 238000011105 stabilization Methods 0.000 description 11
- 239000011889 copper foil Substances 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 238000012545 processing Methods 0.000 description 9
- 230000008859 change Effects 0.000 description 8
- 230000032683 aging Effects 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 229920005575 poly(amic acid) Polymers 0.000 description 7
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
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- XAFOTXWPFVZQAZ-UHFFFAOYSA-N 2-(4-aminophenyl)-3h-benzimidazol-5-amine Chemical compound C1=CC(N)=CC=C1C1=NC2=CC=C(N)C=C2N1 XAFOTXWPFVZQAZ-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
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- -1 (3,4-dicarboxy) Phenyl Chemical group 0.000 description 3
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- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 3
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- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 3
- 238000005979 thermal decomposition reaction Methods 0.000 description 3
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 2
- BWZVCCNYKMEVEX-UHFFFAOYSA-N 2,4,6-Trimethylpyridine Chemical compound CC1=CC(C)=NC(C)=C1 BWZVCCNYKMEVEX-UHFFFAOYSA-N 0.000 description 2
- JYYNAJVZFGKDEQ-UHFFFAOYSA-N 2,4-Dimethylpyridine Chemical compound CC1=CC=NC(C)=C1 JYYNAJVZFGKDEQ-UHFFFAOYSA-N 0.000 description 2
- BSKHPKMHTQYZBB-UHFFFAOYSA-N 2-methylpyridine Chemical compound CC1=CC=CC=N1 BSKHPKMHTQYZBB-UHFFFAOYSA-N 0.000 description 2
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- VQFBXSRZSUJGOF-UHFFFAOYSA-N 4-(1h-benzimidazol-2-yl)aniline Chemical compound C1=CC(N)=CC=C1C1=NC2=CC=CC=C2N1 VQFBXSRZSUJGOF-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- FKNQCJSGGFJEIZ-UHFFFAOYSA-N 4-methylpyridine Chemical compound CC1=CC=NC=C1 FKNQCJSGGFJEIZ-UHFFFAOYSA-N 0.000 description 2
- MBRGOFWKNLPACT-UHFFFAOYSA-N 5-methylnonane-1,9-diamine Chemical compound NCCCCC(C)CCCCN MBRGOFWKNLPACT-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 2
- ATHHXGZTWNVVOU-UHFFFAOYSA-N N-methylformamide Chemical compound CNC=O ATHHXGZTWNVVOU-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000004984 aromatic diamines Chemical class 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
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- HHVIBTZHLRERCL-UHFFFAOYSA-N sulfonyldimethane Chemical compound CS(C)(=O)=O HHVIBTZHLRERCL-UHFFFAOYSA-N 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- 229920006259 thermoplastic polyimide Polymers 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- AVQQQNCBBIEMEU-UHFFFAOYSA-N 1,1,3,3-tetramethylurea Chemical compound CN(C)C(=O)N(C)C AVQQQNCBBIEMEU-UHFFFAOYSA-N 0.000 description 1
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
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- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 1
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- 150000008065 acid anhydrides Chemical class 0.000 description 1
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Images
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- Laminated Bodies (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
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JP2003357738A JP4731107B2 (ja) | 2003-10-17 | 2003-10-17 | フレキシブル金属箔積層体 |
TW093127755A TW200514685A (en) | 2003-10-17 | 2004-09-14 | Flexible metal foil laminate |
CN 200410085678 CN1608835B (zh) | 2003-10-17 | 2004-10-15 | 柔性金属箔层合体 |
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JP2003357738A JP4731107B2 (ja) | 2003-10-17 | 2003-10-17 | フレキシブル金属箔積層体 |
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JP2005119178A JP2005119178A (ja) | 2005-05-12 |
JP4731107B2 true JP4731107B2 (ja) | 2011-07-20 |
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JP2003357738A Expired - Fee Related JP4731107B2 (ja) | 2003-10-17 | 2003-10-17 | フレキシブル金属箔積層体 |
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JP (1) | JP4731107B2 (enrdf_load_stackoverflow) |
CN (1) | CN1608835B (enrdf_load_stackoverflow) |
TW (1) | TW200514685A (enrdf_load_stackoverflow) |
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US10751977B2 (en) | 2016-06-03 | 2020-08-25 | Arisawa Mfg. Co., Ltd. | Method for manufacturing flexible metal-clad laminated plate |
CN115353845B (zh) * | 2022-08-26 | 2024-02-02 | 江西省航宇电子材料有限公司 | 一种不锈钢基覆铜板丝印绝缘胶及丝印方法 |
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JP3805546B2 (ja) * | 1998-11-09 | 2006-08-02 | 株式会社カネカ | 耐熱性ボンディングシートの製造方法 |
JP4507137B2 (ja) * | 1999-12-17 | 2010-07-21 | 東洋紡績株式会社 | フレキシブルプリント配線板及びその製造方法 |
JP3494098B2 (ja) * | 1999-12-20 | 2004-02-03 | ソニーケミカル株式会社 | フレキシブルプリント基板 |
TW584596B (en) * | 2001-12-10 | 2004-04-21 | Mitsui Chemicals Inc | Method for manufacturing a polyimide and metal compound sheet |
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- 2004-09-14 TW TW093127755A patent/TW200514685A/zh not_active IP Right Cessation
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Publication number | Publication date |
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JP2005119178A (ja) | 2005-05-12 |
TWI343869B (enrdf_load_stackoverflow) | 2011-06-21 |
TW200514685A (en) | 2005-05-01 |
CN1608835A (zh) | 2005-04-27 |
CN1608835B (zh) | 2010-04-28 |
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