JP4708951B2 - Inverter module and inverter-integrated AC motor using the same - Google Patents

Description

  The present invention particularly relates to an inverter module integrated with an AC motor.

  Conventionally, an inverter module that is interposed between a DC power source and an armature winding of an AC motor and supplies AC power to the armature winding is integrated with the AC motor, thereby reducing the size and weight and wiring loss. Inverter-integrated AC motors have been proposed that reduce this.

  Since the inverter module can recover the kinetic energy of the load to the DC power source side by regenerative operation during braking, it is widely used for driving motor drive control of hybrid electric vehicles. Such a conventional inverter module will be described with reference to FIG.

  The main battery 1 is a DC power source in which a plurality of secondary batteries are connected in series, and is connected to the inverter module 2 through the insulation-coated cables 11 and 12, the (+) bus line 13, and the (−) bus line 14. A smoothing capacitor 4 is connected between the input terminals of the inverter module 2 to absorb the ripple current and stabilize the input voltage.

In the inverter module 2, 5 a, 5 b, 6 a, 6 b, 7 a, 7 b are IGBTs (Insulated Gate Bipolar Transistors), and the upper arm switching element 5 a and the lower arm switching element 5 b connected in series to each other are the U-phase inverter circuit 5. The upper arm switching element 6a and the lower arm switching element 6b connected in series to each other form a V-phase inverter circuit 6, and the upper arm switching element 7a and the lower arm switching element 7b connected in series to each other are W A phase inverter circuit 7 is configured.
Further, the U-phase output terminal 5e, the V-phase output terminal 6e, and the W-phase output terminal 7e, which are connection points of the respective phases, are connected to the respective phase terminals of the traveling motor through the respective bus lines 15 to 17 and the insulation-coated cables 18 to 20. Individually connected, each phase inverter circuit is alternately turned on / off using the control circuit 8 to convert the DC power of the main battery 1 into AC power and feed the traveling motor 3.
Further, the flywheel diodes 5c, 5d, 6c, 6d, 7c, and 7d are individually connected in parallel with the switching elements 5a, 5b, 6a, 6b, 7a, and 7b, and return current to the traveling motor 3 that is an inductive load. Supply.

  In the conventional inverter module, a semiconductor module constituting each phase inverter circuit is stored in an inverter case together with a cooling block and a smoothing capacitor, and is arranged at a position different from the AC motor.

FIG. 2 is a perspective view seen from the input terminal side and FIG. 3 is a perspective view seen from the output terminal side of the inverter module having such a conventional structure. 2 and 3, the semiconductor module 21 is screwed onto the mounting surface 23 of the cooling block 22 via thermally conductive grease. The cooling block 22 cools the semiconductor module 21 by circulating the cooling liquid through the cold liquid pipes 24a and 24b.
Inside the semiconductor module 21, U, V and W phase inverter circuits and a wiring board are built in, and are connected to the external controller and the current sensors 9a, 9b and 9c through connection terminals.

  In FIG. 2, the positive conductor 25 and the negative conductor 26 of the semiconductor module 21 are connected to the smoothing capacitor 4 and a DC power source (not shown) via a (+) bus line 13 and a (−) bus line 14.

  In FIG. 3, the U-phase output conductor 5e, the V-phase output conductor 6e, and the W-phase output conductor 7e of the semiconductor module 21 pass through the hollow holes of the current sensors 9a, 9b, and 9c, and pass through the U-phase bus line 15, V-phase bus line 16, W It is connected to a stator coil (not shown) of the AC motor via a phase bus line 17.

  FIG. 4 shows an XX cross-sectional view of the inverter module of FIG. 2, and a smoothing capacitor, a current sensor, and a bus line are not shown in order to clarify the internal structure of the semiconductor module 21. The semiconductor module 21 is configured by soldering an insulating substrate 27 on which switching elements 5a and 5b are mounted to an element cooling metal member 28, and further attaching a housing 29. The insulating substrate 27 is configured by adhering electrode plates such as copper or aluminum to both surfaces of a ceramic base material such as aluminum nitride, for example, and circuit patterns 30a and 30b are formed on the upper surface of the electrode plate, thereby switching elements 5a. 5b is soldered and joined, and the lower surface of the electrode plate is soldered and joined to the element cooling metal member 28.

  The wire 31a connects the positive electrode conductor 25 formed integrally with the housing 29 to the circuit pattern 30a. The wire 31c connects the U-phase output terminal 5e integrally formed with the housing 29 to the circuit pattern 30b. On the insulating substrate 27, a shield plate 32 and a wiring substrate 33 are arranged at a predetermined interval. Since a large current of several tens to several hundreds of amperes flows through the inverter circuit, and electromagnetic noise may be emitted to cause a malfunction in the control circuit, the wiring board 33 is completely shielded by the shield plate 32.

FIG. 5 is a view of the U-phase inverter circuit as viewed from the Y direction in the semiconductor module 21 shown in FIG. 4 with the shield plate 32 and the wiring board 33 removed.
In FIG. 5, switching elements 5 a and 5 b and flywheel diodes 5 c and 5 d are mounted on circuit patterns 30 a and 30 b of insulating substrate 27.
The positive electrode conductor 25 and the negative electrode conductor 26 are laminated and arranged on the left side of the insulating substrate 27. The output conductor 5e is disposed on the right side of the insulating substrate 27. The wire 31a connects the positive electrode conductor 25 and the circuit pattern 30a.
The wire 31b connects the switching element 5a and the flywheel diode 5c to the circuit pattern 30b. The wire 31c connects the circuit pattern 30b and the output terminal 5e. The wire 31d connects the switching element 5b and the flywheel diode 5d to the negative electrode conductor 26.

  Thereby, the switching element 5a and the flywheel diode 5c are connected between the positive conductor 25 and the output conductor 5e, and the switching element 5b and the flywheel diode 5d are connected between the output conductor 5e and the negative conductor 26. Thus, a U-phase inverter circuit is configured. Since the V-phase and W-phase inverter circuits have the same configuration, description thereof is omitted here.

  The wire 34 a connects the plurality of signal terminals 35 a of the switching element 5 a and the wiring conductor 36 a formed integrally with the housing 29. The wires 34b connect the signal terminals 35b of the switching element 5b and the wiring conductors 36b formed integrally with the housing 29. The wiring conductors 36a and 36b are soldered to the wiring board 33 and connected to the control circuit.

The positive electrode conductor 25 and the negative electrode conductor 26 are, for example, wirings having a thickness of about 1 to 2 mm and a width of about 10 mm, and the wiring inductance is set to be extremely small so that they are stacked close to each other. On the other hand, the circuit pattern 30a has a thickness of 400 μm, the wires 31a and 31d have a diameter of 350 μm, and the circuit patterns are individually arranged. Therefore, the wiring inductance is larger than that of the positive conductor 25 and the negative conductor 26.
Therefore, when the switching element is turned off, a surge voltage due to the wiring inductance may be generated and the switching element may be destroyed. Therefore, the wiring length of the circuit pattern 30a and the wires 31a and 31d is shortened as much as possible to reduce the wiring inductance. Must be set.

  FIG. 6 is a diagram showing an internal circuit configuration and each signal terminal of the switching element 5a shown in FIG. In FIG. 6, the switching element 5 a is an IGBT and includes a temperature detection diode 37 therein. Each signal terminal is a gate terminal for driving the IGBT, an emitter terminal, a sense emitter terminal for shunting the collector current of the IGBT and detecting an overcurrent, and an anode terminal and a cathode terminal of the temperature detection diode 37. In many cases, the sense emitter terminal, the anode terminal, and the cathode terminal are built in a switching element for large current applications, but may be omitted for small to medium current applications.

FIG. 7 shows a diagram in which two switching elements are arranged in parallel in the U-phase inverter circuit shown in FIG. In FIG. 7, switching elements 5a and 5a ′ and flywheel diodes 5c and 5c ′ are mounted on a circuit pattern 30a of an insulating substrate 27. Switching elements 5b and 5b ′ and flywheel diodes 5d and 5d ′ are mounted on the circuit pattern 30b.
The wire 31e connects the switching element 5a ′ and the flywheel diode 5c ′ to the circuit pattern 30b. The wire 31f connects the switching element 5b ′ and the flywheel diode 5d ′ to the negative conductor 26.
The wire 34 a ′ connects the signal terminal 35 a ′ of the switching element 5 a ′ and the wiring terminal 36 a ′ formed integrally with the housing 29. The wire 34 b ′ connects the signal terminal 35 b ′ of the switching element 5 b ′ and the wiring terminal 36 b ′ formed integrally with the housing 29. The wiring terminals 36a, 36a ′, 36b, and 36b ′ are soldered to the wiring board 33 and connected to the control circuit. Since the connection by other wires has the same configuration as in FIG. 5, the description thereof is omitted here.

In FIG. 7, when the wiring length from the positive electrode conductor 25 to the switching elements 5a and 5a ′ is compared, the wiring resistance of the switching element 5a ′ is slightly increased because the wiring length of the circuit pattern 30a is longer. Therefore, when the amount of current is as large as several hundred amperes, a difference occurs in the voltage drop due to the wiring resistance, and the current flows more easily through the switching element 5a having a smaller wiring resistance (bias phenomenon), and the switching elements 5a and 5a ′. There will be a difference in temperature rise.
The drift phenomenon is prominent when the inverter circuit is short-circuited, and the switching element side having a low wiring resistance is likely to be destroyed. In order to prevent drift when the switching elements are connected in parallel, it is necessary to make the wiring length from the switching element to the positive conductor or the negative conductor uniform and match the wiring resistance as much as possible.

  A number of inverter-integrated AC motors in which these inverter modules are enclosed in a rectangular parallelepiped metal or resin case and fixed to the peripheral wall or end wall of the motor housing have been reported. Hereinafter, a method of fixing the inverter module to the peripheral wall is referred to as a peripheral wall fixing type, and a method of fixing the inverter module to the end wall is referred to as an end wall fixing type.

Inverter-integrated AC motor as an example of fixed peripheral wall type Inverter-integrated type in which switching elements and smoothing capacitors that constitute the inverter module are arranged on the peripheral wall of the AC motor and wired and connected by the bus bar built-in plate and outer frame part AC motors have been proposed. (For example, refer to Patent Document 1.)

Furthermore, as another example of the fixed peripheral wall type, there is an inverter integrated AC motor that increases the cooling capacity of the switching element by arranging the switching elements constituting the inverter module in contact with the peripheral wall of the AC motor. Proposed. (For example, see Patent Document 2.)

As an example of an end wall fixed type of an inverter-integrated AC motor, a structure in which an inverter module formed in a substantially U shape is fitted to an AC motor rotating shaft and integrated with the motor end wall has been proposed. This U-shaped inverter module can be mounted on the end wall on the side where the rotating shaft of the AC motor protrudes, in addition to being advantageous in realizing volume reduction by reducing the motor diameter. Since it can be detached even in a connected state, handling is suitable. (For example, refer to Patent Document 3.)

As another example of the end wall fixed type, an inverter cooling chamber for circulating the refrigerant of the inverter cooling means is provided in the end frame of the AC motor rotating shaft, and the inverter module is arranged on the motor end wall simultaneously with the motor rotation. An inverter-integrated AC motor having a structure for cooling the air has been proposed. (For example, see Patent Document 4)

Further, as another example of the end wall fixed type, each phase inverter circuit is arranged in the circumferential direction with respect to the rotating shaft of the AC motor, and the upper arm switching element and the lower arm switching element constituting each phase inverter circuit are: An inverter module is disclosed which is arranged extending in the radial direction and has a configuration in which a control circuit is arranged between each phase inverter circuit to simplify wiring. (For example, refer to Patent Document 5.)
JP 2003-324903 A JP 2003-262187 A Japanese Patent Laid-Open No. 7-231672 JP 7-298552 A JP 2004-201462 A

However, when the conventional inverter module having a rectangular parallelepiped shape is arranged on the end wall or the peripheral wall of the AC motor having a cylindrical shape, an extra space is generated around the inverter and it is difficult to efficiently arrange the inverter module.
In particular, the current sensor arranged between the output terminal of each phase inverter circuit and the AC motor input terminal is often arranged in a shape protruding from the side surface of the semiconductor module, and the actual situation is that the surrounding space is difficult to use effectively. is there.
This is because the conventional AC motor lead wire is usually placed on the motor peripheral wall, so the current sensor is placed on the side surface of the inverter module, and the inverter module output terminal and the AC motor lead wire are connected as short as possible. This is due to the fact that the approach has been taken. However, when the AC motor lead wire can be freely arranged except for the case where the AC motor lead wire is necessarily arranged on the motor peripheral wall due to restrictions on the motor side (for example, using a general-purpose motor, etc.) There was a problem that it was necessary to optimize the size and to reduce the size.
Further, the smoothing capacitor connected between the input terminals of the semiconductor module is a large component, and there is a problem that the inverter module becomes large if the arrangement space is not devised.

In addition, when the wiring length from each phase inverter circuit to the positive electrode conductor and the negative electrode conductor is long, there is a problem that a surge voltage is generated due to wiring inductance and the switching element is destroyed.
Further, when a plurality of upper arm side and lower arm side switching elements constituting each phase inverter circuit are connected in parallel, the wiring resistance is reduced when the wiring length from the positive conductor or the negative conductor to the switching element is not uniform. In contrast, there is a problem that a drift phenomenon in which a current easily flows in the switching element on one side occurs, and a temperature rise difference occurs in the switching element.

The present invention solves the above-mentioned problem, and each phase inverter circuit is arranged in the circumferential direction with respect to the rotating shaft of the AC motor, and has a hollow hole at a substantially central portion of the element cooling metal member. An object of the present invention is to provide an inverter module in which a sensor or a smoothing capacitor is arranged to realize further miniaturization.
In addition, an inverter structure that can connect the switching element of each phase inverter circuit and the positive electrode terminal or the negative electrode terminal as short as possible is intended to reduce inductance, and even when a plurality of switching elements are connected in parallel, a structure that can maintain a uniform wiring length is provided. An object of the present invention is to provide an inverter module having the same.

An inverter module according to a first aspect of the present invention is a multiphase inverter circuit in which a plurality of single-phase inverter circuits formed by directly connecting an upper arm side switching element and a lower arm side switching element are connected in parallel to each other. An inverter module arranged on the end face of
A plurality of switching elements constituting a multi-phase inverter circuit that converts input DC power into AC power and supplies power to the stator coil of the AC motor, and a metal member for element cooling for dissipating heat by mounting the switching elements A control circuit for controlling the multiphase inverter circuit, a plurality of signal terminals provided in the switching element for connection to the control circuit, and a positive side of the upper arm side switching element of the multiphase inverter circuit ( +) A positive electrode conductor for connecting to the power supply terminal; a negative electrode conductor for connecting the negative electrode side of the lower arm side switching element of the multiphase inverter circuit to the (−) power supply terminal; and the upper arm side switching element and the lower side. An output conductor for each phase connected to the connection point with the arm side switching element,
The switching element is disposed in a circumferential direction at a predetermined interval with respect to a rotating shaft of the AC motor, and the positive electrode conductor and the negative electrode conductor have a ring shape or an arc shape and are adjacent to each other in the circumferential direction. Arranged on the inner peripheral side of the switching element, the output conductor is arranged on the inner peripheral side of the switching element arranged in the circumferential direction, and the signal terminal of the switching element is connected to the switching element. It is characterized in that it is arranged on the outer peripheral side facing the output conductor with being sandwiched and connected to the control circuit.

The switching element is arranged in the circumferential direction with respect to the rotating shaft of the AC motor, the positive electrode conductor and the negative electrode conductor are arranged close to each other in a ring shape or arc shape, and the output conductor is arranged on the inner peripheral side of the switching element. By disposing the switching element on the inner peripheral side, the positive and negative conductors and the switching element, or the output conductor and the switching element can be connected with the shortest and uniform wiring length.
In this way, the effect of suppressing the wiring surge can be obtained by reducing the wiring inductance, and when a plurality of switching elements are connected in parallel, the wiring resistance between the switching elements is not unbalanced, and one side switching is performed. The phenomenon of drifting to the element does not occur.
Furthermore, a large current of several tens to several hundreds of amperes flows through the positive electrode conductor, the negative electrode conductor, and the output conductor, and electromagnetic wave noise may be emitted to the outside, which may cause the control circuit to malfunction. Therefore, the distance between the noise generation source and the control circuit can be ensured, and the influence of electromagnetic noise can be reduced.

In a preferred embodiment, the element cooling metal member has a ring plate shape, and has a hollow cylindrical shape on which the element cooling metal member is placed and forcibly cooled, and is disposed in a hollow portion of the cooling block. And an output bus line extending from the output conductor is connected to the AC motor via the current sensor.
As a result, the current sensor can be arranged in the hollow portion of the cooling block and the space can be effectively utilized to reduce the size, and the wiring length of the output bus line connecting the inverter module and the AC motor can be shortened.

An inverter module according to a second aspect of the present invention is a multi-phase inverter circuit in which a plurality of single-phase inverter circuits formed by directly connecting an upper arm side switching element and a lower arm side switching element are connected in parallel to each other. An inverter module arranged on the end face of
A plurality of switching elements constituting a multi-phase inverter circuit that converts input DC power into AC power and supplies power to the stator coil of the AC motor, and a metal member for element cooling for dissipating heat by mounting the switching elements A control circuit for controlling the multiphase inverter circuit, a plurality of signal terminals provided in the switching element for connection to the control circuit, and a positive side of the upper arm side switching element of the multiphase inverter circuit ( +) A positive electrode conductor for connecting to the power supply terminal; a negative electrode conductor for connecting the negative electrode side of the lower arm side switching element of the multiphase inverter circuit to the (−) power supply terminal; and the upper arm side switching element and the lower side. An output conductor for each phase connected to the connection point with the arm side switching element,
The switching element is disposed in a circumferential direction at a predetermined interval with respect to a rotating shaft of the AC motor, and the positive electrode conductor and the negative electrode conductor have a ring shape or an arc shape and are adjacent to each other in the circumferential direction. Arranged on the outer peripheral side of the switching element, the output conductor is arranged on the outer peripheral side of the switching element arranged in the circumferential direction, and the signal terminal of the switching element sandwiches the switching element It is arranged on the inner peripheral side facing the output conductor and is connected to the control circuit.
According to the present invention, the same effect as that of the first invention can be obtained, and similarly to the case where the positive conductor, the negative conductor, and the output conductor are arranged on the inner peripheral side of the switching element, the wiring inductance is reduced and the switching surge is suppressed. In addition, when a plurality of switching elements are connected in parallel, the phenomenon of drifting to the switching element on one side does not occur. Furthermore, it is possible to separate the positive conductor, negative conductor, and output conductor, which are noise generation sources, from the plurality of signal terminals on the switching element to which the control circuit is connected as much as possible, thereby reducing the influence of electromagnetic noise. Can do.

  In a preferred aspect, the positive electrode conductor and the negative electrode conductor are arranged between the switching element arranged in the circumferential direction and the output conductor. Thereby, the effect which shortens the wiring length of a positive electrode conductor and a negative electrode conductor, and a switching element appears notably.

  In a preferred aspect, the positive electrode conductor and the negative electrode conductor both have an L-shaped cross section, and have a stacked arrangement structure in which they are close to each other. As a result, the positive electrode conductor and the negative electrode conductor can be reduced in size and the wiring inductance can be reduced.

An inverter module according to a third aspect of the present invention is a multiphase inverter circuit in which a plurality of single-phase inverter circuits formed by connecting an upper arm side switching element and a lower arm side switching element in series are connected in parallel to form an AC An inverter module disposed on the end face of the motor,
A plurality of switching elements constituting a multi-phase inverter circuit that converts input DC power into AC power and supplies power to the stator coil of the AC motor, and a metal member for element cooling for dissipating heat by mounting the switching elements A control circuit for controlling the multiphase inverter circuit, a plurality of signal terminals provided in the switching element for connection to the control circuit, and a positive side of the upper arm side switching element of the multiphase inverter circuit ( +) A positive electrode conductor for connecting to the power supply terminal; a negative electrode conductor for connecting the negative electrode side of the lower arm side switching element of the multiphase inverter circuit to the (−) power supply terminal; and the upper arm side switching element and the lower side. An output conductor for each phase connected to the connection point with the arm side switching element,
The switching element is arranged in a circumferential direction with a predetermined interval with respect to the rotating shaft of the AC motor, and the positive electrode conductor and the negative electrode conductor have a ring shape or an arc shape and are close to each other, Arranged on the inner peripheral side of the switching element arranged in the circumferential direction, the output conductor is arranged on the outer peripheral side of the switching element arranged in the circumferential direction, and the signal terminal of the upper arm side switching element is Arranged on the inner peripheral side opposite to the output conductor across the switching element and connected to the control circuit, the signal terminal of the lower arm side switching element relative to the negative conductor across the switching element It arrange | positions to the outer peripheral part side to perform, and is connected to the said control circuit, It is characterized by the above-mentioned.

  According to this invention, in addition to the same effects as the first invention, it is possible to arrange the positive electrode conductor and the negative electrode conductor on the inner peripheral side of the switching element, and to arrange the output conductor on the outer peripheral side of the switching element. When a smoothing capacitor is arranged on the side and a current sensor is arranged on the outer peripheral side, the size can be reduced.

  In a preferred embodiment, the element cooling metal member has a ring plate shape, and a cooling block having a hollow cylindrical shape on which the element cooling metal member is mounted and forcibly cooled, and disposed in a hollow portion of the cooling block And the positive electrode conductor and the negative electrode conductor are connected to the smoothing capacitor. Thereby, the smoothing capacitor can be arranged close to each phase inverter circuit to stabilize the DC voltage, and the inverter module can be miniaturized by making effective use of space.

  In a preferred embodiment, a current sensor is disposed on the outer periphery of the inverter module, and an output bus line extending from the output conductor is connected to the AC motor via the current sensor. Thereby, the wiring length of the output bus line which connects an inverter module and an AC motor can be shortened.

In an inverter module according to a fourth aspect of the invention, a single-phase inverter circuit formed by directly connecting an upper arm side switching element and a lower arm side switching element is connected in parallel to each other to form a multiphase inverter circuit, and an AC motor An inverter module arranged on the end face of
A plurality of switching elements constituting a multi-phase inverter circuit that converts input DC power into AC power and supplies power to the stator coil of the AC motor, and a metal member for element cooling for dissipating heat by mounting the switching elements A control circuit for controlling the multi-phase inverter circuit, a plurality of signal terminals provided in the switching element to be joined to the control circuit, and a positive side of the upper arm side switching element of the multi-phase inverter circuit ( +) A positive electrode conductor for connecting to the power supply terminal; a negative electrode conductor for connecting the negative electrode side of the lower arm side switching element of the multiphase inverter circuit to the (−) power supply terminal; and the upper arm side switching element and the lower side. An output conductor for each phase connected to the connection point with the arm side switching element,
The switching element is disposed in a circumferential direction at a predetermined interval with respect to the rotating shaft of the AC motor, and the positive electrode conductor and the negative electrode conductor have a ring shape or an arc shape and are adjacent to each other in the circumferential direction. Arranged on the outer peripheral side of the switching element arranged on the side, the output conductor is arranged on the inner peripheral side of the switching element arranged in the circumferential direction, and the signal terminal of the upper arm side switching element is the The switching element is disposed on the outer peripheral side facing the output conductor and is connected to the control circuit, and the signal terminal of the lower arm side switching element is the inner circumference facing the negative conductor across the switching element. It is arranged on the part side and connected to the control circuit.
According to this invention, in addition to the same effects as the first invention, the output conductor can be disposed on the inner peripheral side of the switching element, and the positive conductor and the negative conductor can be disposed on the outer peripheral side of the switching element. The size can be reduced by arranging a current sensor on the side.

In a preferred embodiment, the element cooling metal member has a circular plate shape, and has a hollow cylindrical shape on which the element cooling metal member is placed and forcibly cooled, and is disposed in a hollow portion of the cooling block. And an output bus line extending from the output conductor is connected to the AC motor via the current sensor.
Thus, the internal space can be effectively utilized to reduce the size, and the wiring length of the output bus line connecting the inverter module and the AC motor can be shortened.

  In a preferred aspect, the positive electrode conductor and the negative electrode conductor both have an L-shaped cross section, and have a stacked arrangement structure in which they are close to each other. As a result, the positive electrode conductor and the negative electrode conductor can be reduced in size and the wiring inductance can be reduced.

An inverter module according to a fifth aspect of the present invention is a multiphase inverter circuit in which a plurality of single-phase inverter circuits formed by serially connecting an upper arm side switching element and a lower arm side switching element are connected in parallel to form an AC An inverter module disposed on the end face of the motor,
A plurality of switching elements constituting a multi-phase inverter circuit that converts input DC power into AC power and supplies power to the stator coil of the AC motor, and a metal member for element cooling for dissipating heat by mounting the switching elements A control circuit for controlling the multiphase inverter circuit, a plurality of signal terminals provided in the switching element for connection to the control circuit, and a positive side of the upper arm side switching element of the multiphase inverter circuit ( +) A positive electrode conductor for connecting to the power supply terminal; a negative electrode conductor for connecting the negative electrode side of the lower arm side switching element of the multiphase inverter circuit to the (−) power supply terminal; and the upper arm side switching element and the lower side. An output conductor for each phase connected to the connection point with the arm side switching element,
The switching element is arranged in a circumferential direction with a predetermined interval with respect to the rotating shaft of the AC motor, and the positive electrode conductor and the negative electrode conductor have an arrangement structure in which they are close to each other. The upper arm side switching element and the lower arm side switching element constituting the in-phase inverter circuit having a plurality of branch conductor parts extending in a substantially radial direction from the conductor part are circumferentially arranged by the branch conductor parts. The output conductor extends between the upper arm side switching element and the lower arm side switching element constituting the in-phase inverter circuit and extends in the substantially radial direction and is connected to the middle point. In addition, the signal terminal of the upper arm side switching element is disposed on the branch conductor portion side of the positive conductor facing the output conductor with the switching element interposed therebetween. Connected to the control circuit, and the signal terminal of the lower arm side switching element is arranged on the output conductor side facing the branch conductor portion side of the negative conductor across the switching element and connected to the control circuit It is characterized by being.

  According to this invention, in addition to the same effects as the first invention, it is possible to arrange the positive electrode conductor and the negative electrode conductor on the inner peripheral side of the switching element, and to arrange the output conductor on the outer peripheral side of the switching element. When a smoothing capacitor is arranged on the side and a current sensor is arranged on the outer peripheral side, the size can be reduced.

  In a preferred aspect, a ring-shaped or arc-shaped conductor portion of the positive electrode conductor and the negative electrode conductor is disposed on the outer peripheral side or the inner peripheral side of the switching element disposed in the circumferential direction. Thereby, the connection with the smoothing capacitor becomes easy, and the DC voltage can be stabilized.

In a preferred embodiment, the element cooling metal member has a circular plate shape, and has a hollow cylindrical shape on which the element cooling metal member is placed and forcibly cooled, and is disposed in a hollow portion of the cooling block. A smoothing capacitor to be connected, and the positive electrode conductor and the negative electrode conductor are connected to the smoothing capacitor.
Thereby, the smoothing capacitor can be arranged close to each phase inverter circuit to stabilize the DC voltage, and the inverter module can be miniaturized by making effective use of space.

In a preferred embodiment, a current sensor is disposed on the outer periphery of the inverter module, and an output bus line extending from the output conductor is connected to the AC motor via the current sensor.
Thereby, the wiring length of the output bus line which connects an inverter module and an AC motor can be shortened.

In a preferred embodiment, the element cooling metal member has a circular plate shape, and has a hollow cylindrical shape on which the element cooling metal member is placed and forcibly cooled, and is disposed in a hollow portion of the cooling block. And an output bus line extending from the output conductor is connected to the AC motor via the current sensor.
As a result, the current sensor can be arranged in the hollow portion of the cooling block and the space can be effectively utilized to reduce the size, and the wiring length of the output bus line connecting the inverter module and the AC motor can be shortened.

A preferred aspect common to the first to fifth inventions will be described below.
In a preferred aspect, the switching element and the element cooling metal member are connected via insulating ceramics. As the insulating ceramic, for example, a material having low thermal resistance such as aluminum nitride can be used.
As a result, it can be used for applications that require high heat dissipation performance.

In a preferred aspect, an insulating sheet disposed on the mounting surface of the element cooling metal member, a conductor plate disposed by patterning the insulating sheet, and a heat diffusion plate disposed on the conductor plate, The switching element is mounted on one main surface of the thermal diffusion plate.
As a result, the heat generated by the switching element is diffused in the plane direction by the heat diffusing plate, and then the heat is transferred to the element cooling metal member through the insulating sheet having good thermal conductivity to radiate heat. The insulating sheet has a larger thermal resistance than the insulating ceramic described above, but can be used at low cost.
Therefore, a module can be provided at low cost for an application in which a thermal diffusion plate is inserted between the switching element and the insulating sheet to reduce the thermal resistance and guarantee performance.

  In a preferred embodiment, the element cooling metal member has a substantially U-shaped mounting surface. As a result, the heat radiation area of the element cooling metal member can be minimized, and the smoothing capacitor can be disposed in the vacant space, which contributes to the downsizing of the inverter module.

In a preferred aspect, the element cooling metal member has a fin on one main surface facing the mounting surface of the switching element.
As a result, the element cooling metal member can be directly cooled, and the thermal resistance can be greatly reduced.

In a preferred aspect, the fins are arranged in a circumferential direction with a predetermined interval with respect to a rotation shaft included in the AC motor.
As a result, the cooling pipe can be configured with the shortest distance while suppressing pressure reduction.

In a preferred embodiment, the cooling block includes a cooling medium flow path, and has an opening joined to a back surface opposite to one main surface of the element cooling metal member on which the switching element is mounted. The element cooling metal member is fitted and integrated with each other, a part of the surface of the element cooling metal member is exposed in the flow path, and directly cooled with a cooling medium.
Thereby, the fluid tightness of the flow path of the cooling medium can be secured.

In a preferred embodiment, a single or a plurality of parallel-connected switching elements constituting each arm of each phase inverter circuit are arranged in the circumferential direction alternately with the upper arm and the lower arm.
As a result, the upper arm side switching element and the lower arm side switching element of each phase inverter circuit can be disposed close to each phase output terminal, which contributes to the miniaturization of the inverter module.

In a preferred embodiment, a single or a plurality of switching elements connected in parallel constituting each arm of each phase inverter circuit are divided into an upper arm group and a lower arm group and arranged in the circumferential direction.
As a result, it is possible to arrange the control boards without considering the mutual insulation distances of the U-phase, V-phase, and W-phase lower arm control circuits of the control board, and the control board can be saved in space.

In a preferred embodiment, a power supply circuit is arranged at the center of the wiring board, and a control circuit group for driving or protecting the switching elements is arranged in a substantially concentric manner around the power supply circuit to supply power.
As a result, power can be supplied from the power supply circuit to the control circuit group of each phase inverter circuit with the shortest and uniform wiring length, and the power supply voltage can be stabilized.

In a preferred aspect, a converter for performing voltage conversion is also arranged on the mounting surface of the element cooling metal member.
Thereby, after converting the direct-current voltage input from direct-current power supply into a desired voltage value, it can be converted into alternating current power with an inverter, and can be supplied to a motor. In particular, when driving a high-output motor, the inverter DC output voltage can be reduced by boosting the battery DC voltage, and the wiring can be miniaturized.

In a preferred mode, the wiring conductor of the current sensor formed integrally with the housing of the current sensor is directly inserted into the wiring board and soldered.
This eliminates the need for a harness for connecting the current sensor and the wiring board, and simplifies assembly.

  In a preferred embodiment, the semiconductor module is mounted on the cooling block, and a smoothing capacitor is disposed on the semiconductor module to be integrated. Thereby, the semiconductor module portion and the smoothing capacitor can be arranged close to each other, and the inverter module can be miniaturized.

  In a preferred embodiment, the inverter module is integrated with the AC motor so that the diameter of the inverter module is substantially the same as the motor diameter. Thus, a miniaturized inverter-integrated AC motor can be provided.

In a preferred embodiment, a plurality of the semiconductor modules, smoothing capacitors, and cooling blocks are stacked to form an inverter module, and the inverter module is integrated with an AC motor.
Thereby, the inverter module according to the rated output of an AC motor, or an inverter integrated motor can be provided.
For example, a semiconductor module is mounted on both sides of the cooling block to produce an inverter module or an inverter-integrated motor, so that the output capability can be doubled.
Thus, by using an existing component unit and providing an inverter module or an inverter-integrated motor having a plurality of variations, the utilization efficiency of each unit becomes very high.

In a preferred embodiment, there is provided a cooling block comprising a cooling medium flow path formed on a motor housing surrounding the motor and having a large-diameter cylindrical outer peripheral wall and a small-diameter cylindrical inner peripheral wall projecting from one end surface thereof. One-piece molding. Then, the cooling block is fitted and integrated with the back surface opposite to one main surface of the element cooling metal member on which the switching element is mounted, and a part of the surface of the element cooling metal member is placed in the flow path. And is directly cooled by a cooling medium.
As a result, the number of parts can be reduced and the size can be reduced, the motor and the inverter cooling path can be integrated, and an inverter-integrated motor with higher cooling efficiency can be provided.

According to the present invention, each phase inverter circuit is arranged in the circumferential direction with respect to the rotating shaft of the AC motor, and a current sensor or a smoothing capacitor is arranged in a hollow hole at a substantially central portion of the element cooling metal member to further reduce the size. Realized.
In addition, the switching element of each phase inverter circuit and the positive or negative terminal are connected to the shortest wiring to reduce the inductance, prevent destruction of the element due to surge voltage, and connect multiple switching elements in parallel. In this case, an inverter module having a structure capable of maintaining a uniform wiring length can be prevented, and the occurrence of a drift phenomenon due to different wiring resistance can be prevented.

In addition, by placing a smoothing capacitor close to each phase inverter circuit, it is possible to stabilize the DC voltage and to supply power from the power supply circuit to the control circuit group of each phase inverter circuit with the shortest and even wiring length. And contributed to the stabilization of the power supply voltage.
By arranging the converter and boosting the battery DC voltage, the inverter output current can be reduced, the wiring can be downsized, and the current sensor is also integrated with the wiring board, eliminating the need for a harness to be connected. Simplification of assembly was also realized.
In addition, the fin arrangement of the element cooling metal member enables direct cooling of the element cooling metal member, greatly reducing the thermal resistance, and providing a cooling medium flow path in the cooling block makes it possible to integrate an inverter with high cooling efficiency. It became possible to provide a motor.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 8 shows a conceptual diagram of an inverter-integrated motor 38 having an inverter module according to one embodiment of the present invention. In FIG. 8, the inverter module 2 is arranged on the end wall of the motor 3, and the inverter modules can be integrated with very good space efficiency by making the diameters of the motor 3 and the inverter module 2 substantially the same.

  FIG. 9 is a sectional view of the inverter-integrated motor 38 shown in FIG. The inverter module 2 is a semiconductor module 21 that converts a DC voltage into an AC voltage and supplies power to the motor, a smoothing capacitor 4 that is disposed on the input voltage side of the semiconductor module and stabilizes the DC voltage, and cools the semiconductor module. The cooling block 22 and an inverter case 39 that surrounds the inverter module are configured. The motor 3 integrated with the inverter module 2 includes a shaft 40, a rotor 41, a stator 42, a coil 43, bearings 44 a and 44 b, a motor housing 45, and a motor lead wire 46.

  The shaft 40, the rotor 41, the stator 42, and the bearings 44 a and 44 b are disposed in a region surrounded by the motor housing 45. The bearings 44 a and 44 b are attached to the motor housing 45. The shaft 40 is received by bearings 44a and 44b. The stator 42 is disposed outside the rotor 41 around which a coil 43 is wound, and is attached to the motor housing 45. The rotor 41 is fixed to the shaft 40 and rotates inside the stator 42 as the shaft 40 rotates.

  The inverter module 2 is disposed on the end surface of the motor 3. The cooling block 22 having a hollow cylindrical shape constitutes a cooling liquid path that circulates in the circumferential direction with respect to the motor rotation shaft, and cools the semiconductor module 21 mounted on the cooling block 22. The smoothing capacitor 4 has, for example, a plurality of film capacitor elements stored in a case and modularized to have a substantially cylindrical shape. Further, the smoothing capacitor 4 and the semiconductor module 21 are arranged along the side surface of the inverter case 39 so as to extend (+) bus line 13 and (−) bus line 14 (not shown). (Both not shown).

  To supply power from the inverter module 2 to the motor 3, the output conductor arranged at the center of the semiconductor module 21 is drawn out by the motor lead wire 46 via the current sensors 9a and 9b arranged in the cooling block hollow portion, and the stator The motor is driven by connecting to a coil 43 wound around 42. As shown in FIG. 9, by integrating the inverter module with a diameter substantially the same as that of the motor, there is no need to draw a high-voltage cable for power supply outside the inverter module or the motor. Since it can be made unnecessary, the cost can be reduced and the size can be reduced.

  Although the cooling block 22 is formed separately from the motor housing 45 in FIG. 9, the cooling block may be integrally formed with the motor housing 45 as shown in FIG. In the example of FIG. 10, a large-diameter cylindrical outer peripheral wall 47 and a small-diameter cylindrical inner peripheral wall 48 projecting from the end surface are integrally formed on one end surface of the motor housing 45 to form fins for the element cooling metal member 28. The surface side is fitted to one end surface of the motor housing 45 in which the outer peripheral wall 47 and the inner peripheral wall 48 are formed, thereby forming a liquid coolant-tight cooling liquid path. In this way, by integrally forming the cooling block that forms the cooling fluid path in the motor housing, the cost can be reduced and the motor housing can be cooled together with the inverter module. An AC motor can be provided.

FIG. 11 omits the smoothing capacitor 4 and the inverter case 39 from the inverter module 2 shown in FIG. 9 and mounts the substantially cylindrical semiconductor module 21 on the cooling block 22 having a substantially circular mounting surface. FIG. Inside the cooling block 22, heat radiating fins integrally formed with aluminum are arranged and sealed together with the cooling liquid pipes 24a, 24b for circulating the cooling liquid to ensure liquid tightness.
The semiconductor module 21 is mounted by applying thermally conductive grease on the mounting surface of the cooling block 22 to improve the adhesion between them and reduce the thermal resistance. On the upper surface side of the semiconductor module 21, a wiring board 33 for mounting a control circuit of the switching element is disposed, and wiring conductors 36a, 36a ′, 36b, 36b ′, 36c, 36c ′ disposed on the outer periphery of the semiconductor module 21. , 36d, 36d ′, 36e, 36e ′, 36f, 36f ′ (36f, 36f ′ are not shown) and are integrated. A transformer 49 and a capacitor 50 that constitute a power supply circuit are disposed at a substantially central portion of the wiring board 33, and control circuits 51a, 51b, 51c, 51d, 51e, and 51f for switching elements are mounted on the periphery thereof. Yes.

  FIG. 12 is a schematic top view of the semiconductor module 21 shown in FIG. As shown in FIG. 12, a power supply circuit composed of a transformer 49, a capacitor 50, and the like is arranged at the center of the wiring board 33, and control circuits 51a, 51b for the switching elements are arranged substantially concentrically around the power supply circuit. By arranging 51c, 51d, 51e, 51f (not shown) and supplying power, it is possible to supply power from the power supply circuit to the control circuit group of each phase inverter circuit with the shortest and uniform wiring length. Can be stably supplied.

  The wiring conductors 36a, 36a ′, 36b, 36b ′, 36c, 36c ′, 36d, 36d ′, 36e, 36e ′, 36f, 36f ′ are control circuits 51a, 51b, 51c, 51d, 51e, 51f (not shown). ) Is connected to each control circuit and is input to the IGBT that constitutes each arm of each phase inverter circuit, or the current amount and temperature signal of the IGBT are transferred from each wiring conductor to the control circuit. It is configured to transmit or drive or protect each phase inverter circuit.

  FIG. 13 is a perspective view showing a structure in which the wiring board 33 is removed from the semiconductor module 21 shown in FIG. The central axis of the semiconductor module having a low-profile cylindrical shape substantially coincides with the rotation axis included in the AC motor. In the semiconductor module 21, the insulating substrate 27 on which the switching element is mounted is arranged in the circumferential direction with a predetermined interval with respect to the semiconductor module central axis, and after soldering to the element cooling metal member 28, the switching element and the wiring board are arranged. A housing 29 is attached to surround.

  The positive conductor 25, the negative conductor 26, and the output conductors 5e, 6e, and 7e of each phase inverter circuit are arranged on the inner peripheral side of the insulating substrate 27 that is mounted in the circumferential direction with the switching elements mounted thereon, and is a control signal terminal 36a, 36a ', 36b, 36b', 36c, 36c ', 36d, 36d', 36e, 36e ', 36f, 36f' (36e ', 36f, 36f' are not shown) sandwiching the insulating substrate 27 It arrange | positions at the outer peripheral part side facing the output conductors 5e, 6e, and 7e. Further, the output conductors 5e, 6e, and 7e of each phase inverter circuit are bent into an L shape, taken out through the hollow holes of the current sensors 9a, 9b, and 9c, and taken out below the inverter module, and connected to a motor lead wire (not shown). is doing. The wiring terminals of the current sensor are connected by connectors and connected to the wiring board by a harness (not shown), or the wiring terminals are directly connected to the wiring board.

FIG. 14 is a plan view of the semiconductor module 21 with the wiring board 33 shown in FIG. 11 removed. Each arm of each phase inverter circuit is connected in parallel with two IGBTs which are switching elements and flywheel diodes connected in antiparallel. Since switching elements such as IGBTs and flywheel diodes increase in cost exponentially as the area size increases, when configuring a large current element of 300 A or more, there are many cases where a plurality of switching elements are configured in parallel.
FIG. 15 is a partial perspective view seen from the ZZ cross section of FIG. For example, the upper arm of the U-phase inverter circuit includes an insulating substrate 27a in which a flywheel diode 5c is mounted in reverse parallel connection with the switching element 5a, and an insulation board in which the flywheel diode 5c ′ is mounted in reverse parallel connection with the switching element 5a ′. The board 27a ′ is mounted in parallel in the circumferential direction.

  The wire 31a connects the positive electrode conductor 25 and the circuit pattern of the insulating substrate 27a. The wire 31a 'connects the positive electrode conductor 25 and the circuit pattern of the insulating substrate 27a'. The wire 31b connects the emitter terminal of the switching element 5a and the anode terminal of the flywheel diode 5c to the output conductor 5e. The wire 31b 'connects the emitter terminal of the switching element 5a' and the anode terminal of the flywheel diode 5c 'to the output conductor 5e. The wire 34a connects the wiring conductor 36a and the signal terminal 35a of the switching element 5a. The wire 34a 'connects the wiring conductor 36a' and the signal terminal 35a 'of the switching element 5a'.

The U-phase inverter circuit lower arm has an insulating substrate 27b mounted with anti-parallel connection of a flywheel diode 5d to the switching element 5b, and an insulating substrate connected in two parallel connections like the upper arm in parallel in the circumferential direction. Yes. FIG. 15 shows one element of two parallel elements of the lower arm.
The wire 31c connects the output terminal 5e and the circuit pattern of the insulating substrate 27b. The wire 31d connects the emitter terminal of the switching element 5b and the anode terminal of the flywheel diode 5d to the negative conductor 26. The wire 34b connects the wiring conductor 36b and the signal terminal 35b of the switching element 5b. Since the V-phase and W-phase inverter circuits have the same configuration, the description thereof is omitted here.

As shown in FIG. 14, the insulating substrate 27 on which the switching element is mounted is arranged in the circumferential direction at a predetermined interval with respect to the central axis of the semiconductor module, so that the circular mounting surface of the element cooling metal member 28 is effectively utilized. Can contribute to miniaturization of the module.
Further, the positive electrode conductor and the negative electrode conductor have a ring shape or an arc shape and are arranged close to each other on the inner peripheral side of the switching element, and the output conductor is also arranged on the inner peripheral side of the switching element, thereby It is possible to connect the conductor and the negative electrode conductor and the switching element or between the output conductor and the switching element with the shortest and uniform wiring length, thereby reducing the wiring inductance and suppressing the switching surge.
Furthermore, by arranging the positive electrode conductor and the negative electrode conductor between the switching element and the output conductor of each phase inverter circuit, the effect of shortening the wiring length of the switching element, the positive electrode conductor, and the negative electrode conductor is remarkably exhibited.

  In addition, when each arm is configured by connecting a plurality of switching elements in parallel, the switching element, the positive electrode conductor, the negative electrode conductor, and the output conductor are symmetrically arranged in the circumferential direction with respect to the semiconductor module central axis. The wiring resistance between the switching elements in the arm can be set uniformly, and the drift phenomenon due to the current applied to the switching element on one side hardly occurs.

  Further, the signal terminals of the switching elements are arranged on the outer peripheral side and connected to the wiring conductors 36a, 36a ′, 36b, 36b ′, 36c, 36c ′, 36d, 36d ′, 36e, 36e ′, 36f, 36f ′. Therefore, it is possible to increase the distance between the control signal line and the positive conductor, the negative conductor, and the output conductor, which are noise generation sources, and the influence of electromagnetic noise on the control circuit can be reduced.

  FIG. 16 is a plan view of the semiconductor module 21 shown in FIG. 14 with wires removed. As seen in FIG. 16, clockwise from the lower left, the U-phase upper arm 52a, the U-phase lower arm 52b, the V-phase upper arm 52c, the V-phase lower arm 52d, the W-phase upper arm 52e, and the W-phase lower arm 52f By alternately arranging the upper and lower arms of each phase in the circumferential direction, it is possible to place the upper arm side switching element and the lower arm side switching element of each phase inverter circuit close to each phase output terminal, and the inverter module Can contribute to downsizing. Some upper and lower arms may be exchanged, and for example, a U-phase upper arm, U-phase lower arm, V-phase lower arm, V-phase upper arm, W-phase upper arm, and W-phase lower arm may be arranged.

  Further, as shown in FIG. 17, clockwise from the lower left, the U-phase upper arm 52a, the V-phase upper arm 52c, the W-phase upper arm 52e, the U-phase lower arm 52b, the V-phase lower arm 52d, the W-phase lower arm 52f, and the like. As described above, when the upper arm group and the lower arm group are arranged in the circumferential direction, it is not necessary to consider the insulation distance between the U-phase, V-phase, and W-phase lower arm control circuits of the wiring board 33. Arrangement is possible, and the space of the wiring board can be saved. As shown in FIG. 18, the inverter output terminals 5e, 6e, and 7e each have an L-shaped cross section, and are stacked with an insulating layer (not shown) between the terminals. The cooling block 22 is disposed in close contact with the inner peripheral portion of the hollow portion.

  FIG. 19 is a partial perspective view seen from the ZZ cross section of FIG. The insulating substrate 27 on which the switching element is mounted is soldered and mounted on the element cooling metal member 28, and the insulating ceramic constituting the insulating substrate 27 provides insulation between the element cooling metal member 28 and the switching element. It is secured.

As shown in FIG. 20, both the positive electrode conductor 25 and the negative electrode conductor 26 have an L-shaped cross section and are laminated with an insulating layer between both terminals, and the element cooling metal member 28 and the cooling block 22 hollow portion Closely arranged on the inner periphery.
Thereby, the positive electrode conductor and the negative electrode conductor are miniaturized to reduce the wiring inductance. Note that an insulating material such as a resin may be used as the insulating layer.
Further, the positive electrode conductor 25 and the negative electrode conductor 26 are exposed on the upper surface only in an area necessary for the connection between the switching element and the insulating substrate 27, and the remaining conductor is bent into an L shape so that the upper surface of the semiconductor module can be bent. The occupied space of the positive electrode conductor 25 and the negative electrode conductor 26 when viewed can be minimized.

In the example shown in FIG. 19, the output conductor 5e of the inverter circuit is taken out below the inverter module through the hollow hole of the current sensor 9a and connected to the motor lead wire. As a structure for connecting the output conductor 5e to the motor, the inverter output terminal 5e and the connection terminal 54 can be screwed and fixed with bolts 53 through a current sensor hollow hole as shown in FIG. Further, as shown in FIG. 22, a structure in which the motor lead wire 46 is screwed and fixed to the inverter output terminal 5e through the current sensor hollow hole is also possible.
The connection between the output conductor and the motor lead wire may be made with the shortest wiring through the central portion of the motor end wall, or the wiring may be taken out to the motor peripheral wall side and connected there.

In the example shown in FIG. 23, the current sensor 9a is disposed near the side surface of the semiconductor module 21, the inverter output terminal 5e disposed in the center and the connection cable 55 are screwed and fixed with bolts 53, and the connection cable 55 Is extended to the side surface and taken out to the side surface through the current sensor hollow hole.
Compared to FIG. 22, the shortest wiring for connecting the output terminal to the motor lead wire directly under the inverter module is not possible. However, when the motor lead wire is arranged on the motor peripheral wall side, the connection between the inverter module and the motor is easy. Structure.

FIG. 24 shows a structural diagram in which the element cooling metal member 28 is arranged on the mounting surface 23 of the cooling block 22 through the thermally conductive grease in the inverter according to the present invention. (Members such as a housing and a switching element constituting the semiconductor module are omitted.)
As shown by the broken lines in FIG. 24, the heat dissipating fins 56 built in the cooling block 22 are arranged concentrically, and the cooling liquid is circulated to cool directly below the insulating substrate on which the switching elements are mounted.
In the example of FIG. 24, straight fins are used as the radiation fins 56, but offset fins, pin fins, wavy fins, or the like can also be used.

In the heat radiating structure example of FIG. 25, an element cooling metal member 28 and a heat radiating fin 56 are integrated, fitted into a cooling block 22 having a cooling medium flow path and an opening, and liquid-tight. Uses a cooling structure that ensures safety. In order to secure the liquid-tightness of the element cooling metal member 28 and the cooling block 22, an O-ring 57 is fitted between them to maintain a sealing property.
As shown in FIG. 25, two O-rings 57 may be disposed on the inner and outer peripheral sides of the cooling medium flow path, as shown in FIG. As shown, one O-ring 57 can be arranged in a concave shape to ensure the liquid-tightness of the inner and outer peripheral sides of the cooling medium flow path at the same time.

27, 28, and 30 show conceptual diagrams of an inverter module configured by combining the cooling block 22, the semiconductor module 21, and the smoothing capacitor 4. FIG.
FIG. 27 is an example in which the smoothing capacitor 4, the semiconductor module 21, and the cooling block 22 are combined and integrated in this order. Even if the positive electrode conductor and the negative electrode conductor are arranged on the outer periphery of the semiconductor module 21 and connected to the smoothing capacitor 4. Alternatively, a bus line for connection may be drawn just below the center of the smoothing capacitor 4 and connected to the semiconductor module 21.
FIG. 28 shows an example in which the semiconductor module 21 is arranged at the upper part of the cooling block 22 and the smoothing capacitor 4 is arranged at the lower part, and the positive and negative conductors are drawn downward from the semiconductor module 21 so that the cooling block 22 is hollow. It becomes possible to connect to the smoothing capacitor 4 with the shortest wiring through the mouth.
FIG. 29 is a sectional view of the inverter module 2 described in FIG. 28 integrated with the motor 3. The semiconductor module 21 is disposed on the upper surface side of the cooling block 22, and the smoothing capacitor 4 is disposed and integrated on the lower surface side of the cooling block 22. To supply power from the inverter module 2 to the motor 3, the output conductor arranged at the central portion of the semiconductor module 21 is drawn out by the motor lead wire 46 through the current sensors 9a and 9c arranged in the cooling block hollow portion, and the stator The motor is driven by connecting to a coil 43 wound around 42.
The smoothing capacitor 4 has, for example, a plurality of film capacitor elements stored in a case and modularized into a substantially ring shape. Further, the smoothing capacitor 4 and the semiconductor module 21 are provided with a positive conductor 25 and a negative conductor by means of a (+) bus line 13 and a (−) bus line 14 (not shown) arranged along the inner wall of the cooling block hollow port. 26 (both not shown).
FIG. 30 shows an example in which the smoothing capacitor 4 is disposed on the outer peripheral portion of the semiconductor module 21 and mounted on the element cooling metal member 22 to be integrated. In the examples of FIGS. 27 and 28, the smoothing capacitor has a low-profile cylindrical shape, but may have a rectangular parallelepiped shape or the like.

FIG. 31 is an example in which the semiconductor module 21 shown in FIGS. 13 and 14 is configured such that each arm of each phase inverter circuit is configured with one IGBT and a flywheel diode in parallel. Switching elements such as IGBTs and flywheel diodes increase in cost exponentially as the area size increases. Therefore, when configuring a current element of 300 A or more, there are many cases where a plurality of switching elements are configured in parallel. However, when configuring a current element at less than 300 A, it is usual to use one element in parallel. It is.
For example, the upper arm of the U-phase inverter circuit is an insulating substrate 27a mounted with the flywheel diode 5c connected in reverse parallel to the switching element 5a, and the lower arm of the U-phase inverter circuit reverses the flywheel diode 5d to the switching element 5b. This is an insulating substrate 27b mounted in parallel, and these upper and lower arms are alternately mounted in the circumferential direction.

  The wire 31a connects the positive conductor 25 and a circuit pattern (not shown) on the insulating substrate 27a. The wire 31b connects the emitter terminal of the switching element 5a and the anode terminal of the flywheel diode 5c to the output conductor 5e. The wire 34a connects the wiring conductor 36a and the signal terminal 35a of the switching element 5a. The wire 31c connects the output terminal 5e and the circuit pattern of the insulating substrate 27b. The wire 31d connects the emitter terminal of the switching element 5b and the anode terminal of the flywheel diode 5d to the negative conductor 26. The wire 34b connects the wiring conductor 36b and the signal terminal 35b of the switching element 5b. Since the V-phase and W-phase inverter circuits have the same configuration, the description thereof is omitted here.

Further, the current sensor 9a, 9b, 9c is arranged with a hollow hole in the substantially central part of the element cooling metal member 28 and the cooling block 22, and the inverter module is passed through the current sensor from the output conductors 5e, 6e, 7e of the inverter circuit. And is connected to the motor lead wire.
In the example of FIG. 31, compared with FIGS. 13 and 14, the switching elements constituting the three-phase inverter circuit are configured in parallel, and the number of switching elements to be used can be halved. It is possible to comprise with the area of.

32 is a perspective view in which the wiring board 33 and the smoothing capacitor 4 are mounted on the cooling block 22 and the fan-shaped semiconductor module 21 shown in FIG. A power supply circuit composed of a transformer 49, a capacitor 50, and the like is arranged at the center of the wiring board 33. As in FIG. 11, a control circuit for driving or protecting the switching element is arranged concentrically to supply power. is doing.
The smoothing capacitor 4 is mounted on the cooling block 22 and has a fan shape so as to be substantially circular when combined with the semiconductor module 21. The smoothing capacitor 4 has, for example, a plurality of film capacitor elements stored in a case and modularized to have a substantially semicircular shape.
In this way, the combination of the smoothing capacitor 4 and the semiconductor module 21 is made substantially the same shape as the mounting surface of the cooling block 22 and the height dimension is matched, so that a small inverter module is generated without generating dead space. Can be produced. Similarly to FIGS. 27, 28, and 30, the smoothing capacitor 4 can be disposed on the upper side, the lower side, or the peripheral portion of the semiconductor module 21.

FIG. 33 shows a conceptual diagram of an inverter module configured by combining the cooling block 22 having a substantially U-shaped mounting surface, the semiconductor module 21 having a fan shape, and the smoothing capacitor 4. The semiconductor module 21 is the same as that shown in FIG. The mounting surface of the cooling block 22 has substantially the same shape as the bottom surface of the semiconductor module 21, thereby effectively utilizing the space. As in FIG. 14, the cooling block 22 has a free space at the center and the current sensor is arranged. (In the example of FIG. 33, the current sensor is not shown.)
Then, a motor-shaped end wall having a substantially circular shape is formed by combining a fan-shaped smoothing capacitor 4 and fitting a fan-shaped unit in which the cooling block 22 and the semiconductor module 21 are combined to form a substantially cylindrical inverter module. The inverter module can be arranged in the motor and integrated with the motor in a space efficient manner.

  FIG. 34 is a perspective view of a semiconductor module according to the fourth embodiment. The current sensor 9 is an integrated unit of 9a, 9b, and 9c, which facilitates the incorporation of the current sensor into the inverter module and also facilitates the connection to the wiring board by consolidating the current sensor wiring conductors. ing. The housing of the current sensor 9 is integrally formed with a wiring conductor 36g for external connection, and wiring conductors 36a, 36a ′, 36b, 36b ′, 36c, 36c ′, 36d, 36d connected to the signal terminals of the switching elements. ', 36e, 36e', 36f, 36f '(36e', 36f, 36f 'are not shown) are inserted into the wiring board 33 (not shown) and soldered and joined. Therefore, a harness for connecting the current sensor and the wiring board is not necessary, and assembly can be simplified.

  For example, in the case of a three-phase inverter, each phase output current flows with a phase of 120 °. Therefore, the output current for two phases of the three phases is detected and the remaining one phase is calculated. It becomes possible to obtain the current sensor for one phase among the current sensors 9a, 9b, 9c. Therefore, although the current sensors described in FIGS. 13 and 14 monitor the output currents of all phases U, V, and W, the current sensors may be reduced by one and the two phases may be integrated.

  FIG. 35 is a perspective view of a semiconductor module integrated with a boost converter. The semiconductor module 21 is obtained by adding a boost converter circuit including insulating substrates 58a and 58b, switching elements 59a and 59b, flywheel diodes 59c and 59d, a reactor 60, and wires 61a, 61b, 61c, 61d, 61e, and 61f. Others are the same as those of the semiconductor module of the fourth embodiment.

  An insulating substrate 58a in which a flywheel diode 59c is mounted in reverse parallel connection with the switching element 59a and an insulating substrate 58b in which the flywheel diode 59d is mounted in reverse parallel connection with the switching element 59b are mounted on the element cooling metal member. It is mounted in the circumferential direction on the surface.

  The wire 61 a connects the (+) power supply terminal 25 ′ of the DC power supply and the reactor 60. The wire 61 b connects the reactor 60 and the reactor connection conductor 62. The wire 61c connects the positive electrode conductor 25 and the circuit pattern of the insulating substrate 58a. The wire 61d connects the emitter terminal of the switching element 59a and the anode terminal of the flywheel diode 59c to the reactor connection conductor 62. The wire 61e connects the reactor connection conductor 62 and the circuit pattern of the insulating substrate 58b. The wire 61f connects the emitter terminal of the switching element 59b and the anode terminal of the flywheel diode 59d to the negative conductor 26. The wire 63a connects the wiring conductor 36h and the signal terminal of the switching element 59a. The wire 63b connects the wiring conductor 36i and the signal terminal of the switching element 59b.

FIG. 36 shows an electric circuit diagram of the inverter module 2 in which the converter shown in FIG. 35 is integrated. 36 is the same as FIG. 1 except that switching elements 59a and 59b, flywheel diodes 59c and 59d, and a reactor 60 are added to FIG. Switching elements 59a and 59b, flywheel diodes 59c and 59d, and reactor 60 constitute a converter, and the other switching elements constitute an inverter.
In the switching elements 59a and 59b, flywheel diodes 59c and 59d are respectively connected in reverse parallel, and are bridge-connected between the power supply line and the GND line. One terminal of the reactor 60 is connected to an intermediate point between the switching element 59a and the switching element 59b. The other terminal of reactor 60 is connected to the (+) power terminal of DC power supply 1.

The converter boosts the DC voltage from the DC power source according to the period during which the switching elements 59a and 59b are turned on, and supplies the boosted DC voltage to the inverter. The converter steps down the voltage supplied from the inverter according to the period during which the switching element is turned on and supplies the voltage to the DC power supply.
Thus, the converter converts the DC voltage to an arbitrary level between the DC power supply and the inverter.
Therefore, the semiconductor module includes a converter that converts a DC voltage between the DC power supply and the inverter, and an inverter that drives the motor by converting the DC voltage boosted by the converter into an AC voltage.

  FIG. 37 is a perspective view of the semiconductor module according to the sixth embodiment, and shows a portion corresponding to the ZZ cross section of FIG. The semiconductor module is configured by replacing an insulating ceramic substrate with an insulating sheet. An insulating sheet 64 is disposed on the mounting surface of the element cooling metal member 28, and conductor plates 65a and 65b are further provided on the insulating sheet 64. It is arranged. The conductor plates 65a and 65b are formed by bonding a copper plate to the insulating sheet 64 and then removing the portions other than the necessary conductor pattern portion by etching. Further, the conductor plates 65a and 65b and the element cooling metal member ensure insulation performance by the insulating sheet disposed between them and the patterned creepage distance.

  Each arm is connected in parallel with two IGBTs that are switching elements and flywheel diodes in antiparallel. For example, the upper arm of the U-phase inverter circuit is mounted by connecting the flywheel diode 5c to the switching element 5a in reverse parallel connection and the heat diffusion plate 66a mounted in reverse parallel to the switching element 5a ′. The heat diffusion plate 66a 'is connected to the conductor plate 65a by soldering.

The wire 31a connects the positive electrode conductor 25 and the thermal diffusion plate 66a. The wire 31a ′ connects the positive electrode conductor 25 and the heat diffusion plate 66a ′. The wire 31b connects the emitter terminal of the switching element 5a and the anode terminal of the flywheel diode 5c to the output conductor 5e. The wire 31b ′ connects the emitter terminal of the switching element 5a ′ and the anode terminal of the flywheel diode 5c ′ to the output conductor 5e. The wire 34a connects the wiring conductor 36a and the signal terminal 35a of the switching element 5a. The wire 34a ′ connects the wiring conductor 36a ′ and the signal terminal 35a ′ of the switching element 5a ′.
Since the U-phase inverter circuit lower arm, V-phase, and W-phase inverter circuits have the same configuration, the description thereof is omitted here.

  In many cases, the heat diffusion plates 66a and 66a ′ use a copper plate having a large thermal conductivity and a large heat capacity, and the heat generated by the switching element can be rapidly diffused in the surface direction to dissipate the heat in the lower surface direction. It is possible to reduce the temperature rise of the element and to suppress the transient temperature rise due to the rapid heat generation of the switching element. Further, when it is desired to improve environmental resistance such as heat cycle performance, a copper-molybdenum composite material having a small thermal expansion coefficient may be used. The mounting area of the heat diffusion plate may be set in the range of switching element area <heat diffusion plate area <conductor plate area. When the heat generation amount of the switching element is not large, the switching element may be directly joined to the conductor plate without using the heat diffusion plate.

FIG. 38 is a perspective view of the semiconductor module according to the seventh embodiment, and shows a portion corresponding to the ZZ cross section of FIG. The output current is detected by a shunt resistor in place of the current sensor disposed in the inverter module hollow port, and the others are the same as in the sixth embodiment.
In FIG. 38, an insulating sheet 64 and conductor plates 65a and 65b are disposed on the mounting surface of the element cooling metal member 28, and the heat diffusion plates 66a and 66a ′ on which the switching elements are mounted are connected by soldering.
The output conductor is divided into a conductor portion 67a joined to the switching element and a wire and a semiconductor module hollow portion, bent into an L-shape, and divided into a conductor portion 67b connected to the motor lead wire, and the conductors 67a and 67b are divided. They are connected by a shunt resistor 68a.
The shunt resistor 68a can be connected by soldering, welding, or by forming round terminals in advance at both ends of the shunt resistor and connecting them with screws. The signal detected by the shunt resistor 68a is connected to the wiring board 33 by a harness (not shown) connected to the conductors 67a and 67b, and is input to the signal processing circuit on the wiring board.

The shunt resistor 68a detects the output current of the U-phase inverter circuit, converts it into a voltage signal, transmits the information to the controller side, and uses it for motor control. Similarly, for each phase output of the V-phase and W-phase inverter circuits, shunt resistors 68b and 68c (both not shown) are arranged to detect current. The shunt resistor has a low resistance value and detects the voltage drop across it, so it can not be used due to extreme heat generation in applications where the current value is large, but it can be detected at low cost in applications where the current value is small There is.
Although not shown, a method of detecting the current by replacing the shunt resistor with a wiring conductor and arranging a Hall element immediately above the wiring conductor is also applicable.

  FIG. 39 is a perspective view of the semiconductor module according to the eighth embodiment and shows a portion corresponding to the ZZ cross section of FIG. In FIG. 39, the connection of the switching element, the positive electrode conductor, the negative electrode conductor, and the output conductor is changed to a wire to form a connection conductor plate, and the others are the same as in the sixth embodiment. The connecting conductor plate is made of a metal plate having a high thermal conductivity, such as copper or a copper-molybdenum composite material, processed into a convex shape and used in a structure that can easily absorb stress.

The connection conductor plate 69a has a convex shape and connects the positive electrode conductor 25 and the conductor plate 65a. The connection conductor plate 69b connects the emitter terminal of the switching element 5a and the anode terminal of the flywheel diode 5c to the output conductor 5e. The connection conductor plate 69b ′ connects the emitter terminal of the switching element 5a ′ and the anode terminal of the flywheel diode 5c ′ to the output conductor 5e.
The wiring conductor and the signal terminal of the IGBT which is the switching element are connected by a wire as in the sixth embodiment. The wire 34a connects the wiring conductor 36a and the signal terminal 35a of the switching element 5a. The wire 34a ′ connects the wiring conductor 36a ′ and the signal terminal 35a ′ of the switching element 5a ′. Since the U-phase inverter circuit lower arm, the V-phase, and the W-phase inverter circuits have the same configuration, the description thereof is omitted here.
If the connection between the switching element and the positive conductor, negative conductor, and output conductor is changed to a wire to form a connection conductor plate, a heat dissipation effect can be expected from the upper surface of the switching element through the connection conductor. The effect can be expected to reduce temperature rise. In addition, since the bonding area between the connection conductor plate and the switching element is larger than that in the case of using a wire, the temperature rise of the bonding portion can be reduced and the reliability can be improved.

  FIG. 40 is a perspective view of a semiconductor module according to the ninth embodiment. A smoothing capacitor is arranged in the hollow port of the inverter module to reduce the size, and the rest is the same as in the first embodiment.

The low-profile cylindrical smoothing capacitor 4 is disposed in the hollow portion of the inverter module, and is connected to the positive conductor 25 and the negative conductor 26 disposed on the inner peripheral side to smooth the inverter module input voltage. . By pulling out the positive electrode conductor 25 and the negative electrode conductor 26 to the inner periphery and wiring them as short as possible to the connection terminals 4a and 4b of the smoothing capacitor 4, the wiring inductance can be reduced and the switching surge can be greatly reduced.
Further, by arranging the smoothing capacitor in the inverter module hollow portion, it is not necessary to mount the inverter module in the space above or below the inverter module, and the inverter module can be miniaturized.
There are two roles of the smoothing capacitor: bus line voltage stabilization and ripple current absorption. The stabilization of the bus line voltage is represented by a parameter of electrostatic capacity, and the ripple current absorption is represented by a parameter of ripple current capacity. Since the vector control method is used for motor control for electric vehicles, even if the bus line voltage fluctuates somewhat, the motor control is not broken. Therefore, there is no problem even if the capacitance of the smoothing capacitor is small.
On the other hand, since a pulsating flow component having a frequency corresponding to the number of pole pairs is generated in an AC motor, it is necessary to absorb this with a smoothing capacitor, and a relatively large ripple current capacity is required. There are two types of aluminum electrolytic capacitors and film capacitors as typical examples of those used as smoothing capacitors. Aluminum electrolytic capacitors have a large capacitance, but have a large internal loss (tan δ), so that the ripple current capacity is small.
Although the film capacitor has a small capacitance, the ripple current capacity is large because the internal loss (tan δ) is small. Also, the cost can be set slightly lower for aluminum electrolytic capacitors.
In the embodiment of FIG. 40, since a small-diameter motor having a diameter of about 25 cm (less than about 40 kW output) is described, only a small space can be secured in the hollow portion of the inverter module (in the embodiment, the diameter is about 7 cm). In such a case, the use of a film capacitor unit that is small in size and can secure a large ripple current capacity even if the cost is slightly higher is more advantageous for downsizing.
On the other hand, when a large-diameter motor with a diameter of 30 cm or more (approx. 50 kW or more) is used, the space for arranging the semiconductor switching elements can be secured in a substantially circumferential direction as the diameter increases. (It is possible to secure a diameter of 10 cm or more although not shown).
Therefore, when the inverter module of FIG. 40 is realized with a small-diameter motor, a film capacitor unit is used as a smoothing capacitor. When a large-diameter motor is used, a film capacitor unit or an aluminum electrolytic capacitor is used. Realize.

FIG. 41 is a sectional view of the inverter-integrated motor 38 according to the tenth embodiment. The structure of the motor 3 is the same as that of the first embodiment, and the description thereof is omitted here. The inverter module 2 is disposed on the end surface of the motor 3. The cooling block 22 having a hollow cylindrical shape constitutes a cooling liquid path that circulates in the circumferential direction with respect to the motor rotation shaft, and cools the semiconductor module 21 mounted on the cooling block 22. The smoothing capacitor 4 has, for example, a plurality of film capacitor elements stored in a case and modularized to have a substantially cylindrical shape. Further, the smoothing capacitor 4 and the semiconductor module 21 are arranged along the side surface of the inverter case 39 so as to extend (+) bus line 13 and (−) bus line 14 (not shown). (Both not shown).

  The power supply from the inverter module 2 to the motor 3 was taken out from the output conductor arranged on the outer periphery of the semiconductor module 21 through the current sensors 9a and 9c and wound around the stator 42 through the motor lead wire 46. A structure for driving the motor by connecting to the coil 43 is adopted.

  FIG. 42 is a schematic top view of the semiconductor module according to the tenth embodiment. The positive and negative conductors are arranged close to each other and arranged on the outer peripheral side of the switching element arranged in the circumferential direction, and the output conductor is arranged on the outer peripheral side of the switching element and connected to the middle point of each phase inverter circuit In addition, a plurality of signal terminals of the switching element are arranged on the inner peripheral side of the switching element and coupled to the control circuit of the wiring board, and the others are the same as in the first embodiment.

  As shown in FIG. 42, a power supply circuit composed of a transformer 49, a capacitor 50, etc. is arranged at the center of the wiring board 33, and a control circuit for driving or protecting the switching element is arranged on the outer peripheral side of the power supply circuit. By supplying power, it is possible to stably supply power with a uniform wiring length from the power supply circuit to the control circuit of each phase inverter circuit.

  The wiring conductors 36a, 36a ′, 36b, 36b ′, 36c, 36c ′, 36d, 36d ′, 36e, 36e ′, 36f, 36f ′ are control circuits 51a, 51b, 51c, 51d, 51e, 51f (not shown). ) Is placed on the inner circumference side and connected to each control circuit, and a control signal is input to the IGBT which is a switching element constituting each arm of each phase inverter circuit, or the current amount and temperature signal of the IGBT are connected to each wiring. The configuration is such that each phase inverter circuit is driven or protected by transmission from the conductor to the control circuit.

  43 is a perspective view showing a structure in which the wiring board 33 is removed from the semiconductor module 21 shown in FIG. The central axis of the semiconductor module having a low-profile cylindrical shape substantially coincides with the rotation axis included in the AC motor. In the semiconductor module 21, the insulating substrates 27a and 27b on which the switching elements are mounted are arranged in the circumferential direction at a predetermined interval with respect to the central axis of the semiconductor module, and after soldering to the element cooling metal member 28, the switching elements and A housing 29 surrounding the wiring board is attached.

The positive conductor 25, the negative conductor 26, and the output conductors 5e, 6e, and 7e of each phase inverter circuit are arranged on the outer peripheral side of the insulating substrates 27a and 27b that are arranged in the circumferential direction with the switching elements mounted thereon, and are wiring conductors 36a, 36a ′, 36b, 36b ′, 36c, 36c ′, 36d, 36d ′, 36e, 36e ′, 36f, and 36f ′ are arranged on the inner peripheral side facing the output conductor with the switching element interposed therebetween. .
The signal terminals of the semiconductor switching elements (for example, 35a, 35a ′, 35b, 35b ′ in the case of U-phase switching elements) are arranged on the inner peripheral side facing the output conductor, and the wiring conductors 36a, 36a ′, 36b, 36b ', 36c, 36c', 36d, 36d ', 36e, 36e', 36f, 36f 'are connected. The output conductors 5e, 6e, 7e of each phase inverter circuit are connected to a motor lead wire (not shown) through the hollow holes of the current sensors 9a, 9b, 9c arranged on the outer periphery of the inverter module.

As shown in FIG. 43, the wiring conductors 36a, 36a ′, 36b, 36b ′, 36c, 36c ′, 36d, 36d ′, 36e, 36e ′, 36f, 36f are arranged on the inner peripheral side of the switching elements arranged in the circumferential direction. By disposing ', connection with the control signal terminal is possible in the vicinity of the substantially outer peripheral portion of the power supply circuit located in the central portion of the wiring board.
Further, by arranging the output conductor on the outer peripheral side of the switching element, it is possible to connect to the motor through the current sensor hollow hole arranged on the outer peripheral part of the inverter module. Therefore, when it is necessary to use a motor in which motor lead wires are necessarily arranged on the motor peripheral wall side, the arrangement example of FIG. 43 is suitable.
Although not described in the embodiment of FIG. 43, as in the embodiment of FIG. 40, the low-profile cylindrical smoothing capacitor 4 is arranged in the hollow portion of the inverter module and connected to the positive conductor 25 and the negative conductor 26. The inverter module input voltage is smoothed.
Moreover, among the contents described in Examples 1 to 9, the stacked arrangement structure of the positive electrode terminal 25 and the negative electrode terminal 26 illustrated in FIG. 20, the cooling block structure illustrated in FIGS. 24 to 26, and the description of FIGS. 27, 28, and 30. Inverter structure, switching element 1 parallel specification shown in FIG. 31, boost converter integrated structure shown in FIGS. 35 and 36, insulating sheet structure shown in FIG. 37, current detection structure using shunt resistance shown in FIG. 38, and FIG. Although each structure, such as a direct joining method using the connection conductor plate, can be employed, the description is omitted here because the structure is similar.

  FIG. 44 is a schematic top view of a semiconductor module in Example 11. In FIG. 44, the positive electrode conductor and the negative electrode conductor are arranged close to each other and arranged on the inner peripheral side of the switching element arranged in the circumferential direction, and the output conductor is arranged on the outer peripheral side of the switching element. The signal terminals of the upper arm side switching element are arranged on the inner peripheral side facing the output conductor across the switching element, and the signal terminals of the lower arm side switching element are switched. The device is disposed on the outer peripheral side facing the negative electrode conductor with the element interposed therebetween, and the other components are the same as those in the first embodiment.

  As shown in FIG. 44, a power supply circuit is arranged at the center of the wiring board 33, and a control circuit for driving or protecting the switching element is arranged on the outer peripheral side of the power supply circuit to supply power. The wiring conductors 36a, 36a ′, 36c, 36c ′, 36e, 36e ′ of the upper arm switching element are arranged on the inner peripheral side of the control circuit, and the wiring conductors 36b, 36b ′, 36d, 36d ′, 36f, 36f of the lower arm switching element. 'Is placed on the outer peripheral side of the control circuit, and the control signal is input to the IGBT which is a switching element constituting each arm of each phase inverter circuit, or the current amount and temperature signal of the IGBT are transmitted from each wiring conductor to the control circuit. To drive or protect each phase inverter circuit.

FIG. 45 shows a sectional view of the inverter module 2 described in FIG. 44 integrated with the motor 3. The semiconductor module 21 is disposed on the upper surface side of the cooling block 22, and the smoothing capacitor 4 is disposed and integrated in the hollow portion of the cooling block 22. The structure of the motor 3 is the same as that of the first embodiment, and the description thereof is omitted here.
The inverter module 2 is disposed on the end surface of the motor 3. The cooling block 22 having a hollow cylindrical shape constitutes a cooling liquid path that circulates in the circumferential direction with respect to the motor rotation shaft, and cools the semiconductor module 21 mounted on the cooling block 22.
The smoothing capacitor 4 has, for example, a plurality of film capacitor elements stored in a case and modularized to have a substantially cylindrical shape. Further, the smoothing capacitor 4 and the semiconductor module 21 are provided with a positive conductor 25 and a negative conductor by means of a (+) bus line 13 and a (−) bus line 14 (not shown) arranged along the inner peripheral wall of the cooling block 22. 26 (both not shown).

Power supply from the inverter module 2 to the motor 3 is taken out from the output conductor arranged on the outer periphery of the semiconductor module 21 through the current sensors 9a, 9b, 9c, and wound around the stator 42 through the motor lead wire 46. The motor is driven by connecting to the formed coil 43.

  46 is a perspective view showing a structure in which the wiring board 33 is removed from the semiconductor module 21 shown in FIG. In the semiconductor module 21, the insulating substrate 27 on which the switching element is mounted is arranged in the circumferential direction with a predetermined interval with respect to the semiconductor module central axis, and after soldering to the element cooling metal member 28, the switching element and the wiring board are arranged. A housing 29 is attached to surround.

The positive electrode conductor 25 and the negative electrode conductor 26 are arranged close to each other on the inner peripheral side of the insulating substrate 27 arranged in the circumferential direction, and the output conductors 5e, 6e, and 7e are arranged on the outer peripheral side of the insulating substrate 27. The
The wiring conductors 36a, 36a ′, 36c, 36c ′, 36e, and 36e ′ of the upper arm switching element are arranged on the inner peripheral side facing the output conductor with the insulating substrate interposed therebetween. Signal terminals (for example, 35a and 35a ′ in the case of U-phase switching elements) of the upper arm side switching element are arranged on the inner peripheral side facing the output conductor with the switching element interposed therebetween, and the wiring conductors 36a, 36a ′, 36c, 36c ′, 36e, 36e ′.
The wiring conductors 36b, 36b ′, 36d, 36d ′, 36f, and 36f ′ of the lower arm switching element are arranged on the outer peripheral side facing the negative electrode conductor 26 with the insulating substrate interposed therebetween.
Signal terminals (for example, 35b and 35b ′ in the case of U-phase switching elements) of the lower arm side switching element are arranged on the outer peripheral side facing the negative electrode conductor with the switching element interposed therebetween, and wiring conductors 36b, 36b ′, and 36d. , 36d ', 36f, 36f'.

In FIG. 46, the low-profile cylindrical smoothing capacitor 4 is disposed in the hollow portion of the inverter module, and is connected to the positive conductor 25 and the negative conductor 26 disposed on the inner peripheral side, and the inverter module input voltage Is smooth. Current sensors 9a, 9b, and 9c are arranged on the outer periphery of the inverter module, and connection conductors are drawn out from the output conductors 5e, 6e, and 7e through current sensor hollow holes and connected to motor lead wires (not shown).
In this way, the positive electrode conductor and the negative electrode conductor can be arranged on the inner peripheral side of the switching element, and the output conductor can be arranged on the outer peripheral side of the switching element. A smoothing capacitor is provided in the hollow part and a current sensor is provided in the outer peripheral part. When arranged, further miniaturization can be achieved.

  FIG. 47 is a perspective view of the semiconductor module according to the twelfth embodiment. In FIG. 47, the positive electrode conductor and the negative electrode conductor are arranged close to each other and arranged on the outer peripheral side of the switching element arranged in the circumferential direction, and the output conductor is arranged on the inner peripheral part side of the switching element. The plurality of signal terminals of the upper arm side switching element are arranged on the outer peripheral side facing the output conductor with the switching element interposed therebetween, and the plurality of signal terminals of the lower arm side switching element are connected to the switching point. Is disposed on the inner peripheral side opposite to the negative electrode conductor, and the others are the same as in the first embodiment.

As shown in FIG. 47, the positive conductor 25 and the negative conductor 26 are arranged close to each other on the outer peripheral side of the insulating substrate 27 arranged in the circumferential direction, and the output conductors 5e, 6e, and 7e are connected to the insulating substrate 27. Arranged on the inner periphery side.
The wiring conductors 36a, 36a ′, 36c, 36c ′, 36e, and 36e ′ of the upper arm switching element are arranged on the outer peripheral side facing the output conductor with the insulating substrate interposed therebetween. Signal terminals (for example, 35a and 35a ′ in the case of U-phase switching elements) of the upper arm side switching element are arranged on the outer peripheral side facing the output conductor with the switching element interposed therebetween, and wiring conductors 36a, 36a ′, and 36c are arranged. , 36c ′, 36e, 36e ′.
The wiring conductors 36b, 36b ′, 36d, 36d ′, 36f, and 36f ′ of the lower arm switching element are disposed on the inner peripheral side facing the negative electrode conductor 26 with the insulating substrate interposed therebetween.
The signal terminals (for example, 35b and 35b ′ in the case of the U-phase switching element) of the lower arm side switching element are arranged on the inner peripheral side facing the negative electrode conductor with the switching element interposed therebetween, and the wiring conductors 36b, 36b ′, 36d, 36d ', 36f, and 36f' are connected.
In addition, since each switching element and each conductor, and the signal terminal and each wiring conductor of each switching element are the same as those of the previous embodiment, the description thereof is omitted.

In FIG. 47, current sensors 9a, 9b, and 9c are arranged in the hollow portion of the inverter module, and the connection conductors are drawn out from the output conductors 5e, 6e, and 7e through the respective current sensor hollow holes, and motor lead wires (FIG. (Not shown). As described above, the output conductor is disposed on the inner peripheral side of the switching element, and the size can be reduced by connecting to the motor via the current sensor disposed in the hollow portion of the inverter module.
Moreover, among the contents described in Examples 1 to 9, the stacked arrangement structure of the positive electrode terminal 25 and the negative electrode terminal 26 illustrated in FIG. 20, the cooling block structure illustrated in FIGS. 24 to 25, and the description of FIGS. 27, 28, and 30. Inverter structure, switching element 1 parallel specification shown in FIG. 31, boost converter integrated structure shown in FIGS. 35 and 36, insulating sheet structure shown in FIG. 37, current detection structure using shunt resistance shown in FIG. 38, and FIG. Although each structure, such as a direct joining method using the connection conductor plate, can be employed, the description is omitted here because the structure is similar.

  FIG. 48 is a plan view of the semiconductor module according to the thirteenth embodiment. In FIG. 48, the positive conductor and the negative conductor have a ring-shaped or arc-shaped conductor portion and a plurality of branch-like conductor portions extending substantially in the radial direction, and constitute an in-phase inverter circuit. An element and a lower arm side switching element are arranged between the branch conductors in the circumferential direction, and the output conductor is arranged in a substantially radial direction by being sandwiched between the upper arm side switching element and the lower arm side switching element constituting the in-phase inverter circuit. A plurality of signal terminals of the upper arm side switching element are disposed on the branch conductor portion side of the positive conductor facing the output conductor across the switching element, and are connected to the middle point. The plurality of signal terminals of the switching element are arranged on the output conductor side opposite to the branch conductor portion side of the negative electrode conductor with the switching element interposed therebetween, and the others are the same as in the first embodiment. That.

  As shown in FIG. 48, a power supply circuit is arranged at the center of the wiring board 33, and a control circuit for driving or protecting the switching element is arranged on the outer peripheral side of the power supply circuit to supply power. The wiring conductors 36 a, 36 b, 36 c, 36 d, 36 e, and 36 f are arranged extending in the radial direction so as to sandwich the control circuit of each arm, and are connected to the wiring board 33.

  FIG. 49 is a perspective view showing a structure in which the wiring board 33 is removed from the semiconductor module 21 of FIG. The insulating substrate 27 on which the switching elements are mounted is arranged in such a manner that the signal terminals of the switching elements are oriented in the circumferential direction with respect to the central axis of the semiconductor module 21, and after soldering to the element cooling metal member 28, the switching elements and wiring A housing 29 surrounding the substrate is attached.

  The positive electrode conductor 25 and the negative electrode conductor 26 have an arcuate conductor portion and a plurality of branch-like conductor portions extending in the radial direction, and are arranged close to each other. The arcuate conductor portions of the positive electrode conductor 25 and the negative electrode conductor 26 are arranged on the inner peripheral side of the switching element, and the branch conductor portions are formed of the upper arm side switching element and the lower arm side switching element constituting each phase inverter circuit. The groups are arranged so as to be sandwiched between branch conductors in the circumferential direction. The output conductors 5e, 6e, and 7e are disposed so as to extend in a substantially radial direction so as to be sandwiched between the upper arm side switching element and the lower arm side switching element that constitute each phase inverter circuit.

  The wiring conductor 36a is disposed in parallel on the branch conductor portions of the positive electrode conductor 25 and the negative electrode conductor 26 via a resin layer. The signal terminals 35a, 35c, and 35e of the upper arm side switching element are disposed on the positive conductor side facing the output conductor with the switching element interposed therebetween, and are connected to the wiring conductors 36a, 36c, and 36e. The wiring conductor 36b is disposed in parallel on the output conductor 5e via a resin layer. The signal terminals 35b, 35d, and 35f of the lower arm side switching element are disposed on the output conductor side facing the negative electrode conductor with the switching element interposed therebetween, and are connected to the wiring conductors 36b, 36d, and 36f.

  In FIG. 49, a low-profile cylindrical smoothing capacitor 4 is arranged in the hollow portion of the inverter module, and is connected to the positive conductor 25 and the negative conductor 26 arranged on the inner peripheral side, and the inverter module input voltage Is smooth. Current sensors 9a, 9b, and 9c are arranged on the outer periphery of the inverter module, and the connection conductors are drawn out from the output conductors 5e, 6e, and 7e through the respective current sensor hollow holes, and are connected to motor lead wires (not shown). . In this way, a smoothing capacitor is disposed in the hollow portion and a current sensor is disposed on the outer peripheral side to achieve miniaturization.

  FIG. 50 is a perspective view of the semiconductor module according to the fourteenth embodiment. 49, positive electrode conductor 25 and negative electrode conductor 26 have an arcuate conductor portion and a plurality of branch conductor portions extending in the radial direction, and are arranged close to each other. The arcuate conductor portions of the positive electrode conductor 25 and the negative electrode conductor 26 are disposed on the outer peripheral side of the switching element, and the branch conductor portions are groups of upper arm side switching elements and lower arm side switching elements that constitute each phase inverter circuit. Are arranged between the branch-like conductor portions in the circumferential direction. The output conductors 5e, 6e, and 7e are disposed so as to extend in a substantially radial direction so as to be sandwiched between the upper arm side switching element and the lower arm side switching element that constitute each phase inverter circuit. The rest is the same as in Example 13.

  The wiring conductor 36a is disposed in parallel on the branch conductor portions of the positive electrode conductor 25 and the negative electrode conductor 26 via a resin layer. The signal terminals 35a, 35c, and 35e of the upper arm side switching element are disposed on the positive conductor side facing the output conductor with the switching element interposed therebetween, and are connected to the wiring conductors 36a, 36c, and 36e. The wiring conductor 36b is disposed in parallel on the output conductor 5e via a resin layer. The signal terminals 35b, 35d, and 35f of the lower arm side switching element are disposed on the output conductor side facing the negative electrode conductor with the switching element interposed therebetween, and are connected to the wiring conductors 36b, 36d, and 36f.

  In FIG. 50, the current sensor 9 is disposed in the hollow portion of the inverter module, and the connection conductor is drawn out from the output conductors 5e, 6e, and 7e through each current sensor hollow hole, and is connected to a motor lead wire (not shown). Connected. Of the contents described in Examples 1 to 9, the cooling block structure shown in FIGS. 24 to 26, the inverter structure shown in FIGS. 27, 28, and 30, the boost converter integrated structure shown in FIGS. 35 and 36, Each structure such as the insulating sheet structure shown in FIG. 37, the current detection structure using the shunt resistor shown in FIG. 38, and the direct joining method using the connecting conductor plate shown in FIG. 39 can be adopted. Then, explanation is omitted.

FIG. 51 shows a conceptual diagram of an inverter-integrated motor including the inverter module according to the present invention.
The inverter module 2 is a semiconductor module 21 that converts DC voltage into AC voltage and supplies power to the motor, a smoothing capacitor unit 4 that is disposed on the input voltage side of the semiconductor module 21 and smoothes the DC voltage, and cools the semiconductor module. One or a plurality of cooling blocks 22 to be stacked are stacked and integrated with the motor 3.
Even if the AC power that can be supplied from a single semiconductor module is restricted, by arranging a plurality of AC power, AC power corresponding to the motor output capacity can be supplied from the inverter module.
Furthermore, it is not necessary to newly design an inverter module with a high output capacity, and a small inverter-integrated motor can be manufactured with variations in output capacity. The cooling block may be used to cool a single semiconductor module, or, as shown in the cooling block 22 of FIG. 51, a plurality of semiconductor modules are mounted on both sides of the cooling block and cooled from both sides. You may have ability.

  In the first to fifteenth embodiments, for example, a 50% aqueous solution of ethylene glycol is used as a cooling medium, and a liquid cooling method is used. However, an air cooling method may be adopted by circulating air taken from an intake port through a cooling pipe.

  In the first to fifteenth embodiments, the upper arm side switching element and the lower arm side switching element are IGBTs, MOSFETs, or the like having Si (silicon) or SiC (silicon carbide) as constituent elements. Normally, IGBTs are used with flywheel diodes connected in antiparallel, but MOSFETs incorporate antiparallel connected diodes, so flywheel diodes may be used alone without antiparallel connection.

  In Examples 1 to 15, the wiring board on which the control circuit is mounted is arranged on the upper side of the element cooling metal member on which the switching element is arranged, but the control circuit is arranged on the same surface of the element cooling metal member. It may be arranged and joined from the control circuit to the signal terminal of the switching element. The switching element and the control circuit can be mounted together on the element cooling metal member, and a module with higher mounting density can be provided.

  In Examples 1 to 15, as the smoothing capacitor, a film capacitor or an aluminum electrolytic capacitor formed by winding a sheet-like material can be used. The film capacitor and the aluminum electrolytic capacitor may have a cylindrical shape or a compressed flat shape. Further, the smoothing capacitor disposed in the hollow portion of the inverter module has a cylindrical integrated shape, but a plurality of divided capacitors may be disposed in the hollow portion and used.

  In the first to fifteenth embodiments, each phase output current is detected using a current sensor or a shunt resistor. However, when a motor is driven using a sensorless control method, the output current of each phase using a current sensor or a shunt resistor is detected. Control may be performed by omitting detection.

It is a circuit diagram which shows one Example of the traveling motor control apparatus of the hybrid electric vehicle carrying an inverter apparatus. It is the perspective view seen from the input power terminal side of the conventional inverter module. It is the perspective view seen from the output conductor side of the conventional inverter module. It is XX sectional drawing of the inverter module of FIG. It is the top view which looked at the inverter module of FIG. 4 from the Y direction, and is one in which the switching elements which comprise an arm are arranged in parallel. It is the figure which showed the internal circuit structure and each signal terminal of the switching element. FIG. 5 is a plan view of the inverter module of FIG. 4 as viewed from the Y direction, in which switching elements constituting an arm are arranged in parallel. It is a conceptual diagram of an inverter integrated motor. It is sectional drawing of the inverter integrated motor of FIG. FIG. 9 is another embodiment of FIG. 8 and is a diagram in which a cooling block is configured on one end surface of the motor housing. 1 is a perspective view of an inverter module according to an embodiment of the present invention. FIG. 12 is a schematic top view of the inverter module of FIG. 11. It is the perspective view which removed the wiring board of the inverter module of FIG. FIG. 14 is a plan view of FIG. 13. It is the fragmentary perspective view seen from the ZZ cross section of FIG. It is the top view which removed the wire from the top view of FIG. FIG. 17 is a view showing another embodiment of FIG. 16 and showing a configuration in which it is divided into an upper arm group and a lower arm group. It is a perspective view of an output terminal. It is a fragmentary perspective view of the YY cross section in the semiconductor module of FIG. It is a figure which shows the lamination | stacking arrangement | positioning structure of the positive electrode conductor and negative electrode conductor by the Example of FIG. FIG. 20 is another example of FIG. 19, wherein the output conductor and the connection terminal are screwed and fixed with bolts. FIG. 20 is another example of FIG. 19, wherein the output conductor and the motor lead wire are screwed and fixed with bolts. FIG. 20 is another example of FIG. 19, wherein a current sensor is arranged on the side surface of the inverter and a motor lead wire is taken out. It is an arrangement block diagram of a metal member for element cooling, and a cooling block by an example of the present invention. FIG. 25 is another embodiment of FIG. 24, and is an arrangement configuration diagram of fin-integrated element cooling metal members and cooling blocks. FIG. 26 is another example of FIG. 25, in which an O-ring that ensures liquid tightness is integrally formed in a concave shape. It is a conceptual diagram of the inverter module by the Example of this invention, and is the figure arrange | positioned in order of the cooling block, the semiconductor module, and the smoothing capacitor. It is a conceptual diagram of the inverter module by the Example of this invention, and is the figure which has arrange | positioned the semiconductor module in the upper surface side of the cooling block, and the smoothing capacitor in the lower surface side. It is sectional drawing which integrated the inverter module and motor of FIG. FIG. 3 is a conceptual diagram of an inverter module according to an embodiment of the present invention, in which a semiconductor module is disposed on the upper surface side of a cooling block, and a smoothing capacitor is disposed so as to surround the periphery of the semiconductor module. FIG. 3 is a top view of a semiconductor module according to an embodiment of the present invention, in which switching elements constituting each arm are arranged in parallel, and the semiconductor module is arranged in about half of the upper surface of the cooling block. FIG. 4 is a perspective view of an inverter module according to an embodiment of the present invention, in which a semiconductor module is arranged on about half of the upper surface of the cooling block and a smoothing capacitor is arranged on the other half. FIG. 3 is an assembly configuration diagram of an inverter module according to an embodiment of the present invention, in which a fan-shaped semiconductor module is disposed on the upper surface of a U-shaped cooling block, and a smoothing capacitor is disposed in a manner to fit the cooling block and the semiconductor module. FIG. 1 is a perspective view of an inverter module according to an embodiment of the present invention, and is a diagram in which current sensors of respective phases are integrally arranged in an inverter module hollow portion. It is a perspective view of the inverter module by the Example of this invention, and is a figure which shows the inverter module which integrated the converter. It is the circuit diagram which added the converter to the circuit diagram which shows one Example of the traveling motor control apparatus of FIG. It is a perspective view of the ZZ section in the semiconductor module of Drawing 14, and is a figure which has arranged each member in order of an insulating sheet, a conductor board, and a switching element on the upper surface of a metal member for element cooling. FIG. 38 is a perspective view showing another embodiment of FIG. 37 in which shunt resistors are arranged instead of the current sensors. FIG. 38 is another embodiment of FIG. 37, and is a perspective view using connection conductor plates instead of wires. FIG. 3 is a perspective view of an inverter module according to an embodiment of the present invention, in which a smoothing capacitor is arranged in a hollow portion of the inverter module and integrated. It is sectional drawing of an inverter integrated motor. FIG. 6 is a schematic top view of an inverter module according to another embodiment of the present invention, in which a power supply circuit is arranged at the center of the wiring board, and the control signal terminal and the switching element control circuit are arranged in the order of concentric circles around the power supply circuit. FIG. It is the perspective view which removed the wiring board of the inverter module of FIG. 42, and is the figure which also arrange | positioned the current sensor in the outer peripheral part of the inverter module. FIG. 6 is a schematic top view of an inverter module according to another embodiment of the present invention, in which a power supply circuit is arranged at the center of a wiring board, a control circuit for switching elements is arranged substantially concentrically around the power supply circuit, and It is the figure which has arrange | positioned the wiring terminal connected with an upper arm switching element in the inner peripheral part side, and has arrange | positioned the wiring terminal connected with a lower arm switching element in the outer peripheral part side of a control circuit. It is sectional drawing of the inverter integrated motor of FIG. It is the perspective view which removed the wiring board of the inverter module of FIG. 44, and is the figure which also arrange | positioned the current sensor in the outer peripheral part of the inverter module. 44 is another embodiment of FIG. 44, in which a wiring terminal connected to the lower arm switching element is arranged on the inner peripheral side of the switching element arranged in the circumferential direction, and connected to the upper arm switching element on the outer peripheral side of the switching element. It is the perspective view which has arrange | positioned the wiring terminal. It is a top view of the inverter module by other Examples of this invention, arrange | positions a power circuit in the wiring board center part, arrange | positions a control circuit in a substantially concentric form centering on this power circuit, and controls to a substantially radial direction. It is the figure which has arrange | positioned the signal terminal. It is the perspective view which removed the wiring board of the inverter module of FIG. FIG. 6 is a perspective view illustrating another embodiment of the present invention, in which a positive electrode conductor and a negative electrode conductor having an arcuate conductor portion are arranged on the outer peripheral side of a switching element arranged in the circumferential direction. FIG. 5 is a conceptual diagram of an inverter-integrated motor according to another embodiment of the present invention, and is a diagram in which a plurality of semiconductor modules and smoothing capacitor units are arranged above and below a cooling block in an inverter device.

Explanation of symbols

1 DC power supply (main battery)
2 Inverter module 3 Traveling motor 4 Smoothing capacitor 5 U phase inverter circuit 5a, 5b U phase switching element 5e, 6e, 7e Output terminal 6 V phase inverter circuit 6a, 6b V phase switching element 7 W phase inverter circuit 7a, 7b W phase Switching element 8 Control unit circuit 9, 9a, 9b, 9c Current sensor 10a, 10b External controller signal 11 Insulated cable 12 Insulated cable 13 (+) Bus line (connection conductor)
14 (-) Bus line (connection conductor)
15 U-phase bus line 16 V-phase bus line 17 W-phase bus line 18 Insulated cable 19 Insulated cable 20 Insulated cable 21 Semiconductor module 22 Cooling block 23 Cooling block mounting surface 24a, 24b Cold liquid pipe 25 Positive electrode conductor 26 Negative electrode conductor 27 Insulation Substrate 27a, 27b U-phase insulating substrate 28 Element cooling metal member 29 Housing 30a, 30b Circuit pattern 31a-31f Wire (thick line)
32 Shield plate 33 Wiring board 34a-34d Wire (thin wire)
35a to 35d Signal terminals 36a to 36f Wiring conductor 37 Temperature detection diode 38 Inverter integrated motor 39 Inverter case 40 Shaft 41 Rotor 42 Stator 43 Stator coils 44a and 44b Bearing 45 Motor housing 46 Motor lead wire 47 Outer peripheral wall 48 Inner peripheral wall 49 Transformer 50 Capacitors 51a to 51f Control circuit 52a to 52f Each phase arm 53 Bolt 54 Connection terminal 55 Connection cable 56 Radiation fin 57 O-ring 58 Insulating substrate 59 Boost converter circuit 60 Reactor 61a to 61f Wire (bold line)
62 Reactor connection conductor 63a to 63d Wire (thin wire)
64 Insulating sheet 65 Conductor plate 66 Heat diffusion plate 67a, 67b Output conductor 68a-68c Shunt resistance 69 Connection conductor

Claims (32)

Inverter module in which a single-phase inverter circuit formed by connecting an upper arm side switching element and a lower arm side switching element in series is connected in parallel to each other to form a multiphase inverter circuit and is arranged on the end face of the AC motor Because
A plurality of switching elements constituting a multi-phase inverter circuit that converts input DC power into AC power and supplies power to the stator coil of the AC motor, and a metal member for element cooling for dissipating heat by mounting the switching elements A control circuit for controlling the multiphase inverter circuit, a plurality of signal terminals provided in the switching element for connection to the control circuit, and a positive side of the upper arm side switching element of the multiphase inverter circuit ( +) A positive electrode conductor for connecting to the power supply terminal; a negative electrode conductor for connecting the negative electrode side of the lower arm side switching element of the multiphase inverter circuit to the (−) power supply terminal; and the upper arm side switching element and the lower side. An output conductor for each phase connected to the connection point with the arm side switching element,
The switching element is disposed in a circumferential direction at a predetermined interval with respect to a rotating shaft of the AC motor, and the positive electrode conductor and the negative electrode conductor have a ring shape or an arc shape and are adjacent to each other in the circumferential direction. Arranged on the inner peripheral side of the switching element, the output conductor is arranged on the inner peripheral side of the switching element arranged in the circumferential direction, and the signal terminal of the switching element is connected to the switching element. An inverter module, wherein the inverter module is disposed on an outer peripheral side opposite to the output conductor and is connected to the control circuit. The inverter module according to claim 1,
The element cooling metal member has a ring plate shape, a cooling block having a hollow cylindrical shape on which the element cooling metal member is mounted and forcibly cooled, and a current sensor disposed in a hollow portion of the cooling block; And an output bus line extending from the output conductor is connected to the AC motor via the current sensor. Inverter module in which a single-phase inverter circuit formed by connecting an upper arm side switching element and a lower arm side switching element in series is connected in parallel to each other to form a multiphase inverter circuit and is arranged on the end face of the AC motor Because
A plurality of switching elements constituting a multi-phase inverter circuit that converts input DC power into AC power and supplies power to the stator coil of the AC motor, and a metal member for element cooling for dissipating heat by mounting the switching elements A control circuit for controlling the multiphase inverter circuit, a plurality of signal terminals provided in the switching element for connection to the control circuit, and a positive side of the upper arm side switching element of the multiphase inverter circuit ( +) A positive electrode conductor for connecting to the power supply terminal; a negative electrode conductor for connecting the negative electrode side of the lower arm side switching element of the multiphase inverter circuit to the (−) power supply terminal; and the upper arm side switching element and the lower side. An output conductor for each phase connected to the connection point with the arm side switching element,
The switching element is disposed in a circumferential direction at a predetermined interval with respect to a rotating shaft of the AC motor, and the positive electrode conductor and the negative electrode conductor have a ring shape or an arc shape and are adjacent to each other in the circumferential direction. Arranged on the outer peripheral side of the switching element, the output conductor is arranged on the outer peripheral side of the switching element arranged in the circumferential direction, and the signal terminal of the switching element sandwiches the switching element An inverter module, wherein the inverter module is disposed on an inner peripheral side opposite to the output conductor and connected to the control circuit. The inverter module according to any one of claims 1 and 3,
An inverter module, wherein the positive electrode conductor and the negative electrode conductor are arranged between the switching element arranged in the circumferential direction and the output conductor. The inverter module according to any one of claims 1 and 3,
The inverter module characterized in that both the positive electrode conductor and the negative electrode conductor have an L-shaped cross section and have a stacked arrangement structure in which they are close to each other. Inverter module in which a single-phase inverter circuit formed by directly connecting an upper arm side switching element and a lower arm side switching element is connected in parallel to each other to form a multiphase inverter circuit and is arranged on the end face of the AC motor Because
A plurality of switching elements constituting a multi-phase inverter circuit that converts input DC power into AC power and supplies power to the stator coil of the AC motor, and a metal member for element cooling for dissipating heat by mounting the switching elements A control circuit for controlling the multi-phase inverter circuit, a plurality of signal terminals provided in the switching element to be joined to the control circuit, and a positive side of the upper arm side switching element of the multi-phase inverter circuit ( +) A positive electrode conductor for connecting to the power supply terminal; a negative electrode conductor for connecting the negative electrode side of the lower arm side switching element of the multiphase inverter circuit to the (−) power supply terminal; and the upper arm side switching element and the lower side. An output conductor for each phase connected to the connection point with the arm side switching element,
The switching element is disposed in a circumferential direction at a predetermined interval with respect to the rotating shaft of the AC motor, and the positive electrode conductor and the negative electrode conductor have a ring shape or an arc shape and are adjacent to each other in the circumferential direction. The output conductor is disposed on the outer peripheral side of the switching element disposed in the circumferential direction, and the signal terminal of the upper arm side switching element is The switching element is disposed on the inner peripheral side facing the output conductor across the switching element and connected to the control circuit, and the signal terminal of the lower arm side switching element is the outer circumference facing the negative conductor across the switching element An inverter module arranged on the side of the unit and connected to the control circuit. In the inverter module according to any one of claims 1, 3, and 6,
A cooling block having a hollow cylindrical shape in which the element cooling metal member has a ring plate shape and forcibly cooled by placing the element cooling metal member; and a smoothing capacitor disposed in a hollow portion of the cooling block; An inverter module comprising: the positive conductor and the negative conductor connected to the smoothing capacitor. In the inverter module according to any one of claims 3 and 6,
An inverter module, wherein a current sensor is disposed on an outer periphery of the inverter module, and an output bus line extending from the output conductor is connected to the AC motor via the current sensor. Inverter module in which a single-phase inverter circuit formed by directly connecting an upper arm side switching element and a lower arm side switching element is connected in parallel to each other to form a multiphase inverter circuit and is arranged on the end face of the AC motor Because
A plurality of switching elements constituting a multi-phase inverter circuit that converts input DC power into AC power and supplies power to the stator coil of the AC motor, and a metal member for element cooling for dissipating heat by mounting the switching elements A control circuit for controlling the multiphase inverter circuit, a plurality of signal terminals provided in the switching element for connection to the control circuit, and a positive side of the upper arm side switching element of the multiphase inverter circuit ( +) A positive electrode conductor for connecting to the power supply terminal; a negative electrode conductor for connecting the negative electrode side of the lower arm side switching element of the multiphase inverter circuit to the (−) power supply terminal; and the upper arm side switching element and the lower side. An output conductor for each phase connected to the connection point with the arm side switching element,
The switching element is disposed in a circumferential direction at a predetermined interval with respect to the rotating shaft of the AC motor, and the positive electrode conductor and the negative electrode conductor have a ring shape or an arc shape and are adjacent to each other in the circumferential direction. Arranged on the outer peripheral side of the switching element arranged on the side, the output conductor is arranged on the inner peripheral side of the switching element arranged in the circumferential direction, and the signal terminal of the upper arm side switching element is the The switching element is disposed on the outer peripheral side facing the output conductor and is connected to the control circuit, and the signal terminal of the lower arm side switching element is the inner circumference facing the negative conductor across the switching element. An inverter module arranged on the side of the unit and connected to the control circuit. The inverter module according to claim 9,
The element cooling metal member has a ring plate shape, a cooling block having a hollow cylindrical shape on which the element cooling metal member is mounted and forcibly cooled, and a current sensor disposed in a hollow portion of the cooling block; And an output bus line extending from the output conductor is connected to the AC motor via the current sensor. The inverter module according to any one of claims 6 and 9,
The inverter module characterized in that both the positive electrode conductor and the negative electrode conductor have an L-shaped cross section and have a stacked arrangement structure in which they are close to each other. An inverter arranged on the end face of an AC motor by connecting a plurality of single-phase inverter circuits formed by directly connecting the upper arm side switching element and the lower arm side switching element to each other in parallel to form a multiphase inverter circuit A module,
A plurality of switching elements constituting a multi-phase inverter circuit that converts input DC power into AC power and supplies power to the stator coil of the AC motor, and a metal member for element cooling for dissipating heat by mounting the switching elements A control circuit for controlling the multiphase inverter circuit, a plurality of signal terminals provided in the switching element for connection to the control circuit, and a positive side of the upper arm side switching element of the multiphase inverter circuit ( +) A positive electrode conductor for connecting to the power supply terminal; a negative electrode conductor for connecting the negative electrode side of the lower arm side switching element of the multiphase inverter circuit to the (−) power supply terminal; and the upper arm side switching element and the lower side. An output conductor for each phase connected to the connection point with the arm side switching element,
The switching element is arranged in a circumferential direction at a predetermined interval with respect to the rotating shaft of the AC motor, and the positive electrode conductor and the negative electrode conductor are close to each other, from a ring-shaped or arc-shaped conductor part, It has a plurality of branch conductors extending in the radial direction, and is arranged such that the upper arm side switching element and the lower arm side switching element constituting the in-phase inverter circuit are sandwiched between the branch conductor parts in the circumferential direction. The output conductor extends in the substantially radial direction so as to be sandwiched between the upper arm side switching element and the lower arm side switching element constituting the in-phase inverter circuit, and the signal terminal of the upper arm side switching element is: The lower arm side switching element is disposed on the branch conductor portion side of the positive conductor facing the output conductor across the switching element, and is connected to the control circuit. The signal terminal, an inverter module, characterized in that connected to the control circuit and arranged with branch conductor portion of the negative electrode conductor across the switching element on opposite said output conductor side. The inverter module according to claim 12,
An inverter module, wherein the ring-shaped or arc-shaped conductor portions of the positive electrode conductor and the negative electrode conductor are arranged on the outer peripheral side or the inner peripheral side of the switching element arranged in the circumferential direction. The inverter module according to claim 12,
A cooling block having a hollow cylindrical shape in which the element cooling metal member has a ring plate shape and forcibly cooled by placing the element cooling metal member; and a smoothing capacitor disposed in a hollow portion of the cooling block; An inverter module comprising: the positive conductor and the negative conductor connected to the smoothing capacitor. The inverter module according to claim 12,
An inverter module, wherein a current sensor is disposed on an outer periphery of the inverter module, and an output bus line extending from the output conductor is connected to the AC motor via the current sensor. The inverter module according to claim 12,
The element cooling metal member has a ring plate shape, a cooling block having a hollow cylindrical shape on which the element cooling metal member is mounted and forcibly cooled, and a current sensor disposed in a hollow portion of the cooling block; And an output bus line extending from the output conductor is connected to the AC motor via the current sensor. The inverter module according to any one of claims 1, 3, 6, 9, and 12,
The inverter module, wherein the switching element and the element cooling metal member are connected via an insulating ceramic. The inverter module according to any one of claims 1, 3, 6, 9, and 12,
An insulating sheet disposed on the mounting surface of the element cooling metal member, a conductor plate disposed by patterning the insulating sheet, and a heat diffusion plate disposed on the conductor plate, An inverter module, wherein a switching element is disposed on one main surface of the heat diffusion plate. The inverter module according to any one of claims 1, 3, 6, 9, and 12,
An inverter module, wherein the cooling block has a substantially U-shaped mounting surface. The inverter module according to any one of claims 1, 3, 6, 9, and 12,
The inverter module, wherein the element cooling metal member has fins on one main surface facing a mounting surface of the switching element. The inverter module according to claim 20,
An inverter module, wherein the fins are arranged substantially concentrically with respect to a rotating shaft included in the AC motor. The inverter module according to any one of claims 1, 3, 6, 9, and 12,
The cooling block includes a cooling medium flow path, and has an opening joined to a back surface opposite to one main surface of the element cooling metal member on which the switching element is mounted. An inverter module, wherein a metal member is fitted and integrated, a part of the surface of the element cooling metal member is exposed in the flow path, and directly cooled by a cooling medium. The inverter module according to any one of claims 1, 3, 6, 9, and 12,
An inverter module comprising a single or a plurality of parallel-connected switching elements constituting each arm of each phase inverter circuit arranged alternately in an upper arm and a lower arm in a circumferential direction. The inverter module according to any one of claims 1, 3, 6, 9, and 12,
An inverter module comprising a single or a plurality of parallel-connected switching elements constituting each arm of the single-phase inverter circuit divided into an upper arm group and a lower arm group and arranged in the circumferential direction. The inverter module according to any one of claims 1, 3, 6, 9, and 12,
A wiring board that is arranged substantially parallel to the mounting surface of the element cooling metal member and mounts the control circuit; and a power supply circuit for driving the control circuit is arranged at a central portion of the wiring board, An inverter module, characterized in that a control circuit is arranged in the circumferential direction at a predetermined interval with the power supply circuit as a central axis. The inverter module according to any one of claims 1, 3, 6, 9, and 12,
An inverter module comprising a converter for performing voltage conversion mounted on the switching element arrangement surface of the element cooling metal member. The inverter module according to any one of claims 2, 10, and 16,
An inverter module, wherein a wiring conductor of the current sensor formed integrally with the housing of the current sensor is directly inserted into the wiring board and soldered. The inverter module according to any one of claims 1, 3, 6, 9, and 12,
A semiconductor module comprising the switching element mounted on the element cooling metal member, the control circuit, and a housing that encloses and accommodates the switching element and the control circuit, and the semiconductor module is disposed on the cooling block. An inverter module, wherein the inverter module is mounted and integrated with a smoothing capacitor disposed above the semiconductor module. The inverter module according to any one of claims 1, 3, 6, 9, and 12,
An inverter-integrated motor, wherein the inverter module is integrated with a diameter substantially the same as a motor diameter. The inverter module according to any one of claims 1, 3, 6, 9, and 12,
An inverter module, wherein a plurality of the semiconductor modules, smoothing capacitors, and cooling blocks are stacked and integrated.   An inverter-integrated motor, wherein the inverter module according to claim 30 is integrated with a motor. The inverter-integrated AC motor according to claim 29,
A motor housing that surrounds the motor is provided with a cooling medium passage formed by having a large-diameter cylindrical outer peripheral wall and a small-diameter cylindrical inner peripheral wall projecting from one end surface thereof, and the switching element is mounted on the motor housing. The element cooling metal member has an opening joined to the back surface opposite to the main surface of the element cooling metal member, and the element cooling metal member is fitted into the opening to be integrated. An inverter-integrated AC motor, wherein a part of the inverter is exposed in the flow path and directly cooled by a cooling medium.

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