JP4719367B2 - Laser diode submount structure and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a structure of a laser diode submount in which an LD (laser diode) element is fixed on a surface of a substrate and a manufacturing method thereof.
[0002]
[Prior art]
As a conventional method for manufacturing a laser diode submount, a solder film is previously formed by vapor deposition or the like on a bonding surface of an LD element or a metallized surface of a substrate to which the LD element is bonded, and then the bonding surface of the LD element and the substrate are metallized. The LD element and the substrate were joined by pressing the surfaces against each other and heating.
[0003]
The manufacturing process of the first conventional example will be described with reference to FIGS. As shown in FIG. 7, a solder thin film 105 is formed on the surface of the metallized surface 103 of the substrate 102 on which the metallized surface 103 is formed by vapor deposition or the like, and then the LD element 107 is placed as shown by an arrow a. Therefore, the LD element 107 is placed on the surface of the metallized surface 103 on which the solder thin film 105 is formed. Subsequently, the solder thin film 105 is heated and melted by a heater or the like, and the LD element 107 is fixed to the substrate 102 as shown in FIG. In some cases, a solder thin film 105 is formed on the lower surface of the LD element by vapor deposition or the like, and the LD element 107 is placed on the surface of the metallized surface 103.
[0004]
The manufacturing process of the second conventional example will be described with reference to FIGS. As shown in FIG. 9, the flux 204 is placed on the surface of the metallized surface 203 of the substrate 202 having the metallized surface 203 formed on the surface, as shown by the arrow b, and the solder piece 205 is placed on the surface as shown by the arrow c. The flux 204 is placed on the solder piece 205 as shown by the arrow d. Next, the LD element 207 is placed on the surface of the metallized surface 203 on which the flux 204, the solder piece 205, and the flux 204 are placed as shown by an arrow e. Subsequently, the solder thin film 205 is heated and melted by a heater or the like, and the LD element 207 is fixed to the substrate 202 as shown in FIG.
[0005]
[Problems to be solved by the invention]
The manufacturing method of the first conventional example of the conventional laser diode submount is as described above, after a solder film is formed in advance on the bonding surface of the LD element or the metallized surface of the substrate to which the LD element is bonded by vapor deposition or the like. Since the LD element and the substrate are bonded together by pressing and heating the bonding surface of the LD element and the metallized surface of the substrate, it is necessary to mount each LD element individually. Therefore, there is a drawback that a dedicated device is required and the number of steps is large and the cost is high.
[0006]
In addition, as described above, the manufacturing method of the second conventional example has a large number of fluxes, solder pieces, fluxes, and LD elements on the bonding surface of the LD element or the metallized surface of the substrate to which the LD element is bonded with a general-purpose bonder. Since the LD element and the substrate were joined by supplying and heating them individually, there was a drawback that the flux adhered to the LD element. When flux adheres to the light emitting portion of the LD element, light emission is hindered, resulting in a defect in light emission characteristics.
[0007]
It is an object of the present invention to obtain a laser diode submount that is inexpensive and does not cause poor light emission characteristics.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, a substrate for laser diode submount according to the present invention or a method for manufacturing the same includes a substrate made of an insulating material having a metallized surface on an upper surface and a solder layer made of a solder piece on the upper surface of the metallized surface. A substrate used for a laser diode submount composed of an LD element fixed in a sticking manner, wherein an adhesive material is pasted on the substrate in the vicinity of the metallized surface, and one end is over the top surface of the adhesive material. The solder piece is placed on the upper surface of the metallized surface and adhered by the adhesive material.
Further, in the method of manufacturing the laser diode submount of the present invention , the adhesive material is attached to the substrate in the vicinity of the metallized surface of the substrate having the metallized surface, and one end of the solder piece covers the upper surface of the adhesive material. The solder piece is placed on the upper surface of the metallized surface and adhered by the adhesive material, a jig for positioning the LD element is installed on the metallized surface, and the LD element is guided by the jig to The LD element is fixed to the metallized surface of the substrate by placing on the metallized surface and heating.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below based on examples with reference to the drawings.
FIG. 1 is a perspective view showing an embodiment according to the present invention as viewed obliquely from above. FIG. 2 is a cross-sectional view showing a state of a cross section taken along line AA in FIG. FIG. 3 is a cross-sectional view showing a state of a first step for constituting the laser diode submount shown in FIG. FIG. 4 is a cross-sectional view showing a state of the second step following FIG. FIG. 5 is a cross-sectional view showing the state of the third step following FIG. FIG. 6 is a cross-sectional view showing the state of the fourth step following FIG.
[0010]
1 and 2, the configuration of the laser diode submount 1 according to the present invention will be described. A metallized surface 3 is formed on the upper surface of the substrate 2 formed of an insulating material, and an LD element 7 is fixed to the upper surface of the metallized surface 3 via a solder layer 5a.
[0011]
A manufacturing process of the laser diode submount 1 of the present invention will be described with reference to FIGS. As shown in FIG. 3, the adhesive 2 is pasted on the substrate 2 in the vicinity of the metallized surface 3 of the substrate 2 formed of an insulating material and having the metallized surface 3 formed on the upper surface, and one end of the adhesive 4 is A solder piece 5 is placed on the upper surface of the metallized surface 3 so as to cover the upper surface and is adhered by the adhesive material 4.
[0012]
Next, as shown in FIG. 4, a jig 6 for positioning the LD element 7 is installed on the metallized surface 3.
[0013]
Next, as shown in FIG. 5, the LD element 7 is guided by the jig 6 and placed on the metallized surface 3.
[0014]
Next, as shown in FIG. 6, when heated by a heater or the like, the solder piece 5 is melted and then solidified to become a solder layer 5 a, and the LD element 7 is fixed to the upper surface of the metallized surface 3. At this time, the melted solder piece 5 is repelled by the adhesive material 4 and is attracted by the surface tension between the metallized surface 3 and the LD element 7, so that the melted solder piece 5 does not adhere to the adhesive material 4. The metallized surface 3 and the LD element 7 can be completely joined.
Next, after the solder layer 5a is cooled, the jig 6 and the adhesive material 4 are removed to complete the laser diode submount 1 shown in FIG.
[0015]
【The invention's effect】
As described above, according to the present invention, the adhesive material 4 is attached to the substrate 2 in the vicinity of the metallized surface 3 of the substrate 2 formed of an insulating material and having the metallized surface 3 formed on the upper surface. A jig 6 for positioning the LD element 7 is placed on the metallized surface 3 by placing the solder piece 5 on the upper surface of the metallized surface 3 so as to be placed on the upper surface of the adhesive material 4. When the LD element 7 is guided by the jig 6 and placed on the metallized surface 3 and heated by a heater or the like, the solder piece 5 is melted and then solidified to become a solder layer 5a, and the LD element 7 is placed on the upper surface of the metallized surface 3. Secure. At this time, the melted solder piece 5 is repelled by the adhesive material 4 and is attracted by the surface tension between the metallized surface 3 and the LD element 7, so that the melted solder piece 5 does not adhere to the adhesive material 4. The metallized surface 3 and the LD element 7 can be completely joined.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an embodiment according to the present invention as viewed obliquely from above.
FIG. 2 is a cross-sectional view showing a state of a cross section taken along line AA in FIG.
3 is a cross-sectional view showing the state of a first step for forming the laser diode submount shown in FIG. 2;
4 is a cross-sectional view showing a state of the second step following FIG. 3. FIG.
FIG. 5 is a cross-sectional view showing a state of the third step following FIG. 4;
6 is a cross-sectional view showing a state of the fourth step following FIG. 5. FIG.
FIG. 7 is an explanatory diagram for describing a first manufacturing process of the first conventional example.
FIG. 8 is an explanatory diagram for explaining a second manufacturing process of the first conventional example.
FIG. 9 is an explanatory diagram for describing a first manufacturing process of a second conventional example.
FIG. 10 is an explanatory diagram for describing a second manufacturing process of the second conventional example.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Laser diode submount 2 Substrate 3 Metallized surface 4 Adhesive material 5 Solder piece 5a Solder layer 6 Jig 7 LD element

Claims (3)

A substrate used for a laser diode submount comprising a substrate made of an insulating material having a metallized surface on an upper surface and an LD element fixed to the upper surface of the metallized surface through a solder layer made of a solder piece, the metallized surface paste the adhesive material on the substrate in the vicinity of, and characterized by having said solder piece is adhered by the adhesive material placed on a top surface of the metallized surface as one end according to the upper surface of the adhesive material Substrate for laser diode submount. A method of manufacturing a substrate for use in a laser diode submount comprising a substrate made of an insulating material having a metallized surface on an upper surface and an LD element fixed to the upper surface of the metallized surface through a solder layer made of a solder piece, paste the adhesive material on the substrate in the vicinity of the metallized surface, that one end was adhered by the adhesive material placed on a top surface of the solder piece rests on the upper surface of the adhesive material said metallized surface A method for producing a substrate for a laser diode submount, which is characterized.   Adhesive material is affixed on the substrate in the vicinity of the metallized surface of the substrate having the metallized surface, and the solder piece is placed on the upper surface of the adhesive material so that one end of the solder piece covers the upper surface of the adhesive material. A jig for positioning the LD element on the metallized surface is set by adhesion with a material, the LD element is guided by the jig, placed on the metallized surface, and heated to heat the LD element. Is fixed to the metallized surface of the substrate. A method for manufacturing a laser diode submount.

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