KR100968183B1 - 금속화 엘라스토머 프로브 구조 - Google Patents

금속화 엘라스토머 프로브 구조 Download PDF

Info

Publication number
KR100968183B1
KR100968183B1 KR1020077013681A KR20077013681A KR100968183B1 KR 100968183 B1 KR100968183 B1 KR 100968183B1 KR 1020077013681 A KR1020077013681 A KR 1020077013681A KR 20077013681 A KR20077013681 A KR 20077013681A KR 100968183 B1 KR100968183 B1 KR 100968183B1
Authority
KR
South Korea
Prior art keywords
carrier
electrically conductive
conductive layer
contact
contact structures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020077013681A
Other languages
English (en)
Korean (ko)
Other versions
KR20070090927A (ko
Inventor
게레쓰 제프리 호그햄
알리 에프잘리
스티븐 알렌 코르데스
폴 더블유 코테스
매튜 제이 파리넬리
쉐리프 에이 고마
알퐁소 피 랜제타
다니엘 피터 모리스
조안나 로스너
니사 요하난
Original Assignee
인터내셔널 비지네스 머신즈 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 인터내셔널 비지네스 머신즈 코포레이션 filed Critical 인터내셔널 비지네스 머신즈 코포레이션
Publication of KR20070090927A publication Critical patent/KR20070090927A/ko
Application granted granted Critical
Publication of KR100968183B1 publication Critical patent/KR100968183B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Micromachines (AREA)
  • Multi-Conductor Connections (AREA)
KR1020077013681A 2004-12-16 2005-09-30 금속화 엘라스토머 프로브 구조 Expired - Fee Related KR100968183B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US63666604P 2004-12-16 2004-12-16
US60/636,666 2004-12-16

Publications (2)

Publication Number Publication Date
KR20070090927A KR20070090927A (ko) 2007-09-06
KR100968183B1 true KR100968183B1 (ko) 2010-07-05

Family

ID=37570885

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020077013681A Expired - Fee Related KR100968183B1 (ko) 2004-12-16 2005-09-30 금속화 엘라스토머 프로브 구조
KR1020077013680A Expired - Fee Related KR100968184B1 (ko) 2004-12-16 2005-09-30 금속화 엘라스토머 전기 접점

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020077013680A Expired - Fee Related KR100968184B1 (ko) 2004-12-16 2005-09-30 금속화 엘라스토머 전기 접점

Country Status (6)

Country Link
US (2) US8054095B2 (https=)
EP (1) EP1834379B1 (https=)
JP (2) JP4709850B2 (https=)
KR (2) KR100968183B1 (https=)
CN (2) CN101218515B (https=)
WO (2) WO2007001391A2 (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8054095B2 (en) * 2004-12-16 2011-11-08 International Business Machines Corporation Metalized elastomeric probe structure
US7771208B2 (en) * 2004-12-16 2010-08-10 International Business Machines Corporation Metalized elastomeric electrical contacts
TWI275187B (en) * 2005-11-30 2007-03-01 Advanced Semiconductor Eng Flip chip package and manufacturing method of the same
US7585173B2 (en) * 2007-03-30 2009-09-08 Tyco Electronics Corporation Elastomeric electrical contact
US8832936B2 (en) * 2007-04-30 2014-09-16 International Business Machines Corporation Method of forming metallized elastomeric electrical contacts
US8673416B2 (en) * 2009-10-28 2014-03-18 Xerox Corporation Multilayer electrical component, coating composition, and method of making electrical component
US8959764B2 (en) 2009-11-06 2015-02-24 International Business Machines Corporation Metallurgical clamshell methods for micro land grid array fabrication
US8263879B2 (en) * 2009-11-06 2012-09-11 International Business Machines Corporation Axiocentric scrubbing land grid array contacts and methods for fabrication
US8926379B2 (en) * 2010-12-03 2015-01-06 Ardent Concepts, Inc. Compliant electrical contact
US8917106B2 (en) * 2011-11-09 2014-12-23 Advantest America, Inc. Fine pitch microelectronic contact array and method of making same
US8641428B2 (en) * 2011-12-02 2014-02-04 Neoconix, Inc. Electrical connector and method of making it
FR3009445B1 (fr) * 2013-07-31 2017-03-31 Hypertac Sa Organe de contact entre un support et un dispositif et connecteur electrique comprenant un tel organe de contact
US9835653B2 (en) 2014-05-13 2017-12-05 International Business Machines Corporation Solder bump array probe tip structure for laser cleaning
IT201700100522A1 (it) * 2017-09-07 2019-03-07 Technoprobe Spa Elemento di interfaccia per un’apparecchiatura di test di dispositivi elettronici e relativo metodo di fabbricazione
JP7308660B2 (ja) 2019-05-27 2023-07-14 東京エレクトロン株式会社 中間接続部材及び検査装置
SG10202006996QA (en) * 2019-07-23 2021-02-25 Casey Michael Silicone contact element
US11561243B2 (en) * 2019-09-12 2023-01-24 International Business Machines Corporation Compliant organic substrate assembly for rigid probes
US11509080B2 (en) * 2020-07-22 2022-11-22 Te Connectivity Solutions Gmbh Electrical connector assembly having hybrid conductive polymer contacts
JP7541289B2 (ja) * 2020-10-29 2024-08-28 積水ポリマテック株式会社 導電部材

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010066751A (ko) * 1999-12-09 2001-07-11 추후보정 고주파 전기 접속을 위한 와이어 세그먼트 매립형 인터포저
KR20010109164A (ko) * 2000-05-31 2001-12-08 가부시키가이샤 어드밴티스트 평면도 조정 기구를 구비하는 프로브 접촉 시스템

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5476211A (en) * 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US5917707A (en) * 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
JPS63208237A (ja) * 1987-02-25 1988-08-29 Hitachi Ltd 半導体装置の測定装置
US5071359A (en) 1990-04-27 1991-12-10 Rogers Corporation Array connector
JPH0826231B2 (ja) 1991-08-16 1996-03-13 インターナショナル・ビジネス・マシーンズ・コーポレイション 導電性ポリマー材料及びその使用
US5244143A (en) 1992-04-16 1993-09-14 International Business Machines Corporation Apparatus and method for injection molding solder and applications thereof
US5371654A (en) 1992-10-19 1994-12-06 International Business Machines Corporation Three dimensional high performance interconnection package
US6295729B1 (en) 1992-10-19 2001-10-02 International Business Machines Corporation Angled flying lead wire bonding process
US5810607A (en) 1995-09-13 1998-09-22 International Business Machines Corporation Interconnector with contact pads having enhanced durability
US6054651A (en) 1996-06-21 2000-04-25 International Business Machines Corporation Foamed elastomers for wafer probing applications and interposer connectors
US6329827B1 (en) 1997-10-07 2001-12-11 International Business Machines Corporation High density cantilevered probe for electronic devices
JPH0737633A (ja) * 1993-07-14 1995-02-07 Whitaker Corp:The エラストマコネクタ
US6624648B2 (en) * 1993-11-16 2003-09-23 Formfactor, Inc. Probe card assembly
US6336269B1 (en) 1993-11-16 2002-01-08 Benjamin N. Eldridge Method of fabricating an interconnection element
US6835898B2 (en) 1993-11-16 2004-12-28 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US5632631A (en) * 1994-06-07 1997-05-27 Tessera, Inc. Microelectronic contacts with asperities and methods of making same
US5590460A (en) * 1994-07-19 1997-01-07 Tessera, Inc. Method of making multilayer circuit
US5599193A (en) * 1994-08-23 1997-02-04 Augat Inc. Resilient electrical interconnect
US5700398A (en) 1994-12-14 1997-12-23 International Business Machines Corporation Composition containing a polymer and conductive filler and use thereof
DE19605661A1 (de) 1995-02-24 1996-08-29 Whitaker Corp Elektrisches Verbinderbauteil zur Herstellung einer elektrischen Verbindung zwischen leitfähigen Flächen
JPH08287983A (ja) * 1995-04-14 1996-11-01 Whitaker Corp:The エラストマコネクタ
US5785538A (en) 1995-11-27 1998-07-28 International Business Machines Corporation High density test probe with rigid surface structure
US5632626A (en) * 1996-01-05 1997-05-27 The Whitaker Corporation Retention of elastomeric connector in a housing
DE69734158T2 (de) 1996-09-13 2006-06-22 International Business Machines Corp. Prüfkopfstruktur mit mehreren getrennten isolierten prüfspitzen
DE69737599T2 (de) 1996-09-13 2007-12-20 International Business Machines Corp. Integrierte nachgiebige sonde für waferprüfung und einbrennen
WO1998011449A1 (en) 1996-09-13 1998-03-19 International Business Machines Corporation Wafer scale high density probe assembly, apparatus for use thereof and methods of fabrication thereof
US6104201A (en) 1996-11-08 2000-08-15 International Business Machines Corporation Method and apparatus for passive characterization of semiconductor substrates subjected to high energy (MEV) ion implementation using high-injection surface photovoltage
US6329829B1 (en) * 1997-08-22 2001-12-11 Micron Technology, Inc. Interconnect and system for making temporary electrical connections to semiconductor components
US7349223B2 (en) * 2000-05-23 2008-03-25 Nanonexus, Inc. Enhanced compliant probe card systems having improved planarity
US6146151A (en) * 1999-08-18 2000-11-14 Hon Hai Precision Ind. Co., Ltd. Method for forming an electrical connector and an electrical connector obtained by the method
US6442039B1 (en) * 1999-12-03 2002-08-27 Delphi Technologies, Inc. Metallic microstructure springs and method of making same
US6586955B2 (en) * 2000-03-13 2003-07-01 Tessera, Inc. Methods and structures for electronic probing arrays
JP3921163B2 (ja) * 2000-09-26 2007-05-30 株式会社アドバンストシステムズジャパン スパイラルコンタクタ及びその製造方法、並びにそれを用いた半導体検査装置、及び電子部品
US7083436B2 (en) 2001-03-06 2006-08-01 International Business Machines Corporation Particle distribution interposer and method of manufacture thereof
US6425518B1 (en) 2001-07-25 2002-07-30 International Business Machines Corporation Method and apparatus for applying solder to an element on a substrate
JP2003142537A (ja) * 2001-11-01 2003-05-16 Hitachi Ltd 半導体装置の検査装置
US6712621B2 (en) * 2002-01-23 2004-03-30 High Connection Density, Inc. Thermally enhanced interposer and method
US20030186572A1 (en) * 2002-04-01 2003-10-02 Hougham Gareth Geoffrey Self compensating design for elastomer interconnects
US6854981B2 (en) * 2002-06-03 2005-02-15 Johnstech International Corporation Small pin connecters
JP4215468B2 (ja) * 2002-08-26 2009-01-28 信越ポリマー株式会社 電気コネクタ
US6838894B2 (en) 2002-09-03 2005-01-04 Macintyre Donald M. Stress relieved contact array
US6881072B2 (en) * 2002-10-01 2005-04-19 International Business Machines Corporation Membrane probe with anchored elements
WO2004039135A1 (en) * 2002-10-24 2004-05-06 International Business Machines Corporation Land grid array fabrication using elastomer core and conducting metal shell or mesh
JP3978174B2 (ja) 2003-03-07 2007-09-19 北川工業株式会社 コンタクト
US7491892B2 (en) * 2003-03-28 2009-02-17 Princeton University Stretchable and elastic interconnects
US6948940B2 (en) * 2003-04-10 2005-09-27 Formfactor, Inc. Helical microelectronic contact and method for fabricating same
US7137827B2 (en) 2003-11-17 2006-11-21 International Business Machines Corporation Interposer with electrical contact button and method
US7172431B2 (en) 2004-08-27 2007-02-06 International Business Machines Corporation Electrical connector design and contact geometry and method of use thereof and methods of fabrication thereof
US7021941B1 (en) 2004-10-19 2006-04-04 Speed Tech Corp. Flexible land grid array connector
US8054095B2 (en) 2004-12-16 2011-11-08 International Business Machines Corporation Metalized elastomeric probe structure

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010066751A (ko) * 1999-12-09 2001-07-11 추후보정 고주파 전기 접속을 위한 와이어 세그먼트 매립형 인터포저
KR20010109164A (ko) * 2000-05-31 2001-12-08 가부시키가이샤 어드밴티스트 평면도 조정 기구를 구비하는 프로브 접촉 시스템

Also Published As

Publication number Publication date
JP4709850B2 (ja) 2011-06-29
WO2007001391A2 (en) 2007-01-04
EP1834379A2 (en) 2007-09-19
WO2007001391A3 (en) 2007-12-13
US20070298626A1 (en) 2007-12-27
CN101288205A (zh) 2008-10-15
US20080094085A1 (en) 2008-04-24
US7452212B2 (en) 2008-11-18
EP1834379A4 (en) 2010-02-24
WO2006137896A3 (en) 2008-01-24
CN101218515B (zh) 2011-08-24
CN101288205B (zh) 2011-09-21
US8054095B2 (en) 2011-11-08
CN101218515A (zh) 2008-07-09
KR100968184B1 (ko) 2010-07-05
KR20070090927A (ko) 2007-09-06
KR20070112107A (ko) 2007-11-22
WO2006137896A2 (en) 2006-12-28
JP2008524583A (ja) 2008-07-10
JP2008524799A (ja) 2008-07-10
EP1834379B1 (en) 2012-07-11
JP5220417B2 (ja) 2013-06-26

Similar Documents

Publication Publication Date Title
KR100968183B1 (ko) 금속화 엘라스토머 프로브 구조
US6576485B2 (en) Contact structure and production method thereof and probe contact assembly using same
US6471538B2 (en) Contact structure and production method thereof and probe contact assembly using same
US6504223B1 (en) Contact structure and production method thereof and probe contact assembly using same
US6917102B2 (en) Contact structure and production method thereof and probe contact assembly using same
US6948940B2 (en) Helical microelectronic contact and method for fabricating same
US6750136B2 (en) Contact structure production method
US6612861B2 (en) Contact structure and production method thereof
KR20070053743A (ko) 한번에 다수 방식으로 와이어 본드 프로브 카드를 구축하는방법
KR20090108608A (ko) 회전형 접촉 요소 및 이 회전형 접촉 요소의 제조 방법
US20020048973A1 (en) Contact structure and production method thereof and probe contact assembly using same
US7771208B2 (en) Metalized elastomeric electrical contacts
US8832936B2 (en) Method of forming metallized elastomeric electrical contacts
JP2004317162A (ja) プローブカード、プローブピン及びその製造方法

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20130630

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20130630

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000