JP4709850B2 - 電気的接続デバイス及びこれの製造方法 - Google Patents

電気的接続デバイス及びこれの製造方法 Download PDF

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Publication number
JP4709850B2
JP4709850B2 JP2007546648A JP2007546648A JP4709850B2 JP 4709850 B2 JP4709850 B2 JP 4709850B2 JP 2007546648 A JP2007546648 A JP 2007546648A JP 2007546648 A JP2007546648 A JP 2007546648A JP 4709850 B2 JP4709850 B2 JP 4709850B2
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JP
Japan
Prior art keywords
bump
elastomer
elastomeric
opening
electrical connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007546648A
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English (en)
Japanese (ja)
Other versions
JP2008524799A5 (https=
JP2008524799A (ja
Inventor
ホーハム、ガレス、ジェフリー
アフザリ、アリ
コーデス、スティーブン、アレン
コートイス、ポール、ダブリュー
ファリネリ、マシュー、ジェイ
ゴーマ、シェリフ、エー
ランゼッタ、アルフォンソ、ピー
モリス、ダニエル、ピーター
ロスナー、ジョアンナ
ヨハンナン、ニシャ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JP2008524799A publication Critical patent/JP2008524799A/ja
Publication of JP2008524799A5 publication Critical patent/JP2008524799A5/ja
Application granted granted Critical
Publication of JP4709850B2 publication Critical patent/JP4709850B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Micromachines (AREA)
  • Multi-Conductor Connections (AREA)
JP2007546648A 2004-12-16 2005-09-30 電気的接続デバイス及びこれの製造方法 Expired - Fee Related JP4709850B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US63666604P 2004-12-16 2004-12-16
US60/636,666 2004-12-16
PCT/US2005/035324 WO2007001391A2 (en) 2004-12-16 2005-09-30 Metalized elastomeric electrical contacts

Publications (3)

Publication Number Publication Date
JP2008524799A JP2008524799A (ja) 2008-07-10
JP2008524799A5 JP2008524799A5 (https=) 2008-08-21
JP4709850B2 true JP4709850B2 (ja) 2011-06-29

Family

ID=37570885

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2007546648A Expired - Fee Related JP4709850B2 (ja) 2004-12-16 2005-09-30 電気的接続デバイス及びこれの製造方法
JP2007546647A Expired - Fee Related JP5220417B2 (ja) 2004-12-16 2005-09-30 メタライズ・エラストマ・プローブ構造体

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2007546647A Expired - Fee Related JP5220417B2 (ja) 2004-12-16 2005-09-30 メタライズ・エラストマ・プローブ構造体

Country Status (6)

Country Link
US (2) US8054095B2 (https=)
EP (1) EP1834379B1 (https=)
JP (2) JP4709850B2 (https=)
KR (2) KR100968183B1 (https=)
CN (2) CN101218515B (https=)
WO (2) WO2007001391A2 (https=)

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US7585173B2 (en) * 2007-03-30 2009-09-08 Tyco Electronics Corporation Elastomeric electrical contact
US8832936B2 (en) * 2007-04-30 2014-09-16 International Business Machines Corporation Method of forming metallized elastomeric electrical contacts
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US8959764B2 (en) 2009-11-06 2015-02-24 International Business Machines Corporation Metallurgical clamshell methods for micro land grid array fabrication
US8263879B2 (en) * 2009-11-06 2012-09-11 International Business Machines Corporation Axiocentric scrubbing land grid array contacts and methods for fabrication
US8926379B2 (en) * 2010-12-03 2015-01-06 Ardent Concepts, Inc. Compliant electrical contact
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US8641428B2 (en) * 2011-12-02 2014-02-04 Neoconix, Inc. Electrical connector and method of making it
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JP7308660B2 (ja) 2019-05-27 2023-07-14 東京エレクトロン株式会社 中間接続部材及び検査装置
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US11561243B2 (en) * 2019-09-12 2023-01-24 International Business Machines Corporation Compliant organic substrate assembly for rigid probes
US11509080B2 (en) * 2020-07-22 2022-11-22 Te Connectivity Solutions Gmbh Electrical connector assembly having hybrid conductive polymer contacts
JP7541289B2 (ja) * 2020-10-29 2024-08-28 積水ポリマテック株式会社 導電部材

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Also Published As

Publication number Publication date
WO2007001391A2 (en) 2007-01-04
EP1834379A2 (en) 2007-09-19
WO2007001391A3 (en) 2007-12-13
US20070298626A1 (en) 2007-12-27
CN101288205A (zh) 2008-10-15
US20080094085A1 (en) 2008-04-24
US7452212B2 (en) 2008-11-18
EP1834379A4 (en) 2010-02-24
WO2006137896A3 (en) 2008-01-24
CN101218515B (zh) 2011-08-24
CN101288205B (zh) 2011-09-21
US8054095B2 (en) 2011-11-08
CN101218515A (zh) 2008-07-09
KR100968183B1 (ko) 2010-07-05
KR100968184B1 (ko) 2010-07-05
KR20070090927A (ko) 2007-09-06
KR20070112107A (ko) 2007-11-22
WO2006137896A2 (en) 2006-12-28
JP2008524583A (ja) 2008-07-10
JP2008524799A (ja) 2008-07-10
EP1834379B1 (en) 2012-07-11
JP5220417B2 (ja) 2013-06-26

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