JP4718405B2 - 照明装置 - Google Patents

照明装置 Download PDF

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Publication number
JP4718405B2
JP4718405B2 JP2006253528A JP2006253528A JP4718405B2 JP 4718405 B2 JP4718405 B2 JP 4718405B2 JP 2006253528 A JP2006253528 A JP 2006253528A JP 2006253528 A JP2006253528 A JP 2006253528A JP 4718405 B2 JP4718405 B2 JP 4718405B2
Authority
JP
Japan
Prior art keywords
light
reflector
light source
incident
lighting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006253528A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008077888A (ja
JP2008077888A5 (enExample
Inventor
正高 宮田
雅之 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP2006253528A priority Critical patent/JP4718405B2/ja
Publication of JP2008077888A publication Critical patent/JP2008077888A/ja
Publication of JP2008077888A5 publication Critical patent/JP2008077888A5/ja
Application granted granted Critical
Publication of JP4718405B2 publication Critical patent/JP4718405B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Light Guides In General And Applications Therefor (AREA)
  • Light Sources And Details Of Projection-Printing Devices (AREA)
  • Planar Illumination Modules (AREA)
  • Facsimile Heads (AREA)
  • Facsimile Scanning Arrangements (AREA)
  • Led Device Packages (AREA)
JP2006253528A 2006-09-19 2006-09-19 照明装置 Expired - Fee Related JP4718405B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006253528A JP4718405B2 (ja) 2006-09-19 2006-09-19 照明装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006253528A JP4718405B2 (ja) 2006-09-19 2006-09-19 照明装置

Publications (3)

Publication Number Publication Date
JP2008077888A JP2008077888A (ja) 2008-04-03
JP2008077888A5 JP2008077888A5 (enExample) 2008-11-27
JP4718405B2 true JP4718405B2 (ja) 2011-07-06

Family

ID=39349746

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006253528A Expired - Fee Related JP4718405B2 (ja) 2006-09-19 2006-09-19 照明装置

Country Status (1)

Country Link
JP (1) JP4718405B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7994529B2 (en) * 2008-11-05 2011-08-09 Koninklijke Philips Electronics N.V. LED with molded bi-directional optics
JP2011171208A (ja) * 2010-02-22 2011-09-01 Stanley Electric Co Ltd サイドエッジ型面状発光装置
JP2011188080A (ja) * 2010-03-05 2011-09-22 Nisca Corp 光源ユニット及びこれを用いた画像読取装置
JP5049375B2 (ja) * 2010-09-29 2012-10-17 シャープ株式会社 擬似太陽光照射装置
JP5408152B2 (ja) * 2011-02-21 2014-02-05 パナソニック株式会社 平面表示装置
TWI477855B (zh) * 2012-01-20 2015-03-21 Au Optronics Corp 背光模組
CN102889526B (zh) * 2012-10-19 2015-04-01 威海华菱光电股份有限公司 图像读取装置用led棒状光源制造方法
JP6163667B2 (ja) 2015-01-06 2017-07-19 コニカミノルタ株式会社 照明装置及び画像読取装置
JP6299636B2 (ja) * 2015-03-18 2018-03-28 京セラドキュメントソリューションズ株式会社 照明装置、及び画像読取装置
JP6283013B2 (ja) * 2015-11-24 2018-02-21 カルソニックカンセイ株式会社 照明構造

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH097414A (ja) * 1995-06-16 1997-01-10 Sanyo Electric Co Ltd 線状光源
JPH11134918A (ja) * 1997-03-04 1999-05-21 Matsushita Electric Ind Co Ltd 線状照明装置
JPH11160545A (ja) * 1997-11-27 1999-06-18 Hitachi Chem Co Ltd バックライト装置
JP3798195B2 (ja) * 1999-08-12 2006-07-19 ローム株式会社 チップ型発光装置
JP2001343531A (ja) * 2000-05-30 2001-12-14 Canon Inc 照明装置、この照明装置を有するイメージセンサーおよびこのイメージセンサーを用いた画像読取装置ならびに情報処理システム
JP2002299699A (ja) * 2001-03-30 2002-10-11 Sumitomo Electric Ind Ltd 発光装置およびその製造方法
JP2002314143A (ja) * 2001-04-09 2002-10-25 Toshiba Corp 発光装置
JP2002365439A (ja) * 2001-06-08 2002-12-18 Toyota Industries Corp 導光体及び液晶表示装置
JP2003115615A (ja) * 2001-10-04 2003-04-18 Matsushita Electric Ind Co Ltd 発光ダイオード装置
JP2003234008A (ja) * 2002-02-06 2003-08-22 Nichia Chem Ind Ltd 面発光装置
US20060113544A1 (en) * 2002-12-13 2006-06-01 Koji Otsuka Semiconductor light-emitting device, method for manufacturing same, and linear light source
JP3910171B2 (ja) * 2003-02-18 2007-04-25 シャープ株式会社 半導体発光装置、その製造方法および電子撮像装置
JP4504662B2 (ja) * 2003-04-09 2010-07-14 シチズン電子株式会社 Ｌｅｄランプ
JP2005183531A (ja) * 2003-12-17 2005-07-07 Sharp Corp 半導体発光装置
JP2005243973A (ja) * 2004-02-26 2005-09-08 Kyocera Corp 発光装置および照明装置
JP2005285702A (ja) * 2004-03-31 2005-10-13 Citizen Watch Co Ltd 導光部材及びそれを用いた照明装置
JP2006222037A (ja) * 2005-02-14 2006-08-24 Ichikoh Ind Ltd 車両用部品

Also Published As

Publication number Publication date
JP2008077888A (ja) 2008-04-03

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